Manufacturing method and structure of miniaturized three-dimensional inductor with magnetic core

Abstract

The invention discloses a manufacturing method and structure of a miniaturized three-dimensional inductor with a magnetic core. The manufacturing method comprises the following steps of 1) manufacturing at least one microgroove structure on a magnetic substrate; 2) manufacturing a plurality of through holes in the hidden frame substrate, and filling metal materials in the through holes; 3) cuttingthe hidden frame substrate to form a plurality of hidden frames with metal materials, and embedding and fixing the hidden frames into the microgroove structures; and 4) respectively manufacturing a first plane interconnection structure and a second plane interconnection structure on the front surface and the back surface of the magnetic substrate, wherein the first plane interconnection structureand the second plane interconnection structure are respectively and electrically connected with the metal material of the hidden frame to form at least one inductance winding. The present invention achieves a high-capacity miniaturized inductor device.

Description

technical field [0001] The invention relates to the fields of magnetic material processing, microelectronic technology and magnetic components, in particular to a manufacturing method and structure of a three-dimensional inductor. Background technique [0002] With the improvement of the performance of electronic products, the level of miniaturization, light weight and integration of electronic products is getting higher and higher, the operating frequency of the system is continuously increasing, the operating voltage is getting lower and lower, and the quality requirements of the system for signal transmission are also increasing. High, traditional solutions have been unable to fully meet the technical requirements of new technologies for high-density system integration; at the same time, the miniaturization and integration of passive components have also become an important bottleneck restricting the development of electronic systems. In order to solve this problem, resea...

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Problems solved by technology

However, the ferrite layer formed by screen printing should be sintered at a temperature of 900-1000°C, which is incompatible with the standard integrated circuit manufacturing process; the thickness of the magnetic core produced by the sputtering process is limited and the cost is high , which limits the industrial development of this technology; the inductance Q value of the magnetic material core using electroplating film formation is generally lower than the Q value of film formation materials using sputtering technology or screen printing technology, the main reason is the magnetic material. Due to the conductivity, when the operating frequency of the inductor increases, the eddy current loss of the core will increase

In addition to the compatibility of magnetic materials and microelectronics processes, semiconductor processes are generally planar processes, which can only realize chip inductors, which greatly limits the performance of inductors

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