Wet process ceramic slurry of multi-layer chip ceramic dielectric capacitor and preparation method thereof

Abstract

The invention belongs to the technical field of multi-layer chip type ceramic dielectric capacitors, and particularly relates to wet process ceramic slurry of a multi-layer chip type ceramic dielectric capacitor and a preparation method thereof. The ceramic slurry preparation process has the advantages of high automation degree, high production efficiency, uniform particle size distribution, few bubbles, enhanced dispersion uniformity and stability of the ceramic slurry, long ceramic slurry preservation time, low organic solvent component content, low proportion, few pores during glue discharge, relatively small shrinkage rate of a ceramic slurry dielectric film and an inner electrode during sintering, the shrinkage matching performance of sintering and rubber discharging is improved, andthe risk of layering and cracking is reduced.

Description

technical field [0001] The invention belongs to the technical field of multilayer chip ceramic capacitors, and in particular relates to a porcelain paste of wet process multilayer chip ceramic capacitors and a preparation method thereof. Background technique [0002] With the rapid development of some special fields in China, such as electromagnetic pulse weapons, electromagnetic rail guns, oil exploration and other fields. Multilayer chip ceramic capacitors are referred to as chip capacitors for short. The conventional manufacturing process is to stack the ceramic dielectric diaphragms with printed electrodes (internal electrodes) in a dislocation manner, and form a ceramic chip after one-time high-temperature sintering, and then on the chip. Both ends of the metal layer (external electrode) are sealed to form a structure similar to a monolith. This process is referred to as a dry process. The cost of process equipment for this process is relatively high (especially for hig...

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Problems solved by technology

Multilayer chip ceramic capacitors are referred to as chip capacitors for short. The conventional manufacturing process is to stack the ceramic dielectric diaphragms with printed electrodes (internal electrodes) in a dislocation manner, and form a ceramic chip after one-time high-temperature sintering, and then on the chip. Both ends of the metal layer (external electrode) are sealed to form a structure similar to a monolith. This process is referred to as a dry process. The cost of process equipment for this process is relatively high (especially for highly integrated automatic intelligent equipment) , The dry process contains harmful solvents (toluene), there are many key quality control points before the green body is formed (not easy to control), and delamination is easy to occur during the green body debinding and sintering (especially for large-scale and high-thickness products). If the dry process is used Using porcelain slurry to make high-voltage and high-capacity multilayer ceramic chip capacitors, large pulse power ceramic capacitors and other special multilayer ceramic chip capacitors has problems such as high cost, relatively narrow product series, and easy delamination of products after debinding and sintering. , such as the patent document CN102653469B discloses a kind of chip multilayer ceramic capacitor dielectric slurry and dielectric preparation method

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