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Metallized porous conductive polymer composite material, preparation method and application thereof

A polymer material, porous conductive technology, applied in conductive materials dispersed in non-conductive inorganic materials, electrical components, magnetic field/electric field shielding, etc., can solve problems such as high weight and limit the application range of composite materials, and achieve large contact area, increase the multiple reflection loss, and improve the effect of uniformity

Inactive Publication Date: 2021-02-02
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the increase of fillers will inevitably increase the density of composite materials, and high-density materials limit the application range of composite materials due to their high weight.

Method used

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  • Metallized porous conductive polymer composite material, preparation method and application thereof
  • Metallized porous conductive polymer composite material, preparation method and application thereof
  • Metallized porous conductive polymer composite material, preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Embodiment 1 carbon nanotube / styrene-butadiene-styrene triblock copolymer metallization method

[0047] (1) Conductive filler solution: add 20 grams of SBS to 100 milliliters of 1,4-dioxane solution, add 1 gram of CNTs powder after the SBS is completely dissolved, and mix well to obtain a CNT / SBS mixed solution;

[0048] (2) Porous polymer material: put the CNTs / SBS mixed solution in an environment of 0°C, and after it is completely solidified, put it into a freeze-drying box for freeze-drying to obtain a porous CNTs / SBS foam material;

[0049] (3) Metallization of porous conductive polymers: soak the CNTs / SBS foam in a 10wt.% silver trifluoroacetate ethanol solution, place it in a vacuum box for 30 minutes of adsorption, then take out the CNTs / SBS foam and dry it at room temperature for 1 h. Subsequently, the CNTs / SBS foam was placed in an ethanol solution of hydrazine hydrate and reacted in a vacuum box for 5 minutes, and the CNTs / SBS foam was taken out and dried at r...

Embodiment 2

[0052] Embodiment 2 carbon fiber / hydrogenated styrene-butadiene block copolymer metallization method

[0053] (1) Conductive filler solution: Add 15 grams of SEBS to 100 milliliters of 3-pentanone solution, add 5 grams of CF powder after SEBS is completely dissolved, and mix well to obtain a CF / SEBS mixed solution;

[0054] (2) Porous polymer material: place the CF / SEBS mixed solution in an environment of -50°C, and after it is completely solidified, put it into a freeze-drying box for freeze-drying to obtain a porous CF / SEBS foam material;

[0055] (3) Metallization of porous conductive polymers: immerse the CF / SEBS foam in an ethanol solution of 20wt.% copper trifluoroacetate, place it in a vacuum box for adsorption for 30 minutes, then take out the CF / SEBS foam and dry it at room temperature for 1 h. Subsequently, the CF / SEBS foam was placed in an ethanol solution of phenylhydrazine, and placed in a vacuum box to react for 5 minutes. The CF / SEBS foam was taken out and dried...

Embodiment 3

[0057] Embodiment 3 silver nanowire / styrene-isoprene-styrene block copolymer metallization method

[0058] (1) Conductive filler solution: add 10 grams of SIS to 100 milliliters of chloroform solution, add 2 grams of AgNW powder after the SIS is completely dissolved, and mix well to obtain an AgNW / SIS mixed solution;

[0059] (2) Porous polymer material: place the AgNW / SIS mixed solution in an environment of -196°C, and after it is completely solidified, put it into a freeze-drying oven for freeze-drying to obtain a porous AgNW / SIS foam material;

[0060] (3) Metallization of porous conductive polymers: The AgNW / SIS foam was immersed in a 15wt.% silver trifluoroacetate ethanol solution, placed in a vacuum box for 30 minutes of adsorption, and the AgNW / SIS foam was taken out and dried at room temperature for 1 h. Then the AgNW / SIS foam was placed in the ethanol solution of phenylhydrazine, and placed in a vacuum box for 5 minutes to react, the AgNW / SIS foam was taken out and dr...

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Abstract

The invention relates to a metallized porous conductive polymer composite material, a preparation method and application thereof, and particularly discloses a preparation method of the metallized porous conductive polymer composite material. The method comprises the following steps of: (1) preparing a conductive filler solution, (2) preparing a porous conductive polymer material, and (3) metallizing the porous conductive polymer material. The invention also discloses the metallized porous conductive polymer composite material prepared by the method. The density of the obtained metallized porous conductive polymer composite material is 0.2-0.8g / cm<3>, the conductivity is 200-5000S / m, and the electromagnetic shielding effectiveness in the X waveband is 60-120dB. According to the invention, the preparation process is simplified, the bonding strength between the metal particles and the polymer is improved, the mechanical strength of the porous polymer composite material is improved, the addition amounts of the polymer and the conductive filler are reduced, and the porous polymer composite material has important application value in the fields of conductive polymer-based composite materials, electromagnetic shielding materials and the like.

Description

technical field [0001] The invention relates to the field of electronic materials, in particular to a metallized porous conductive polymer and its preparation method and application. Background technique [0002] In recent years, with the rapid development of information technology, electronic equipment has produced a large number of electromagnetic waves, and the resulting electromagnetic pollution problem has become increasingly serious, which will not only affect the normal work of electronic equipment, but also affect people's health . In order to solve the above problems, light and high-performance electromagnetic shielding materials have been paid more and more attention by more and more people, and have been developed rapidly. This material can reflect and absorb electromagnetic waves in space, thereby attenuating electromagnetic energy. It is a research topic in this field. hotspot. [0003] Traditionally, metal materials are often used in the field of electromagne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L53/02C08K3/04C08K3/08C08K7/06C08J9/28C08J9/40H01B1/22H01B1/24H05K9/00
CPCC08J9/28C08J9/40C08J9/0071C08J9/008C08J9/0085C08J9/0076C08J9/0066C08J9/0095H01B1/22H01B1/24H05K9/0081C08J2353/02C08J2201/0482C08K3/041C08K2201/011C08K2003/0806C08K7/06C08K2003/085C08K3/042
Inventor 胡友根田锭坤王勇林志强张玲赵涛邓飞孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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