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Patterned aluminum oxide dielectric layer and gate based on silk-screen printing and preparation method and application of patterned aluminum oxide dielectric layer

A technology of screen printing and alumina, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve the problems of limiting the advantages of anodized alumina methods, increasing preparation costs, and complicated protection processes, so as to increase preparation costs, Facilitate large-scale production and simple operation

Active Publication Date: 2021-02-26
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing anodic alumina growth technology makes alumina completely cover the surface of aluminum. In order to realize the construction of complex circuits, it is necessary to perform secondary pattern etching on alumina
Because the chemical properties of alumina and aluminum are similar, etching alumina alone requires a complex protection process, which greatly increases the preparation cost and limits the advantages of the anodic alumina method.
[0003] In addition, semiconductor manufacturing is divided into wafer manufacturing and integrated circuit manufacturing. Patterning technology is an essential part of integrated circuit manufacturing. Commonly used patterning technologies include optical Engraving and development and etching processes, using photolithography and development to manufacture mask patterns, the operation is complicated, and a series of operations such as pre-treatment, glue leveling, pre-baking, alignment exposure, development, and post-baking are required, resulting in high energy consumption, A series of problems such as high pollution and high cost

Method used

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  • Patterned aluminum oxide dielectric layer and gate based on silk-screen printing and preparation method and application of patterned aluminum oxide dielectric layer
  • Patterned aluminum oxide dielectric layer and gate based on silk-screen printing and preparation method and application of patterned aluminum oxide dielectric layer
  • Patterned aluminum oxide dielectric layer and gate based on silk-screen printing and preparation method and application of patterned aluminum oxide dielectric layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079] Such as figure 1 As shown, a method for preparing an aluminum oxide dielectric layer with confinement growth of a common gate contact site comprises the following steps:

[0080] 1) Vacuum deposition gate:

[0081] A substrate is prepared, and the substrate is polyethylene naphthalate (PEN). After cleaning the substrate, dry the substrate with nitrogen gas, and evaporate an aluminum film with a thickness of 100 nm on the substrate as the grid;

[0082] 2) Use screen printing method to print a layer of photoresist material on the aluminum film as a mask, and make sure that the pattern is printed clearly, such as image 3 (3(a), 3(b) and 3(c)), curing at 60°C for 2 minutes (in order to reduce the erosion of the electrolyte in the electrolytic cell to the pattern in the mask area, the mask needs to be cured); where , the photoresist material is photoresist. The silk screen adopted in the screen printing method is 500 meshes, the moving speed of the squeegee during scr...

Embodiment 2

[0088] A method for preparing a confinement-grown aluminum oxide dielectric layer with a common gate contact site, comprising the following steps:

[0089] 1) Vacuum deposition gate:

[0090] A substrate is prepared, which is a glass slide. After cleaning the substrate, dry the substrate with nitrogen gas, and evaporate an aluminum film with a thickness of 100 nm on the substrate as the grid;

[0091] 2) Use screen printing method to print a layer of photoresist material on the aluminum film as a mask, make sure that the pattern is printed clearly, and cure at 60°C for 2 minutes (in order to reduce the erosion of the electrolyte in the electrolytic cell to the pattern in the mask area, it is necessary to curing the mask); wherein, the photoresist material is photoresist. The silk screen adopted in the screen printing method is 500 meshes, the moving speed of the squeegee during screen printing is 20mm / s, the pattern of mask is the rectangular photoresist material layer arran...

Embodiment 3

[0098] Such as Figure 9 Shown, a kind of preparation method based on screen printing patterned aluminum oxide dielectric layer and grid comprises the following steps:

[0099] a) Immerse the alumina dielectric layer of the confinement-grown alumina dielectric layer obtained in Example 2 into isopropanol, ultrasonicate for 5 minutes, blow dry with nitrogen, and print on the alumina dielectric layer by screen printing A layer of photoresist is screen-printed as a resist layer (determining that the pattern is printed clearly), cured at 80° C. for 2 minutes, wherein the photoresist is a positive photoresist, and the screen used in the screen printing method is 500 mesh. The moving speed of the scraper during screen printing is 20 mm / s, the pattern of the resist layer is a photoresist layer arranged along a rectangular matrix, and the size of the photoresist layer is a square of 700 μm×700 μm;

[0100] b) Put the substrate obtained in step a) into an etching solution until the al...

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Abstract

The invention discloses a silk-screen printing-based patterned alumina dielectric layer, a grid electrode, and a preparation method and an application of the patterned alumina dielectric layer and thegrid electrode, and the preparation method comprises the steps: immersing the alumina dielectric layer grown in a limited range into isopropanol, carrying out the ultrasonic treatment for 5-10 minutes, performing drying, carrying out the silk-screen printing of a layer of photoresist on the alumina dielectric layer through a silk-screen printing method to serve as an anti-corrosion layer, carrying out curing for 11 minutes, putting the obtained substrate into an etching solution until the aluminum oxide dielectric layer which is not covered by the anti-corrosion layer is etched, and cleaningthe anti-corrosion layer to obtain the patterned aluminum oxide dielectric layer and the grid electrode. The preparation method is simple in operation, the patterned alumina dielectric layer and the grid electrode can be obtained only through two steps, the anti-corrosion layer is printed through a silk-screen printing method, various patterns can be simply and rapidly obtained, better conditionsare provided for subsequent circuit design, the method can be used for preparing complex circuits, and the cost is low; and the operation is not complex and time-consuming like the traditional photoetching and etching patterning technology.

Description

technical field [0001] The invention belongs to the technical field of semiconductor thin film transistor preparation, and in particular relates to a patterned aluminum oxide dielectric layer and grid based on screen printing and a preparation method and application thereof. Background technique [0002] In recent years, thin film transistors (TFT) have become the core components of display drive backplanes in the flat panel display industry. With the development of large-scale integrated circuit technology, the device size, including the thickness of the dielectric layer, is getting smaller and smaller, and its reduction trend follows Moore's Law. However, in TFT devices, the dielectric layer is mostly based on silicon oxide material. As the thickness of silicon oxide decreases, the leakage current of the dielectric layer will gradually increase, causing high energy consumption and heat dissipation problems of the device. In order to solve related problems, a dielectric la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/28H01L21/02H01L29/423
CPCH01L21/28008H01L21/28079H01L21/28158H01L21/02178H01L29/42364H01L29/42372
Inventor 张静胡文平段树铭任晓辰耿博文高雄汪涛
Owner TIANJIN UNIV