Packaging shaping method of bagging fosb by ultrasonic sealing

A technology of ultrasonic wave and sealing device, which is applied in the field of bagging FOSB packaging shaping, can solve the problems of low automation and low efficiency, and achieve the effect of high automation, high efficiency and close cooperation

Active Publication Date: 2022-06-28
无锡迪渊特科技有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problems of low efficiency and low degree of automation caused by manual shaping of the existing FOSB bagged packaging bags, and proposes a packaging shaping method for bagging FOSB using ultrasonic sealing, which can be automatically realized Vacuuming and automatic shaping of FOSB bags after bagging improves shaping efficiency

Method used

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  • Packaging shaping method of bagging fosb by ultrasonic sealing
  • Packaging shaping method of bagging fosb by ultrasonic sealing
  • Packaging shaping method of bagging fosb by ultrasonic sealing

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Embodiment Construction

[0052] The present invention will be further described below in conjunction with the accompanying drawings:

[0053] like Figures 1~10 As shown in the figure, a packaging and shaping method of bagging FOSB using ultrasonic sealing is used for shaping the packaging bag outside the FOSB with the packaging bag. The two sides of the FOSB are divided into a protruding side front side and a side back side, the two side back sides are connected with the back side, and the two side front sides are connected with the front side. The packaging shaping method specifically includes the following steps:

[0054] Step 1: The FOSB conveyor belt 1 sends the FOSB12 with the bag mouth in the open state after bagging to the shaping station;

[0055] Step 2: The whole composed of the horizontal driving device 5 of the sealing station and the clamping device 2 and the ultrasonic sealing device 3 moves to the front of the FOSB until the vacuum splint 17 of the clamping device 2 is located under ...

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Abstract

The invention discloses a packaging and shaping method of bagged FOSB using ultrasonic sealing, which specifically includes the following steps: moving the FOSB to a shaping station, clamping the mouth of the packaging bag and inserting a vacuum suction pipe, and the vacuum suction pipe is placed on the packaging bag While vacuuming the inside, the back and side of the FOSB are shaped; after the vacuuming is completed, the vacuum suction pipe is drawn out, and the ultrasonic sealing device seals the bag mouth that is clamped; after the sealing operation is completed, the vacuuming device and ultrasonic sealing The device moves to the initial position, and the FOSB front-end shaping device starts to shape the front packaging bag of the FOSB. After the shaping is completed, the FOSB is removed, and finally the FOSB front-end shaping device is reset. The invention can automatically realize the vacuuming and automatic shaping of the bagged FOSB packaging bag, improves the shaping efficiency, and the whole process is fully automated to reduce the labor cost.

Description

technical field [0001] The invention relates to the field of FOSB packaging, in particular to a packaging and shaping method for bagging FOSB using ultrasonic sealing. Background technique [0002] Wafer refers to a silicon chip made of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. A wafer is a carrier used in the production of integrated circuits. In general, a wafer basically refers to It is a single crystal silicon wafer. The single crystal silicon wafer is drawn and extracted from ordinary silica sand. After a series of measures such as dissolution, purification and distillation, the single crystal silicon rod is supported. The single crystal silicon rod becomes a wafer after polishing and slicing. With the continuous development of integrated circuit manufacturing technology, the chip feature size is getting smaller and smaller, the number of interconnect layers is increasing, and the wafer diameter is also increasing. T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65B31/06B65B51/22B65B61/00
CPCB65B31/06B65B51/225B65B61/00
Inventor 王迪杏计时鸣
Owner 无锡迪渊特科技有限公司
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