Pyramid rapid texturing liquid and its texturing method and silicon wafer product

Abstract

The invention discloses a pyramid rapid texturing liquid, a texturing method and a silicon wafer product. The main components of the pyramid rapid texturing liquid include a silver ion source, a copper ion source, a fluoride ion source, an oxidant and deionized water. Using the above-mentioned pyramid rapid texturing liquid, the surface of the silicon wafer can be quickly textured at room temperature, and an independent, complete, uniform and closely arranged positive pyramid textured structure can be formed on the surface of the silicon wafer in a very short time. It is 0.5μm to 2μm, and its surface reflectivity is between 8% and 20%. Compared with the pyramid structure of the existing production line, the size is small, the spire is smooth, and the distribution is more uniform, which is very conducive to back throwing and passivation, especially It is suitable for existing high-efficiency battery structures such as PERC, HIT, and IBC. The overall reaction time of the pyramid texturing method provided by the invention is controlled within 5 minutes, which can greatly reduce the time cost and equipment cost, and is favorable for wide popularization and application.

Description

technical field

[0001] The invention belongs to the technical field of solar cells, and in particular relates to a pyramid rapid texturing liquid, a texturing method and a silicon wafer product. Background technique

[0002] Texturing, as a key process in the crystalline silicon cell process, plays an important role in improving efficiency. For single crystal silicon, the commonly used texturing process is alkali texturing, which forms a pyramid structure on the surface of the silicon wafer by anisotropic etching of alkali. In the alkaline texturing process, it is usually necessary to add some additives, such as IPA, to effectively control the reaction. However, with the development of crystalline silicon cell technology, cost reduction and efficiency increase have become the focus of attention. The traditional alkali texturing process requires high temperature (75℃~85℃), long time (20min~30min) and rough throwing with great weight reduction. The throwing process still re...

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