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Self-flame-retardant organic silicon resin for PCB, preparation method of self-flame-retardant organic silicon resin and composition containing self-flame-retardant organic silicon resin

A PCB circuit board and resin composition technology, which is applied in the direction of circuit substrate materials, printed circuits, printed circuit components, etc., can solve problems such as environmental pollution and affecting the physical properties of materials

Pending Publication Date: 2021-03-09
西安安聚德纳米科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the existing technology, the existing self-flame-retardant silicone resin needs to add a large amount of inorganic fillers to meet the flame-retardant requirements. Pollution Technical Issues

Method used

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  • Self-flame-retardant organic silicon resin for PCB, preparation method of self-flame-retardant organic silicon resin and composition containing self-flame-retardant organic silicon resin
  • Self-flame-retardant organic silicon resin for PCB, preparation method of self-flame-retardant organic silicon resin and composition containing self-flame-retardant organic silicon resin
  • Self-flame-retardant organic silicon resin for PCB, preparation method of self-flame-retardant organic silicon resin and composition containing self-flame-retardant organic silicon resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] See Figure 1-Figure 7 , a self-flame-retardant silicone resin for PCB boards is prepared by steps from the following raw materials in parts by weight: 25 to 150 parts of methyltrimethoxysilane, 10 to 50 parts of tetraethoxysilane, tetramethylhydrogen 2-25 parts of ammonium oxide, 4-100 parts of dimethyldimethoxysilane, 5-30 parts of ethylenediamine, 20-60 parts of acetone, N, 30-80 parts of N-dimethylformamide, 50-100 parts of methyl isobutyl ketone, 2-10 parts of glacial acetic acid, and 10-60 parts of deionized water.

[0029] The above-mentioned circuit board uses self-flame-retardant silicone resin, which is synthesized by the following specific steps:

[0030] (1) Add methyl trimethoxysilane and methyl isobutyl ketone in sequence in the reactor, drop the mixture of acetone and ethylenediamine below 5°C, stir for 2h~4h, then add dropwise the mixture of glacial acetic acid and deionized water , and then heated to 50°C to 70°C for 6h to 9h, and the final reaction s...

Embodiment 2

[0040] On the basis of Embodiment 1, the scheme of the embodiment of the present invention is further described in detail by taking a specific manufactured product as an example.

[0041] Described a kind of flame retardant silicone resin for PCB circuit board is synthesized by following specific steps:

[0042] ⑴Add 65.4 parts of methyltrimethoxysilane and 50 parts of methyl isobutyl ketone in turn to the reactor, add dropwise a mixture of 20 parts of acetone and 14.5 parts of ethylenediamine at below 5°C, stir for 2 hours, and then add 1.4 parts dropwise A mixture of glacial acetic acid and 26 parts of deionized water was then heated to 60°C for 8 hours, and the final reaction solution was washed with water until neutral to obtain product A.

[0043] (2) Add 37.8 parts of a blend of tetraethoxysilane and ethanol dropwise to 16.6 parts of a stirring aqueous solution of tetramethylammonium hydroxide, react at room temperature for 25 hours, then heat to 55°C for 12 hours; the f...

Embodiment 3

[0047] Described a kind of flame retardant silicone resin for PCB circuit board is synthesized by following specific steps:

[0048] ⑴Add 109 parts of methyltrimethoxysilane and 50 parts of methyl isobutyl ketone in turn to the reactor, add dropwise a mixture of 30 parts of acetone and 24 parts of ethylenediamine at below 5°C, stir for 2 hours, then add 2.2 parts dropwise A mixture of glacial acetic acid and 43.2 parts of deionized water was then heated to 60°C for 8 hours, and the final reaction solution was washed with water until neutral to obtain product A.

[0049] (2) Add 16.6 parts of a blend of tetraethoxysilane and ethanol dropwise to 7.3 parts of a stirring aqueous solution of tetramethylammonium hydroxide, react at room temperature for 25 hours, then heat to 55°C for 12 hours; the final reaction solution Concentrate, cool, and filter to obtain product B.

[0050] (3) Add the product B obtained from (2) to the N,N-dimethylformamide solution of 28.4 parts of dimethyl...

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Abstract

The invention provides a self-flame-retardant organic silicon resin for a PCB, a preparation method of the self-flame-retardant organic silicon resin and a composition containing the self-flame-retardant organic silicon resin, the resin structure takes a cage-shaped structure as a fulcrum, and an organic silicon main chain similar to a ladder-shaped structure is connected to a side chain of the fulcrum through a flexible chain segment, so that the product has high strength and certain toughness; the thermal stability of the cured organic silicon resin is superior to that of common bisphenol Aepoxy resin; by adjusting the numerical values of m and n in the molecular structure, the product has high carbon-forming property, and the synthesized organic silicon resin belongs to a flame-retardant material and has certain flame retardancy; and the synthesized organic silicon resin contains a vinyl group, has high stability, is easy to store for a long time, has a simple curing process, doesnot produce micromolecular byproducts in the curing process, and has low shrinkage rate, good dimensional stability, low product thermal expansion coefficient and good heat conduction property after curing.

Description

technical field [0001] The invention relates to the technical field of silicone resins, in particular to a self-flame-retardant silicone resin for PCB circuit boards, a preparation method thereof and a composition containing the same. Background technique [0002] With the rapid development of electronic information and communication equipment, electronic components and integrated circuits are also developing rapidly in the direction of densification, high precision and high power, which will inevitably lead to a substantial increase in the heat generation of electronic devices; at the same time, the miniaturization of electronic devices makes The heat dissipation space decreases sharply. If the heat cannot be transferred out in a timely and effective manner, the operating temperature of the circuit will rise rapidly, which may lead to the failure of electronic devices, etc., which will affect the heat resistance, thermal conductivity, insulation and Flame retardancy puts fo...

Claims

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Application Information

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IPC IPC(8): C08G77/20C08G77/06C08L83/07H05K1/03
CPCC08G77/20C08G77/06C08L83/04H05K1/0326C08L2201/02C08L2203/20
Inventor 邓超然刘强
Owner 西安安聚德纳米科技有限公司
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