High-thermal-conductivity and high-electric-conductivity PC/ABS composite material and preparation method thereof

A composite material and high thermal conductivity technology, which is applied in the field of high thermal conductivity and electrical conductivity PC/ABS composite material and its preparation, can solve problems such as poor compatibility, easy agglomeration of added amount, poor compatibility, etc., to improve thermal and electrical conductivity, solve Difficult heat transfer at the interface and effects of improving impact resistance

A composite material and high thermal conductivity technology, which is applied in the field of high thermal conductivity and electrical conductivity PC/ABS composite material and its preparation, can solve problems such as poor compatibility, easy agglomeration of added amount, poor compatibility, etc., to improve thermal and electrical conductivity, solve Difficult heat transfer at the interface and effects of improving impact resistance

CN112457646AInactive Publication Date: 2021-03-09GUANGZHOU SHIYUAN ELECTRONICS CO LTD
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  • High-thermal-conductivity and high-electric-conductivity PC/ABS composite material and preparation method thereof
  • High-thermal-conductivity and high-electric-conductivity PC/ABS composite material and preparation method thereof
  • High-thermal-conductivity and high-electric-conductivity PC/ABS composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Embodiment 1 of the present invention provides a high thermal conductivity and electrical conductivity PC / ABS composite material, which comprises the following raw materials in parts by weight: 80 parts of PC, 20 parts of ABS, 8 parts of ABS toughening agent with a particle size of 5 μm or more, 3 parts of ABS toughening agent below 1μm, 8 parts of flake graphite masterbatch with particle size of 3μm, 20 parts of flake graphite masterbatch with particle size of 12μm, 5 parts of spherical graphite masterbatch with particle size of 10μm, length of 5μm 3 parts of carbon nanotube masterbatch, 1.4 parts of silane coupling agent KH570, 2 parts of hindered phenol antioxidant 1010, 1 part of phosphite antioxidant 168, and 3 parts of pentaerythritol stearate lubricant.

Embodiment 2

[0036] Embodiment 2 of the present invention provides a PC / ABS composite material with high thermal conductivity and electrical conductivity, which comprises the following raw materials in parts by weight: 100 parts of PC, 50 parts of ABS, 10 parts of MBS toughening agent with a particle size of 5 μm or more, and a particle size of 4 parts of MBS toughening agent below 1μm, 20 parts of flake graphite masterbatch with particle size of 3μm, 15 parts of flake graphite masterbatch with particle size of 12μm, 10 parts of spherical graphite masterbatch with particle size of 10μm, length of 5μm 8 parts of carbon nanotube masterbatch, 2.65 parts of silane coupling agent KH550, 5 parts of hindered phenol antioxidant 1076, 3 parts of phosphite antioxidant PEP-36, and 4 parts of pentaerythritol stearate lubricant.

Embodiment 3

[0038] Embodiment 3 of the present invention provides a high thermal conductivity and electrical conductivity PC / ABS composite material, which comprises the following raw materials in parts by weight: 120 parts of PC, 30 parts of ABS, 6 parts of acrylate toughening agent with a particle size of 5 μm or more, particle size 12 parts of acrylate toughening agent below 1μm, 30 parts of flake graphite masterbatch with particle size of 3μm, 10 parts of flake graphite masterbatch with particle size of 12μm, 20 parts of spherical graphite masterbatch with particle size of 10μm, length of 5 parts of 5 μm carbon nanotube masterbatch, 3.25 parts of titanate coupling agent NDZ101, 3 parts of hindered phenol antioxidant 245, 2 parts of phosphite antioxidant 168, and 2 parts of polyol lubricant.

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Abstract

The invention relates to a high-thermal-conductivity and high-electric-conductivity PC / ABS composite material and a preparation method thereof. The high-heat-conductivity and high-electric-conductivity PC / ABS comprises PC, ABS, a toughening agent, a graphite heat-conducting filler, a cellulose heat-conducting filler, a coupling agent, a main antioxidant, an auxiliary antioxidant and a lubricatingagent, wherein the graphite heat-conducting filler and the fiber heat-conducting filler are respectively subjected to polyvinyl alcohol coating modification and coupling agent modification treatment in advance; and blending, melting and extruding are carried out to obtain heat-conducting filler master batch, and the heat-conducting filler master batch is compounded with other raw material components. According to the high-heat-conductivity and high-electric-conductivity PC / ABS composite material, a multi-heat-conductivity and multi-electric-conductivity percolation network is constructed by compounding the graphite heat-conducting filler and the fiber heat-conducting filler, and the graphite heat-conducting filler and the fiber heat-conducting filler are subjected to surface chemical modification in combination with pretreatment of polyvinyl alcohol coating and coupling agent treatment; The electric conduction and heat conduction performance is effectively improved, and the impact resistance of the material can be enhanced.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a high thermal conductivity and electrical conductivity PC / ABS composite material and a preparation method thereof. Background technique [0002] PC / ABS composite material inherits the high heat resistance, high impact and high dimensional stability of PC and the high flow and low internal stress of ABS. It is a kind of composite material with excellent comprehensive properties. It has a wide range of applications in the fields of automobile, machinery, and communication. The service life and failure of many electronic devices are directly related to heat dissipation. As the size of electronic devices is further reduced and the integration level is improved, higher requirements for heat dissipation are also put forward. In addition, in order to prevent surface charge accumulation The resulting series of problems, some products also have electrical conductivity requirem...

Claims

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Application Information

Patent Timeline
09 Mar 2021
Publication
CN112457646A
IPC
C08L69/00; C08L55/02; C08L51/04; C08L33/04; C08L83/04; C08K13/06; C08K9/10; C08K7/00; C08K7/18; C08K3/04
CPC
C08L69/00; C08L55/02; C08L2201/04; C08K2201/014; C08K2201/011; C08K2201/001; C08L2205/025; C08L2205/035
Inventors
万虎; 冯先强