Adhesive, preparation method thereof and adhesive tape
A technology of adhesives and initiators, applied in the direction of adhesives, adhesive types, ester copolymer adhesives, etc., can solve the problems of weakened interaction, strong interaction force, and reduced adhesive performance, so as to ensure adhesive performance , good bonding performance, avoid the effect of seepage
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Embodiment 1
[0052] Mix 2.0g of ionic liquid monomer 1-vinyl-3-butylimidazole bistrifluoromethanesulfonimide salt and 9.4mg of 1-hydroxycyclohexyl phenyl ketone evenly, and apply it on the tape after vacuum degassing for 30s. The substrate with the mold is then cured by UV light. Then poly-1-vinyl-3-butylimidazole bistrifluoromethanesulfonimide salt was dissolved in 5 mL of acetone with 4.0 g of hexafluorobutyl acrylate, 4.0 g of methyl methacrylate and 116 mg of 1-hydroxycyclohexylphenyl The ketone is mixed evenly, and the solvent is volatilized after being evenly coated on the substrate, and then cured by ultraviolet light. The light curing conditions are set as follows: the light source power density is 50mW / cm 2 , time 1h.
Embodiment 2
[0054] 1.2g of hexafluorobutyl acrylate, 1.2g of methyl methacrylate and 35mg of 1-hydroxycyclohexyl phenyl ketone were mixed evenly, and after vacuum degassing for 30s, they were coated on a substrate with a mold and then cured by ultraviolet light. The copolymer synthesized above was dissolved in 5 mL of acetone and mixed with 1.2 g of ionic liquid monomer 1-vinyl-3-butylimidazole bistrifluoromethanesulfonimide salt and 5.7 mg of 1-hydroxycyclohexyl phenyl ketone , and then evenly coated on the substrate to evaporate the solvent, followed by UV curing. The light curing conditions are set as follows: the light source power density is 50mW / cm 2 , time 1h.
Embodiment 3
[0056] 0.3g of ionic liquid monomer 1-vinyl-3-butylimidazole bistrifluoromethanesulfonimide salt, 0.7g of hexafluorobutyl acrylate and 7.5mg of 1-hydroxycyclohexyl phenyl ketone were mixed uniformly and vacuum degassed After 30s it is applied to the substrate with the mold and then cured by UV light. The UV curing conditions are set as follows: the power density of the light source is 50mW / cm 2 , time 1h.
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