MXene nanosheet compounded thermal conductive gel with thermal self-repairing performance and preparation method of MXene nanosheet compounded thermal conductive gel

Abstract

The invention relates to the technical field of thermal interface materials, in particular to MXene nanosheet compounded thermal conductive gel with thermal self-repairing performance and a preparation method of the MXene nanosheet compounded thermal conductive gel. The thermal conductive gel comprises the following components: vinyl-terminated polydimethylsiloxane, a chain extender, a cross-linking agent, a silane coupling agent, an inhibitor, a catalyst, a thermal self-repairing polymer, a conventional thermal conductive filler and an MXene nanosheet. The MXene nanosheet and a conventional heat-conducting filler cooperate to construct a heat-conducting path, so that the thermal resistance is reduced, and the heat-conducting property is improved; and the thermal self-repairing polymer component has a reversible dynamic coordination bond sensitive to temperature, and can be crosslinked again to form a crosslinked network, so that the thermal conductive gel has a self-repairing function, and the service life of the thermal conductive gel is prolonged. The preparation method is simple, the reaction temperature is moderate, the organic matrix and the heat-conducting filler are fully crosslinked, the interface thermal resistance is reduced, meanwhile, the phenomena of oil overflow, dry solid pulverization and the like are effectively overcome, and the product reliability is improved.

Description

technical field [0001] The invention relates to the technical field of thermal interface materials, in particular to a thermally conductive gel compounded with MXene nanosheets and having thermal self-healing properties and a preparation method thereof. Background technique [0002] With the increasing integration and miniaturization of electronic equipment, more and more heat is generated when electronic equipment is working, and heat dissipation has become a key technology that restricts the development and safe operation of electronic equipment. Thermal resistance analysis shows that there is a "hard" contact between the device and the heat sink, and the interface between the device and the heat sink has a large thermal resistance, making it difficult to form an effective heat dissipation channel. This is mainly due to the microscopic roughness of the solid surface. It only accounts for 1%-5%, and the rest is tiny voids filled with air. Air is a poor conductor of heat an...

AI Technical Summary

Problems solved by technology

Since the thermal conductivity of these commonly used thermal conductive fillers is not very high, to obtain high thermal conductivity, a large amount is added. The addition of a large amount of thermal conductive fillers not only increases the cost and weight of the thermal conductive gel, but also reduces the interface wettability of the material. , viscosity increases, and hardness increases, which are subject to certain restrictions in actual construction applications

In addition, when traditional thermal gels work under high temperature conditions for a long time, internal cracking problems will inevitably occur. Air, as a poor conductor of heat, enters the cracks, affecting work performance and reducing service life.

[0005] In the prior art, the invention patent application with the publication number CN109777345A discloses a self-healing two-component addition type thermally conductive silicone gel. m.K, it is difficult to meet the high heat dissipation requirements of electronic components

In addition, the patent applications for inventions with publication numbers CN105754350A and CN111286307A are all related to the preparation method of thermally conductive gel. However, the thermal conductivity of the thermally conductive gel prepared by the above-mentioned prior art can reach 3w / m.K, and the mass fraction of thermally conductive fillers is high. More than 1000phr, and the heat conduction gel works under high temperature conditions for a long time, cracking will inevitably occur, which will affect the heat dissipation effect and service life of the heat conduction gel

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