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PCB tin brushing patch production process method

A production process and tin patch technology, which is applied in the field of PCB tin patch production process, can solve the problems of low production efficiency and high defect rate, and achieve the effects of improved production efficiency, good wetting, and large spreading rate

Inactive Publication Date: 2021-04-16
图尔克(天津)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In solder paste printing, there are three important parts, solder paste, stencil and printing equipment. In addition, the feeding system is manual feeding, which leads to low production efficiency and high defect rate.

Method used

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  • PCB tin brushing patch production process method
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  • PCB tin brushing patch production process method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Example 1: The solder paste formula is Sn-Bi lead-free solder paste. The specific formula is a combination of metal powder and flux, according to the weight ratio: 88% metal powder, 12% flux; wherein the metal powder is: Sn: 42%, Bi: 57%, Ag: 1%, flux is composed of activator, solvent, thixotropic agent and film former, active agent 8-9%, solvent 5-11.5%, thixotropic agent 0.5-1% And film former 80-85%. According to weight ratio: active agent 9%, solvent 8.4%, thixotropic agent 1% and film former 81.6%, wherein the selected active agent is methyl succinic acid, adipic acid, salicylic acid and succinic acid by weight The ratio is 5:3:5:2, and organic amines are added to adjust the pH at room temperature or low temperature. Among them, triethanolamine is selected as the organic amine.

[0044] The solvent is selected from ethylene glycol ethyl ether, tetrahydrofurfuryl alcohol, and diethylene glycol ethyl ether, and the compounding ratio is 1:2:2 by weight. The thixotro...

Embodiment 2

[0045] Example 2 The solder paste formula is Sn-Bi lead-free solder paste. The specific formula is a combination of metal powder and flux, according to the weight ratio: metal powder 88%, flux 12%; wherein the metal powder is according to the weight ratio: Sn: 42 %, Bi: 57%, Ag: 1%, flux is composed of activator, solvent, thixotropic agent and film-forming agent, active agent 8-9%, solvent 5-11.5%, thixotropic agent 0.5-1% and Film former 80-85%. According to weight ratio: active agent 9%, solvent 8.4%, thixotropic agent 1% and film former 81.6%, wherein the selected active agent is methyl succinic acid, adipic acid, salicylic acid and succinic acid by weight The ratio is 5:3:5:2, and organic amines are added to adjust the pH at room temperature or low temperature. Among them, triethanolamine is selected as the organic amine.

[0046] The solvent is selected from ethylene glycol ethyl ether, tetrahydrofurfuryl alcohol, and diethylene glycol ethyl ether, and the compounding ra...

Embodiment 3

[0047] Example 3 The solder paste formula is Sn-Bi series lead-free solder paste. The specific formula is a combination of metal powder and flux, according to the weight ratio: 80% metal powder, 20% flux; wherein the metal powder according to the weight ratio is: Sn: 42 %, Bi: 57%, Ag: 1%, flux is composed of activator, solvent, thixotropic agent and film-forming agent, active agent 8-9%, solvent 5-11.5%, thixotropic agent 0.5-1% and Film former 80-85%. According to weight ratio: active agent 9%, solvent 8.4%, thixotropic agent 1% and film former 81.6%, wherein the selected active agent is methyl succinic acid, adipic acid, salicylic acid and succinic acid by weight The ratio is 5:3:5:2, and organic amines are added to adjust the pH at room temperature or low temperature, among which triethanolamine is selected as the organic amine.

[0048] The solvent is a mixture of ethylene glycol ether, tetrahydrofurfuryl alcohol, and diethylene glycol ether, and the compounding ratio is...

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Abstract

The invention discloses a PCB tin brushing patch production process method comprising a feeding system, tin paste printing, accurate patch pasting, reflow soldering, visual inspection and a general control operation system; a formula of tin paste is designed in the PCB tin brushing patch production process method, and an active agent, a solvent, a thixotropic agent and the like of a compounding system are added; therefore, the tin paste has the properties of good wetting degree, high spreading rate, excellent cold and hot collapse performance and the like. A visual system is introduced into the feeding procedure, automatic feeding is achieved, and the production efficiency is greatly improved. A machine visual system and a printing screen micro-positioning system for marking MARK points on a PCB of printing equipment are improved, a cooling air conditioner is added into a printing machine to achieve rapid cooling of the tin paste, the effect that the tin paste is rapidly separated from a printing screen and does not adhere to the printing screen can be achieved, and the problem that the tin paste adheres to the screen in the industry is greatly solved.

Description

technical field [0001] The invention relates to the technical field of PCB circuit board processing, in particular to a production process for PCB tin patching Background technique [0002] Surface mount technology (SMT) has become the most common technology in today's electronic assembly technology, soldering [0003] The production process of PCB brush tin patch mainly includes: solder paste printing, precise patch, reflow soldering. Solder paste printing is the first key process in the basic process of SMT, and it is also one of the most important links. The quality of solder paste printing directly affects the quality and efficiency of SMT assembly. On a typical PCB (printed circuit board), there may be hundreds of components and 600 to 1,000 connection points (ie, pads). Therefore, the rate of weld failures at these endpoints must be maintained at a minimum. In the actual production process, about 60% of the PCBs that fail the test and need to be reworked are due to...

Claims

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Application Information

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IPC IPC(8): H05K13/00H05K13/04H05K13/08H05K7/20H05K3/34
Inventor 王瑞克田健夫孙大宝陈磊
Owner 图尔克(天津)科技有限公司
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