Method for processing gallium nitride by femtosecond laser dry etching
A technology of femtosecond laser and dry etching, applied in the field of femtosecond laser application, can solve the problems of complex process, low processing quality and high technical threshold
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0027] The method for processing gallium nitride by femtosecond laser dry etching, the specific steps are as follows:
[0028] Step 1: Build a femtosecond laser micromachining system, using a femtosecond laser with a center wavelength of 800nm, a repetition rate of 1kHz, and a pulse width of 30fs. Through an objective lens with a numerical aperture of 0.5, it is focused on the surface of the gallium nitride sample fixed on the three-dimensional translation stage;
[0029] Step 2: Controlling the number of femtosecond laser pulses acting on the gallium nitride surface is 1000, the pulse energy is 8mW, and the processing point interval is 20μm;
[0030] Step 3: ultrasonically clean the gallium nitride sample after femtosecond laser processing in acetone, ethanol, and deionized water for 5 minutes to remove particles produced by laser ablation and scattered on the surface of the sample; step 4: place the cleaned sample In the etching chamber of the inductively coupled plasma etc...
Embodiment 2
[0037] The method for processing gallium nitride by femtosecond laser dry etching, the specific steps are as follows:
[0038] Step 1: Build a femtosecond laser micromachining system, using a femtosecond laser with a center wavelength of 800nm, a repetition rate of 1kHz, and a pulse width of 30fs. Through an objective lens with a numerical aperture of 0.5, it is focused on the surface of the gallium nitride sample fixed on the three-dimensional translation stage;
[0039]Step 2: Controlling the number of femtosecond laser pulses acting on the gallium nitride surface is 50, the pulse energy is 7mW, and the processing point interval is 20μm;
[0040] Step 3: ultrasonically clean the gallium nitride sample after femtosecond laser processing in acetone, ethanol, and deionized water for 5 minutes to remove particles produced by laser ablation and scattered on the surface of the sample; step 4: place the cleaned sample In the etching chamber of the inductively coupled plasma etchin...
Embodiment 3
[0047] The method for processing gallium nitride by femtosecond laser dry etching, the specific steps are as follows:
[0048] Step 1: Build a femtosecond laser micromachining system, using a femtosecond laser with a center wavelength of 800nm, a repetition rate of 1kHz, and a pulse width of 30fs. Through an objective lens with a numerical aperture of 0.5, it is focused on the surface of the gallium nitride sample fixed on the three-position translation stage;
[0049] Step 2: Controlling the number of femtosecond laser pulses acting on the gallium nitride surface is 50, the pulse energy is 4mW, and the processing point interval is 20μm;
[0050] Step 3. Ultrasonic cleaning the gallium nitride sample after femtosecond laser processing in acetone, ethanol and deionized water for 5 minutes respectively, to remove the particles produced by laser ablation and scattered on the surface of the sample;
[0051] Step 4, place the cleaned sample in the etching chamber of the inductivel...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 

