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Metal printed circuit board with heat dissipation layer

A technology of printed circuit boards and heat dissipation layers, applied in the directions of printed circuit components, circuit thermal devices, circuit thermal components, etc., can solve the problems of low product reliability, cracks or peeling, different thermal expansion coefficients, etc.

Inactive Publication Date: 2021-05-04
仁诚科技(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the case of metal PCBs, although metal materials such as metal substrates and copper circuit layers are used, heat dissipation performance is superior to that of conventional epoxy resin PCBs using epoxy resin, etc. The thermal expansion coefficients of the copper and other circuit pattern layers formed on the copper layer or the heat dissipation layer are different, and cracks or peeling phenomena occur due to the difference in thermal expansion, resulting in a problem of low product reliability.
[0007] In addition, metal PCBs have been equipped with heat dissipation layers and insulating layers so far, which makes it difficult to reduce the thickness and miniaturization of metal PCBs.

Method used

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  • Metal printed circuit board with heat dissipation layer
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  • Metal printed circuit board with heat dissipation layer

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] In the manufacturing method of the above-mentioned high heat dissipation insulating composite material core plate of the present invention, as shown in Table 1, change the mixing amount of the aluminum nitride that has done surface modification with silane, to analyze the effect of different ceramic filling ratios on thermal conductivity and thermal expansion The effect of the coefficient. Here, the average diameter of the aluminum nitride spherical powder is 4 μm, and the volume ratio of the spherical powder and the acicular powder is 1:1.

[0055] Table 1

[0056]

[0057] As shown in Table 1, the higher the AlN filling rate, the greater the thermal conductivity and the smaller the thermal expansion coefficient of the high heat dissipation insulating composite core board. This shows that aluminum nitride possesses the physical properties of much higher thermal conductivity than epoxy resin and a small coefficient of thermal expansion.

[0058] On the other hand, ...

Embodiment 2

[0060] Next, in the above-mentioned high heat dissipation insulation composite core board manufacturing method, as shown in Table 2, the proportion of spherical aluminum nitride and acicular silicon carbide modified with silane was changed to analyze the different ceramic fillers. The effect of the type on thermal conductivity and thermal expansion coefficient. Here, the average diameter of the aluminum nitride spherical powder is 1.5 μm, and the ceramic filling rate of the total of aluminum nitride and needle-like silicon carbide is set to 50% by volume.

[0061] Table 2

[0062]

[0063]As shown in Table 2, the thermal conductivity is the highest when the ratio of silicon carbide and aluminum nitride is 1:6, and the thermal conductivity of aluminum nitride alone is higher than that of silicon carbide alone, which shows that aluminum nitride is better than carbonized in improving thermal conductivity. Silicon is more effective.

[0064] In addition, as shown in Table 2, ...

Embodiment 3

[0066] Next, in the above-mentioned high heat dissipation insulation composite core plate manufacturing method, as shown in Table 3, the ratio of spherical aluminum nitride and needle-shaped aluminum nitride with silane surface modification was changed to analyze the thermal conductivity and Changes in the coefficient of thermal expansion. Here, the average diameter of the aluminum nitride spherical powder is 2 μm, and the total ceramic filling rate of the spherical aluminum nitride and the needle-shaped aluminum nitride is set to be 50% by volume.

[0067] table 3

[0068]

[0069] As shown in Table 3, the change in the proportion of spherical AlN and acicular AlN has a greater effect on the coefficient of thermal expansion than the thermal conductivity, and the larger the proportion of spherical AlN, the smaller the coefficient of thermal expansion.

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Abstract

The invention provides a metal printed circuit board with a heat dissipation layer. The metal printed circuit board with the heat dissipation layer comprises a metal substrate 110, a heat dissipation layer 120 and a circuit pattern layer 130, wherein the heat dissipation layer 120 is located between the metal substrate 110 and the circuit pattern layer 130, the heat dissipation layer 120 is a composite material core plate, and the composite material core plate is made of epoxy resin, silane and a ceramic filler. The metal printed circuit board with the heat dissipation layer provided by the invention can reduce a thermal expansion difference between the metal substrate and the circuit pattern layer or other parts so as to prevent thermal shock or fatigue cracking, can meet the requirements of the metal PCB used by a high-power integrated circuit for heating power and electrical characteristics, and achieves the advantages of miniaturization, lightness and thinness of the metal PCB.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a metal printed circuit board with a heat dissipation layer. Background technique [0002] Recently, the electronic equipment used in automobiles, electronics and electrical fields has become increasingly thinner, smaller, and multi-functional. As a result, more and more highly integrated electronic components generate more and more heat. The heat dissipated not only reduces the performance of electronic components, but also becomes the culprit that causes the misoperation of surrounding electronic components and the deterioration of substrates. There is also more and more attention and research on heat control technology. [0003] Especially in the case of LEDs, about 85% of the input energy is converted into heat loss, and the high-temperature heat discharge causes the temperature of the junction to continue to rise, thereby shortening the life of the LED semico...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0203H05K2201/06
Inventor 任洪宰张伟
Owner 仁诚科技(深圳)有限公司