Single-component solventless hot melt adhesive as well as preparation method and use method thereof

A hot-melt adhesive and solvent-free technology, applied in the direction of adhesives, adhesive types, adhesive additives, etc., can solve problems such as difficult to meet the lamination process, environmental pollution, and human safety hazards, so as to reduce investment in environmental protection facilities and reduce Effect of VOC emissions and reduction of environmental protection disposal costs

Pending Publication Date: 2021-05-25
WUXI LAIEN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] The purpose of the present invention is to provide a single-component solvent-free hot melt adhesive and its preparation method and use method. The hot melt adhesive solves the problem of the large environmental pollution caused by the solvent-based hot melt adhesive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0035]Example 1: A single component solventless hot melt glue, the hot melt glue consists of 30 parts of the material of 30 parts of isocyanate, 60 parts of polyester polyol, 20 parts of polyether polyol, 0.2 parts of the chain extender, 0.8 parts of curing agent, 2 polycarbonimide, 1.5 parts of adhesion promoter, 0.1 parts of catalyst and 0.2 parts of an antioxidant.

[0036]The isocyanate is a polyphenyl polyphenylene poly isocyanate, polyphenyl polymethylene poly isocyanate, isocyanate, diphenyl methane diisocyanate, dicyclohexylmethyl isocyanate and six methylene group 2 One or more mixtures of isocyanate.

[0037]The polyester polyol includes one or more mixtures of an epoxy acrylic modified saturated polyester, an aliphatic polyol, an aromatic polyol, a polycaprolactone polyol, and a polycarbonate diol; the polyester The average molecular weight of the polyol is 500-4000.

[0038]The polyether polyol is a polyoxylated propylene glycol, a polyoxy acrylic alcohol, a polytetrahydrofuran, ...

Example Embodiment

[0058]Example 2: A single component solventless hot melt adhesive, the hot melt glue consists of 30 parts of the amount of isocyanate, 80 parts of polyester polyol, 15 parts of polyether polyol, 0.5 parts of the chain extender, 1 part of the curing agent, 1.5 parts of polycarbiximine, 1 part of the adhesion promoter, 0.2 parts of catalyst and 0.1 parts of an antioxidant.

[0059]The isocyanate is a polyphenyl polyphenylene poly isocyanate, polyphenyl polymethylene poly isocyanate, isocyanate, diphenyl methane diisocyanate, dicyclohexylmethyl isocyanate and six methylene group 2 One or more mixtures of isocyanate.

[0060]The polyester polyol includes one or more mixtures of an epoxy acrylic modified saturated polyester, an aliphatic polyol, an aromatic polyol, a polycaprolactone polyol, and a polycarbonate diol; the polyester The average molecular weight of the polyol is 500-4000.

[0061]The polyether polyol is a polyoxylated propylene glycol, a polyoxy acrylic alcohol, a polytetrahydrofura...

Example Embodiment

[0081]Example 3: A single component solvent-free thermally melt glue, the hot melt glue consists of 30 parts by weight of isocyanate, 50 parts of polyester polyol, 50 parts of polyether polyol, 1 part of the chain extender, 1.5 parts of curing agent, 3 polycarbonimide, 2 parts of adhesion promoter, 0.5 parts of catalyst and 0.3 parts of an antioxidant.

[0082]The isocyanate is a polyphenyl polyphenylene poly isocyanate, polyphenyl polymethylene poly isocyanate, isocyanate, diphenyl methane diisocyanate, dicyclohexylmethyl isocyanate and six methylene group 2 One or more mixtures of isocyanate.

[0083]The polyester polyol includes one or more mixtures of an epoxy acrylic modified saturated polyester, an aliphatic polyol, an aromatic polyol, a polycaprolactone polyol, and a polycarbonate diol; the polyester The average molecular weight of the polyol is 500-4000.

[0084]The polyether polyol is a polyoxylated propylene glycol, a polyoxy acrylic alcohol, a polytetrahydrofuran, a tetrahydrofura...

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Abstract

The invention discloses a single-component solventless hot melt adhesive as well as a preparation method and a use method thereof. The hot melt adhesive is prepared from the following raw materials in parts by weight: 30 to 50 parts of isocyanate, 60 to 90 parts of polyester polyol, 10 to 30 parts of polyether polyol, 0.1 to 5 parts of a chain extender, 0.1 to 2 parts of a curing agent, 0.1 to 3 parts of polycarbodiimide, 0.1 to 2 parts of an adhesion promoter, 0.1 to 0.5 part of a catalyst and 0.1 to 0.3 part of an antioxidant. No organic solvent or Bis-phenol A substances need to be added, the VOC emission can be greatly reduced, the pollution of the hot melt adhesive to the environment is effectively improved, the viscosity of the hot melt adhesive is 5000 mpa.s, NOC% measured according to the weight ratio is 8.5%, and the hot melt adhesive has good boiling resistance, high temperature steaming resistance, 85 experiment resistance, salt mist resistance, hydrochloric acid resistance, electrolysis resistance and deep drawing resistance.

Description

technical field [0001] The invention relates to a one-component solvent-free hot-melt adhesive, a preparation method and a use method thereof, and belongs to the technical field of hot-melt adhesives. Background technique [0002] In industrial production, it is often necessary to use adhesives to realize materials and composites. Common composite adhesives are divided into solvent-based adhesives and solvent-free adhesives, and both solvent-based adhesives and solvent-free adhesives can be realized in the form of one-component or two-component. And according to the composition of the formula, it can be divided into heating and non-heating forms. [0003] In some typical lamination fields, such as metal lamination, the metal plate lamination technology is a processing technology that pastes the plastic film on the metal plate by hot pressing the plastic film and the metal plate at high temperature. The film lamination technology was born in 1977. In Japan, it was originally...

Claims

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Application Information

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IPC IPC(8): C09J175/06C09J175/08C09J11/06C08G18/66C08G18/42C08G18/48C08G18/34
CPCC09J175/06C09J175/08C09J11/06C08G18/6625C08G18/4018C08G18/348
Inventor 张来
Owner WUXI LAIEN TECH
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