Photo-acid generator and resin composition for photolithography

Abstract

The purpose of the present invention is to provide a non-ionic photo-acid generator which exhibits high photosensitivity to i-rays, excellent compatibility with, and solubility in, a resist solution, and excellent thermal stability. The present invention is a non-ionic photo-acid generator that is characterized by being represented by general formula (1). In formula (1), X denotes an oxygen atom or a sulfur atom, R1 denotes a hydrogen atom or a C1-12 alkyl group that may have a carboxylic acid group, R2 denotes a hydrogen atom or a C1-12 alkyl group, and Rf denotes a C1-12 hydrocarbon group in which some or all of the hydrogen atoms are substituted with fluorine atoms.

Description

Technical field[0001]The present invention relates to a photoclease generator and a photolithography resin composition. More specifically, a nonionic acid generating agent suitable for generating a strong acid to produce a strong acid and a photolithographic resin composition comprising its photolithography is involved in the action of an ultraviolet (I line).Background technique[0002]Also, in the field of microfabrication represented by semiconductor, I is widely used as a photolithographic process using wavelength 365 nm as exposure light.[0003]As the resist material used in the photolithography process, for example, a resin composition containing a polymer and an optic acid generator has a tert-butyl carbonate group of a carboxylic acid having a t-butyl carbonate group of a carboxylic acid. As a photoconlease generator, a triarylium-based arylium salt (Patent Document 1) is known, a benzylmethylamidium salt having a naphthyl skeleton (Patent Document 2), and has an oxime sulfonat...

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Problems solved by technology

[0006] Since the compatibility of ionic photoacid generators with hydrophobic materials containing these alicyclic skeletons and fluorine-containing skeletons is insufficient, there is a problem that phase separation occurs in the resist material, thereby failing to exert a sufficient effect. Resist properties, no patterning possible

On the other hand, although the nonionic photoacid generator has good compatibility with hydrophobic materials, it has the problem of generating scum in the exposed part in the alkaline development process.

In addition, there are problems of insufficient sensitivity to the i-line, and a problem of narrow allowance due to decomposition in post-exposure heating (PEB) due to insufficient heat resistance stability.

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