Flexible conductive metal pattern, preparation method and application of flexible conductive metal pattern, and conductive material

A conductive metal and pattern technology, which is used in equipment for manufacturing conductive/semiconducting layers, conductive layers on insulating carriers, cable/conductor manufacturing, etc., can solve problems such as damage and poor pattern conductivity, and achieve simple and economical processes. time, good flexibility

Active Publication Date: 2021-06-25
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the metal layer formed by printing metal precursors needs to undergo high-temperature post-treatment before it can conduct electricity, and high temperature will cause irreversible damage to plastic or paper substrates; and the formed pattern has poor conductivity due to being too thin

Method used

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  • Flexible conductive metal pattern, preparation method and application of flexible conductive metal pattern, and conductive material
  • Flexible conductive metal pattern, preparation method and application of flexible conductive metal pattern, and conductive material
  • Flexible conductive metal pattern, preparation method and application of flexible conductive metal pattern, and conductive material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] This embodiment provides a method for preparing a flexible conductive metal pattern, which includes the following steps:

[0046] The rosin-capped Ag nanoparticles were mixed and stirred with 3-aminopropyltriethoxysilane solution accounting for 5% of the mass of Ag, and self-assembled on the surface of Ag particles to form a silane molecular film. Mix polydimethylsiloxane prepolymer (Dow Corning, sylgard184) with curing agent (small molecule silane) in a mass ratio of 10:1, add the silver nanoparticles (particle diameter 60-100 nanometers), the mixture of the three is fully stirred until it is evenly mixed to obtain ink. Print ink with a certain pattern on the surface of qualitative filter paper with a screen printing process (with a hollow line width of 500 microns and a line spacing of 500 microns), the thickness of which is about 8 microns, and dry at 80°C for 2 hours; the filter paper printed with the pattern Immerse in tetrahydrofuran solution to swell for 15 minu...

Embodiment 2

[0051] The rosin-capped Ag nanoparticles were mixed and stirred with 3-aminopropyltriethoxysilane solution accounting for 5% of the mass of Ag, and self-assembled on the surface of Ag particles to form a silane molecular film. Mix the polydimethylsiloxane prepolymer and the curing agent (small molecule silane) at a mass ratio of 10:1, add the above-mentioned treated silver nanoparticles (60-100 nanometers in diameter) accounting for 50% of the total mass ), the mixture of the three is fully stirred until it is evenly mixed to obtain ink. A large-area ink pattern with a length of 10 cm and a width of 10 cm was printed on the surface of qualitative filter paper by a large-area screen printing process, with a thickness of about 8 microns, and dried at 80°C for 2 hours; the filter paper printed with PDMS-Ag ink was immersed in Swell in tetrahydrofuran solution for 15 minutes; then immerse the swollen substrate in electroless copper plating solution for 30 minutes, 60 minutes, 120 ...

Embodiment 3

[0058] This embodiment provides a method for preparing a flexible conductive metal pattern, which includes the following steps:

[0059] Mix the polydimethylsiloxane prepolymer and the curing agent (small molecule silane) at a mass ratio of 10:1, add 60% of the total mass of nickel nanoparticles (particle diameter is less than 100 nanometers), and combine the three The mixture was sonicated for 30 min and stirred thoroughly to obtain ink. Print a certain pattern of ink on the surface of the dust-free paper with a screen printing process (with a hollow line width of 500 microns and a line spacing of 500 microns), with a thickness of about 9 microns, and dry at 80°C for 1 hour; The filter paper is swelled in acetone solution for 10 minutes; then the swollen substrate is immersed in the electroless nickel plating solution for 1 hour for plating. The A component of the electroless nickel plating solution is: Ni 2 SO 4 ·5H 2 O (40g / L), sodium citrate (20 g / L), lactic acid (10 g / ...

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Abstract

The invention belongs to the technical field of electronic device preparation, and provides a flexible conductive metal pattern, a preparation method and application of the flexible conductive metal pattern, and a conductive material. The preparation method of the conductive metal pattern comprises the following steps: mixing metal nanopowder having been subjected to or not subjected to surface silanization treatment, a polydimethylsiloxane prepolymer and a curing agent with or not with a first solvent to obtain ink; printing the ink on a flexible substrate, and curing the flexible substrate to obtain a printed substrate; and immersing the printed substrate into a second solvent which is mutually soluble with water and can swell ink for swelling treatment, then transferring the substrate into a metal salt solution to realize metallization of the pattern via a chemical plating process, and then conducting drying to obtain the conductive metal pattern. The preparation method provided by the invention is simple in process and low in cost, a printing and solution treatment method compatible with an industrial preparation method is adopted, and the prepared flexible conductive metal pattern is high in binding force with a substrate, high in conductivity and high in printing precision.

Description

technical field [0001] The invention belongs to the technical field of electronic device preparation, and in particular relates to a flexible conductive metal pattern and a preparation method and application thereof. Background technique [0002] At present, various emerging electronic devices have tended to be flexible, including flexible circuit boards, radio frequency identification cards, sensors, displays, solar cells, energy storage devices, smart textiles, electronic skin and so on. Conductive materials are essential in flexible electronics, so the development of bendable or foldable high-performance flexible conductors is of great significance for various new application scenarios. Flexible conductive materials include metal films, carbon-based materials, oxides, two-dimensional transition metal carbides, nitrides and carbonitrides, conductive polymers (polyaniline, polypyrrole, polythiophene), etc. Compared with other materials, metal has the characteristics of hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B13/00H01B5/14
CPCH01B13/0026H01B5/14Y02E10/549
Inventor 郭瑞生李昊东王浩然
Owner NORTHWESTERN POLYTECHNICAL UNIV
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