Flexible conductive metal pattern, preparation method and application of flexible conductive metal pattern, and conductive material
A conductive metal and pattern technology, which is used in equipment for manufacturing conductive/semiconducting layers, conductive layers on insulating carriers, cable/conductor manufacturing, etc., can solve problems such as damage and poor pattern conductivity, and achieve simple and economical processes. time, good flexibility
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Embodiment 1
[0045] This embodiment provides a method for preparing a flexible conductive metal pattern, which includes the following steps:
[0046] The rosin-capped Ag nanoparticles were mixed and stirred with 3-aminopropyltriethoxysilane solution accounting for 5% of the mass of Ag, and self-assembled on the surface of Ag particles to form a silane molecular film. Mix polydimethylsiloxane prepolymer (Dow Corning, sylgard184) with curing agent (small molecule silane) in a mass ratio of 10:1, add the silver nanoparticles (particle diameter 60-100 nanometers), the mixture of the three is fully stirred until it is evenly mixed to obtain ink. Print ink with a certain pattern on the surface of qualitative filter paper with a screen printing process (with a hollow line width of 500 microns and a line spacing of 500 microns), the thickness of which is about 8 microns, and dry at 80°C for 2 hours; the filter paper printed with the pattern Immerse in tetrahydrofuran solution to swell for 15 minu...
Embodiment 2
[0051] The rosin-capped Ag nanoparticles were mixed and stirred with 3-aminopropyltriethoxysilane solution accounting for 5% of the mass of Ag, and self-assembled on the surface of Ag particles to form a silane molecular film. Mix the polydimethylsiloxane prepolymer and the curing agent (small molecule silane) at a mass ratio of 10:1, add the above-mentioned treated silver nanoparticles (60-100 nanometers in diameter) accounting for 50% of the total mass ), the mixture of the three is fully stirred until it is evenly mixed to obtain ink. A large-area ink pattern with a length of 10 cm and a width of 10 cm was printed on the surface of qualitative filter paper by a large-area screen printing process, with a thickness of about 8 microns, and dried at 80°C for 2 hours; the filter paper printed with PDMS-Ag ink was immersed in Swell in tetrahydrofuran solution for 15 minutes; then immerse the swollen substrate in electroless copper plating solution for 30 minutes, 60 minutes, 120 ...
Embodiment 3
[0058] This embodiment provides a method for preparing a flexible conductive metal pattern, which includes the following steps:
[0059] Mix the polydimethylsiloxane prepolymer and the curing agent (small molecule silane) at a mass ratio of 10:1, add 60% of the total mass of nickel nanoparticles (particle diameter is less than 100 nanometers), and combine the three The mixture was sonicated for 30 min and stirred thoroughly to obtain ink. Print a certain pattern of ink on the surface of the dust-free paper with a screen printing process (with a hollow line width of 500 microns and a line spacing of 500 microns), with a thickness of about 9 microns, and dry at 80°C for 1 hour; The filter paper is swelled in acetone solution for 10 minutes; then the swollen substrate is immersed in the electroless nickel plating solution for 1 hour for plating. The A component of the electroless nickel plating solution is: Ni 2 SO 4 ·5H 2 O (40g / L), sodium citrate (20 g / L), lactic acid (10 g / ...
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