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Processing and preparing method of high-thermal-conductivity PCB substrate

A high thermal conductivity, substrate technology, applied in the processing of insulating substrates/layers, printed circuit manufacturing, printed circuits, etc., can solve the problems of low resin content, decreased resin fluidity, brittle fracture, etc. The effect of increasing the bulk density and increasing the filling density

Pending Publication Date: 2021-08-27
广州青苗新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Increasing the proportion of ceramic powder can improve the thermal conductivity of the material, but at the same time it will seriously reduce the mechanical properties of the material, resulting in the unusability of the material
[0012] In order to further improve the thermal conductivity of ceramic composite materials, increasing the filler ratio is an ideal solution, but the high filler ratio reduces the fluidity of the resin, making it difficult to completely fill the gaps in the material, resulting in defects such as gaps and cracks, thereby deteriorating the mechanical properties of the material
At the same time, the low resin content also makes the polymer as a bonding material weak, causing cracks to develop easily and forming brittle fractures

Method used

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  • Processing and preparing method of high-thermal-conductivity PCB substrate
  • Processing and preparing method of high-thermal-conductivity PCB substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Weigh 15g of PPS (polyphenylene sulfide, Xinhecheng 11200F), 60g of corundum-type alumina particles of 300 mesh, and 25g of corundum-type alumina particles of 600 mesh. Mix in a small pulverizer for 10 seconds and set aside.

[0033] 100 g of the mixed sample was weighed, and hot-pressed in a circular mold with a diameter of 50 mm and a heating mantle at a pressure of 200 MPa, a temperature of 300° C., and a pressing time of 20 min.

[0034] After cooling, the sample was taken out, and the sample was cut into 1.5mm thin slices with a diamond wire cutting machine (Tangshan Jingyu), marked as M1-0, and the thickness size distribution, thermal conductivity and mechanical properties were tested.

[0035] M1-0 is heat treated according to the curve H1, marked as M1-0-H1, and the thickness size distribution, thermal conductivity and mechanical properties are tested.

Embodiment 2

[0037] Weigh 15g of PPS (polyphenylene sulfide, Xinhecheng 11200F), 60g of corundum-type alumina particles of 300 mesh, and 25g of corundum-type alumina particles of 600 mesh. Mix in a small pulverizer for 10 seconds and set aside.

[0038] 10 g of the mixed sample was weighed, and hot-pressed in a circular mold with a diameter of 50 mm and a heating mantle at a pressure of 200 MPa, a temperature of 300° C., and a pressing time of 20 min.

[0039] After cooling, the sample was taken out and marked as M1-1, and the thickness size distribution, thermal conductivity and mechanical properties were tested.

[0040] M1-1 is heat treated according to the curve H1, marked as M1-1-H1, and the thickness size distribution, thermal conductivity and mechanical properties are tested.

Embodiment 3

[0042] Weigh 15g of PPS (polyphenylene sulfide, Xinhecheng 11200F), 60g of corundum-type alumina particles of 300 mesh, and 25g of corundum-type alumina particles of 600 mesh. Mix in a small pulverizer for 10 seconds and set aside.

[0043] 10 g of the mixed sample was weighed, and hot-pressed in a circular mold with a diameter of 50 mm and a heating mantle at a pressure of 200 MPa, a temperature of 300° C., and a pressing time of 20 min.

[0044] After cooling, the sample was taken out, and after heat treatment according to molding H1, the sample was cut into 1.5mm thin slices with a diamond wire cutting machine (Tangshan Jingyu). Marked as M1-2-H1, testing thickness size distribution, thermal conductivity and mechanical properties.

[0045]

[0046] Such as figure 1 As shown, it is a graph of the heat treatment of the composite material body first, the ordinate is the temperature (°C), the abscissa is the time (min), the heat treatment temperature is 220°C-320°C, the pr...

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Abstract

The invention provides a processing and preparation method of a high-thermal-conductivity PCB substrate, and the processing and preparation method comprises the following steps: carrying out plasticizing molding on corundum-type alumina particles and PPS engineering resin to obtain a composite material blank, and cutting the composite material blank into sheets by adopting a diamond wire cutting technology to obtain a sheet insulating plate. According to the processing and preparation method of the high-thermal-conductivity PCB substrate, corundum type aluminum oxide particles with relatively high apparent density are adopted as a filler, so the solid density of an initial state is improved. The corundum-type aluminum oxide particles are materials obtained after crystal aluminum oxide is crushed and have compact internal structures, so that the apparent density of the corundum-type aluminum oxide particles is greatly improved compared with that of common aluminum oxide powder, and heat conduction of more than 99% of corundum phase structures of the corundum-type aluminum oxide particles is the best in all aluminum oxide.

Description

technical field [0001] The invention relates to the field of new materials, in particular to a method for processing and preparing a high thermal conductivity PCB substrate. Background technique [0002] The statements in this section only provide background information related to the present disclosure and may not constitute prior art. [0003] Printed Circuit Board (PCB), as a basic and important part of the modern electronics industry, is widely used in almost all electronic devices. [0004] At present, printed circuit boards are mainly prepared by etching. The main principle is to use copper clad laminates as raw materials. By using oxidative etching solution, under the protection of photosensitive resin, the copper foil of unnecessary parts will be removed according to the requirements of circuit design drawings. Etched and removed to form the basic circuit. Multiple such circuits are superimposed, and the substrates of epoxy materials are laminated together to form ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0011H05K3/0052
Inventor 张晓东聂锋
Owner 广州青苗新材料科技有限公司
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