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Production process of high-frequency circuit board glass fiber substrate

A glass fiber substrate, high-frequency circuit technology, applied in circuit substrate materials, printed circuits, printed circuit components, etc., can solve the problem that high-frequency circuit boards cannot be well applied, and copper clad laminates cannot be applied to the use environment and dielectric loss. High problems, to achieve the effect of uniform overall glue content, good wettability and permeability, and avoid leakage

Active Publication Date: 2021-09-17
DONGGUAN XIANGSI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The glass fiber substrate of the copper clad laminate plays a vital role in the performance of the copper clad laminate; when the operating frequency of the circuit is above 300MHz or even reaches 10GHz, the dielectric constant stability of the glass fiber substrate made by traditional production technology is relatively low. Poor, high dielectric loss, not suitable for high-frequency circuit boards, and the existing copper-clad laminates cannot be used in some harsh environments, such as maintaining stable performance in high-temperature environments

Method used

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  • Production process of high-frequency circuit board glass fiber substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Embodiment 1. The production process of the high-frequency circuit board glass fiber substrate in this embodiment includes the following steps:

[0042] Prepare dipping solution;

[0043] To make glass fiber bonding cloth, that is to dry the raw material of glass fiber cloth at least twice, and perform several dipping treatments before each drying treatment;

[0044] The glass fiber bonding cloth is cut according to the required shape and size to obtain a prepreg, and the prepreg is covered with copper foil and pressed to make a glass fiber substrate.

[0045] Dipping solution comprises dipping solution A, dipping solution B,

[0046] Dipping solution A comprises the raw material of following parts by weight:

[0047] 80 parts of epoxy modified PPO resin, 15 parts of hydrocarbon resin, 20 parts of modified cyanate resin, 10 parts of diallyl bisphenol A type benzoxazine resin, 5 parts of triallyl isocyanurate 1 part, 2 parts of curing agent, 1 part of initiator, 0.2 p...

Embodiment 2

[0068] Embodiment 2. The production process of the high-frequency circuit board glass fiber substrate in this embodiment includes the following steps:

[0069] Prepare dipping solution;

[0070] To make glass fiber bonding cloth, that is to dry the raw material of glass fiber cloth at least twice, and perform several dipping treatments before each drying treatment;

[0071] The glass fiber bonding cloth is cut according to the required shape and size to obtain a prepreg, and the prepreg is covered with copper foil and pressed to make a glass fiber substrate.

[0072] Dipping solution comprises dipping solution A, dipping solution B,

[0073] Dipping solution A comprises the raw material of following parts by weight:

[0074] 120 parts of epoxy modified PPO resin, 15 parts of hydrocarbon resin, 30 parts of modified cyanate resin, 25 parts of diallyl bisphenol A type benzoxazine resin, 15 parts of triallyl isocyanurate Parts, 5 parts of curing agent, 2 parts of initiator, 1.2...

Embodiment 3

[0095] Embodiment 3. The production process of the high-frequency circuit board glass fiber substrate in this embodiment includes the following steps:

[0096] Prepare dipping solution;

[0097] To make glass fiber bonding cloth, that is to dry the raw material of glass fiber cloth at least twice, and perform several dipping treatments before each drying treatment;

[0098] The glass fiber bonding cloth is cut according to the required shape and size to obtain a prepreg, and the prepreg is covered with copper foil and pressed to make a glass fiber substrate.

[0099] Dipping solution comprises dipping solution A, dipping solution B,

[0100] Dipping solution A comprises the raw material of following parts by weight:

[0101] 80 parts of epoxy modified PPO resin, 15 parts of hydrocarbon resin, 30 parts of modified cyanate resin, 15 parts of diallyl bisphenol A type benzoxazine resin, 5 parts of triallyl isocyanurate 2 parts, curing agent 2 parts, initiator 3 parts, accelerat...

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Abstract

The invention relates to the technical field of production of high-frequency circuit board glass fiber substrates, in particular to a production process of a high-frequency circuit board glass fiber substrate. The comprises the following steps: preparing a gum dipping solution; manufacturing the glass fiber bonding cloth, namely drying the glass fiber cloth raw material for at least two times, and carrying out gum dipping treatment for a plurality of times before each drying treatment; and cutting the glass fiber bonding cloth according to the required shape and size to obtain a prepreg, covering the prepreg with a copper foil, and pressing to obtain the glass fiber substrate. The process is simple, production and manufacturing are convenient, the glass fiber bonding cloth is good in wettability and permeability, soaking leakage can be avoided, the overall glue content is uniform, and it can be guaranteed that the overall dielectric constant is uniform; and the high-frequency circuit board glass fiber substrate has the excellent characteristics of high bonding force, high toughness, high hardness, abrasion resistance, cold and hot impact resistance, high temperature aging resistance and the like, and can be suitable for harsh use environments such as high-temperature environments.

Description

Technical field: [0001] The invention relates to the technical field of production of glass fiber substrates of high-frequency circuit boards, in particular to a production process of glass fiber substrates of high-frequency circuit boards. Background technique: [0002] Copper-clad laminates are mainly used to make printed circuit boards, and are widely used in communication equipment, mobile communications, instrumentation, satellites, radars and other products, and have gradually become one of the most important basic materials in electronic information products. With the development of electronic information technology, conventional copper-clad laminates can no longer meet the needs of high-density interconnection of electronic installations that have developed rapidly in recent years, and copper-clad laminates with high performance have attracted more and more attention. [0003] Copper-clad laminates are made of glass fiber cloth, fiber paper or glass fiber non-woven f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/04C08L71/12C08L57/02C08L79/04C08L61/34C08L83/04C08K7/14C08K5/3492B32B17/02B32B15/14B32B15/20B32B37/10H05K1/03
CPCC08J5/043B32B5/02B32B15/14B32B15/20B32B37/10H05K1/036B32B2262/103C08K7/14C08K5/34924C08J2371/12C08J2457/02C08J2479/04C08J2461/34C08J2483/04
Inventor 王振海郭智胜宁方为
Owner DONGGUAN XIANGSI ELECTRONICS TECH CO LTD
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