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Preparation method of beryllium-aluminum alloy surface composite reinforced modified layer

A beryllium-aluminum alloy and surface compounding technology is applied in the field of preparation of a beryllium-aluminum alloy surface composite strengthening and modified layer, which can solve the problems of mismatched CTE parameters of the matrix, large differences in phase electrochemical properties, and low hardness/strength, etc. Difficulty and heating power advantages, reduce usage, and ensure the effect of structural stability

Active Publication Date: 2021-10-15
MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the large difference in the phase electrochemical properties of beryllium and aluminum and the low standard electrochemical potential, there is a large difference in the oxidation film-forming ability of the two phases during surface modification processes such as conventional anodic oxidation and micro-arc oxidation, and the process is not yet available. Mature
In addition, the surface chemical coating often has problems such as low hardness / strength and mismatch with the CTE parameters of the substrate

Method used

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  • Preparation method of beryllium-aluminum alloy surface composite reinforced modified layer
  • Preparation method of beryllium-aluminum alloy surface composite reinforced modified layer
  • Preparation method of beryllium-aluminum alloy surface composite reinforced modified layer

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Embodiment 1

[0038] A method for preparing a beryllium-aluminum alloy surface composite strengthened modified layer, comprising the steps of:

[0039](1) Aluminum oxide powder and beryllium oxide powder with an average particle diameter of about 100 microns, aluminum oxide powder and beryllium oxide powder with an average particle diameter of about 100 nanometers, 20% of aluminum oxide powder, 15% of nano beryllium oxide powder, and the rest being aluminum powder Prepare in parts by weight, carry out dry ball milling and mixing in high-purity argon, the balls used in the ball milling are corundum, the weight ratio of the balls and the composite mixed powder is controlled at 1:1, the ball milling time is 2 hours, and then in high-purity argon Take out the premixed powder in the air and let it stand for later use;

[0040] (2) Grinding and polishing the surface of the beryllium aluminum alloy to be treated, ultrasonically cleaning it with analytical pure anhydrous ethanol and deionized water...

Embodiment 2

[0045] A method for preparing a beryllium-aluminum alloy surface composite strengthened modified layer, comprising the steps of:

[0046] (1) Aluminum oxide powder and beryllium oxide powder with an average particle diameter of about 150 microns, aluminum oxide powder and beryllium oxide powder with an average particle diameter of about 200 nanometers, 25% of aluminum oxide powder, 20% of nano beryllium oxide powder, and the rest being aluminum powder Prepare in parts by weight, carry out dry ball milling and mixing in high-purity argon, the balls used in ball milling are corundum, the weight ratio of balls and composite mixed powder is controlled at 1:0.8, the ball milling time is 3 hours, and then in high-purity argon Take out the premixed powder in the air and let it stand for later use;

[0047] (2) Grinding and polishing the surface of the beryllium aluminum alloy to be treated, ultrasonically cleaning it with analytical pure anhydrous ethanol and deionized water successi...

Embodiment 3

[0052] A method for preparing a beryllium-aluminum alloy surface composite strengthened modified layer, comprising the steps of:

[0053] 1) Aluminum oxide powder and beryllium oxide powder with an average particle size of about 30 microns, aluminum oxide powder and beryllium oxide powder with an average particle size of about 20 nanometers, according to the weight of aluminum oxide powder 30%, nano beryllium oxide powder 30%, and the rest being the weight of metal aluminum powder Parts preparation, dry ball milling and mixing in high-purity argon, the balls used in the ball milling are corundum, the weight ratio of the balls and the composite mixed powder is controlled at 1:1.2, the ball milling time is 5 hours, and then in high-purity argon Take out the pre-mixed powder and let it stand for later use;

[0054] (2) Grinding and polishing the surface of the beryllium aluminum alloy to be treated, ultrasonically cleaning it with analytical pure anhydrous ethanol and deionized w...

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Abstract

The invention discloses a preparation method of a beryllium oxide / aluminum oxide double-phase particle composite reinforced modification layer on the surface of a beryllium-aluminum alloy. A mode of pre-sintering ternary premixed composite powder of micron metal aluminum powder, nano aluminum oxide powder and nano beryllium oxide powder on the surface of the beryllium-aluminum alloy is adopted, and electron beam remelting and subsequent heat treatment are combined to obtain an alloy surface modification layer with high hardness and gradient distribution of strengthening phase particles. By adopting the technical route, adverse effects caused by the use of metal beryllium powder and cracking failure of the surface modification layer can be avoided, metallurgical bonding between the modification layer and an alloy matrix is realized, and the structural stability of the surface modification layer is ensured. The method is simple, convenient and feasible in process route, can effectively meet the requirement for the thermophysical property of a surface coating when the cast beryllium-aluminum alloy is used as an electronic encapsulating material, and has a good practical engineering application prospect.

Description

technical field [0001] The invention relates to the field of surface modification of non-ferrous metal materials, in particular to the surface modification and coating preparation of beryllium aluminum alloys, in particular to a method for preparing a composite strengthened modified layer on the surface of beryllium aluminum alloys. Background technique [0002] High thermal conductivity and the ability to match the coefficient of thermal expansion (CTE) of the base material are the primary performance requirements for integrated packaging materials for electronic components. In addition, the ever-growing electronic technology and industry have put forward higher and higher requirements for the density, strength, dimensional stability, damping performance and even the surface state (coating, plating, etc.) of the encapsulation material. Among the many candidate materials that meet the conditions, beryllium, copper, tungsten, and aluminum metal matrix composites have their ow...

Claims

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Application Information

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IPC IPC(8): C22F3/00C22F1/04C22F1/02
CPCC22F3/00C22F1/04C22F1/02
Inventor 杨勋刚余良波李鱼飞姚志勇纪和菲陈冬
Owner MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS
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