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Preparation method of surface coating of ceramic chopper, ceramic chopper and application of ceramic chopper

A technology of surface coating and riving knife, which is applied in the field of preparation of ceramic riving knife surface coating, can solve the problems of high price, difficulty in meeting the surface roughness requirements of ceramic riving knife, high packaging cost, etc.

Pending Publication Date: 2021-10-29
SHENZHEN SUNTECH ADVANCED CERAMICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as gold is a precious metal, it is obviously scarce and expensive, resulting in high packaging costs
With the continuous development of semiconductor bonding wires from gold to low-cost materials such as alloys and copper, higher requirements have been put forward for the bonding wire gripping ability of ceramic choppers. Traditional chemical treatment methods are difficult to meet the requirements of bonding wire gripping. Capability of Surface Roughness Requirements for Ceramic Wranglers

Method used

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  • Preparation method of surface coating of ceramic chopper, ceramic chopper and application of ceramic chopper
  • Preparation method of surface coating of ceramic chopper, ceramic chopper and application of ceramic chopper
  • Preparation method of surface coating of ceramic chopper, ceramic chopper and application of ceramic chopper

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preparation example Construction

[0023] refer to figure 1 , an embodiment of the present invention provides a method for preparing a surface coating of a ceramic capillary, including the following steps S100 and S200.

[0024] Step S100: granulating the alumina powder to obtain coating particles, the median diameter of the alumina powder is 120nm-200nm. Alumina has the characteristics of high hardness and high wear resistance, and can be used as a coating material for ceramic riving knives to prepare ceramic riving knives with high wear resistance and long service life.

[0025] In some embodiments, in step S100, the granulation treatment is plasma granulation or spray granulation. Specifically, in the embodiment of the present invention, the granulation treatment adopts plasma granulation.

[0026] In some of the embodiments, before the step S100, the method further includes: grinding and drying the dried alumina powder to obtain alumina powder.

[0027] In some of the embodiments, the median particle dia...

Embodiment 1

[0051] The manufacture process of the ceramic riving knife of the present embodiment is specifically as follows:

[0052] (1) Take alumina powder with a median particle size of 150 nm, heat it at 150° C. for 3 hours, remove moisture, and obtain dry alumina powder.

[0053] (2) Weigh each raw material according to the mass ratio of alumina powder, alumina grinding ball and absolute ethanol as 1:1:2, add it into a nylon ball mill tank, and perform high-energy ball milling at a ball milling speed of 300r / min. The ball milling time is 48 Hours; the ball-milled slurry was dried at a constant temperature of 75° C. for 24 hours to obtain alumina powder.

[0054] (3) The alumina powder is granulated in a plasma device to obtain coated particles, and the particle size of the coated particles is 20 μm.

[0055] (4) Clean the semi-finished substrate of the alumina ceramic splitter and set it aside.

[0056] (5) Coating was prepared by plasma spraying with coating particles as the raw m...

Embodiment 2

[0058] The manufacture process of the ceramic riving knife of the present embodiment is specifically as follows:

[0059] (1) Take alumina powder with a median particle size of 150 nm, heat it at 150° C. for 3 hours, remove moisture, and obtain dry alumina powder.

[0060] (2) Weigh each raw material according to the mass ratio of alumina powder, alumina grinding ball and absolute ethanol as 1:1:2, add it into a nylon ball mill tank, and perform high-energy ball milling at a ball milling speed of 300r / min. The ball milling time is 48 Hours; the ball-milled slurry was dried at a constant temperature of 75° C. for 24 hours to obtain alumina powder.

[0061] (3) The alumina powder is granulated in a plasma device to obtain coated particles, and the particle size of the coated particles is 20 μm.

[0062] (4) Clean the semi-finished substrate of the alumina ceramic splitter and set it aside.

[0063] (5) Coating was prepared by plasma spraying with coating particles as the raw m...

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Abstract

The invention relates to a preparation method of a surface coating of a ceramic chopper, the ceramic chopper and application of the ceramic chopper. The preparation method of the ceramic chopper surface coating comprises the following steps: granulating aluminum oxide powder to obtain coating particles; and carrying out plasma spraying of the coating particles onto the surface of a ceramic chopper semi-finished product to prepare the coating with the thickness of 0.04-5 [mu] m and the roughness 0.01-0.5 [mu]m. The aluminum oxide coating is formed on the surface of the ceramic chopper through the plasma spraying technology, the process parameters of plasma spraying are adjusted, the ceramic chopper with different surface roughness can be obtained, compared with traditional chemical roughening treatment, welding of different metal wires such as gold wires, silver wires and copper wires can be met, and the service life of the welding wire of the ceramic chopper is long.

Description

technical field [0001] The invention relates to the technical field of ceramic materials, in particular to a method for preparing a surface coating of a ceramic riving knife, a ceramic riving knife and applications thereof. Background technique [0002] The ceramic rivet is an axisymmetric ceramic tool with a vertical hole. Because of its advantages of high hardness, high wear resistance, high temperature resistance, chemical corrosion resistance, high surface finish and high dimensional accuracy, it is used in the field of semiconductor wire bonding welding. play an irreplaceable role. Wire bonding is the process of pasting the chip electrode face up on the package base, and connecting the chip electrode and the corresponding electrode on the lead frame with a wire by welding. The purpose of wire bonding is to electrically connect the chip with the external packaging frame to ensure the smooth transmission of electrical signals. [0003] The ceramic capillary needs to pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B41/87C04B37/02B05D5/02B05D7/24
CPCC04B41/87C04B41/5031C04B41/009C04B37/023B05D5/02B05D7/24B05D2203/30C04B41/4533C04B41/0063C04B35/10
Inventor 朱佐祥谭毅成付苒
Owner SHENZHEN SUNTECH ADVANCED CERAMICS
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