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Preparation method of nano cerium-based polishing slurry

A polishing slurry and nano-technology, applied in the preparation/treatment of rare earth metal compounds, chemical instruments and methods, polishing compositions containing abrasives, etc., can solve the problems of polishing surface damage, removal of large particles, many steps, etc., to achieve The effect of small particles, simple preparation steps, and high surface chemical activity

Inactive Publication Date: 2021-10-29
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Overall, the existing nano-cerium-based polishing slurry preparation technology has many steps and a long process, and it is difficult to completely remove large particles from the microscopic level, causing damage to the polishing surface

Method used

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  • Preparation method of nano cerium-based polishing slurry
  • Preparation method of nano cerium-based polishing slurry
  • Preparation method of nano cerium-based polishing slurry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] (1) Synthesis of nano-cerium hydroxide: Add dropwise the mixed solution of 500mL 1.2mol / L hydrogen peroxide and 1000mL1.4mol / L ammonia water to 500mL 0.8mol / L Ce(NO 3 ) 3 In the solution, the pH value of the reaction solution after the dropwise addition was 8.0, and it was a yellow-brown suspension. Continue to stir for 1.5 hours, then heat the reaction solution to 90°C and stir for 2 hours. After heating, the reaction solution gradually turns into a light yellow suspension. The solid and liquid were separated by filtration, and the solid was washed with deionized water until the filtrate was neutral to obtain nanometer cerium hydroxide.

[0023] (2) Preparation of polishing slurry: ultrasonically disperse the obtained nano-cerium hydroxide in 2L deionized water, wherein the content of cerium hydroxide (in terms of molar concentration) is 0.2mol / L, and add 20mL 2mol / L hydrogen peroxide under stirring conditions, Then a certain amount of 0.8 mol / L ammonia solution was a...

Embodiment 2

[0025] (1) Synthesis of nano-cerium hydroxide: Add dropwise the mixed solution of 500mL 0.55mol / L hydrogen peroxide and 1000mL0.72mol / L ammonia water to 500mL 0.4mol / L Ce(NO 3 ) 3 In the solution, the pH value of the reaction solution after the dropwise addition was 8.4, and it was a yellow-brown suspension. Continue to stir for 1 hour, then heat the reaction solution to 90°C and stir for 2 hours. The solid and liquid were separated, and the solid was washed with deionized water until the filtrate was neutral to obtain nanometer cerium hydroxide.

[0026] (2) Preparation of polishing slurry: ultrasonically disperse the obtained nanometer cerium hydroxide in 2L deionized water, wherein the content of cerium hydroxide (in terms of molar concentration) is 0.1mol / L, add 10mL 2mol / L hydrogen peroxide under stirring condition, Then a certain amount of 1 mol / L sodium hydroxide solution was added dropwise to adjust the pH value of the slurry to 9.0 to obtain a cerium-based polishing ...

Embodiment 3

[0028] (1) Synthesis of nano-cerium hydroxide: Add dropwise a mixed solution of 500mL 0.75mol / L hydrogen peroxide and 1000mL1.7mol / L ammonia water to 500mL 1.0mol / L Ce(NO 3 ) 3 In the solution, the pH value of the reaction solution after the dropwise addition was 8.5, and it was an orange-yellow suspension. Continue to stir for 2 hours, then heat the reaction solution to 90°C and stir for 3 hours. After heating, the reaction solution gradually turns into a light yellow suspension. The solid and liquid were separated, and the solid was washed with deionized water until the filtrate was neutral to obtain nanometer cerium hydroxide.

[0029] (2) Preparation of polishing slurry: ultrasonically disperse the obtained nano-cerium hydroxide in 2L of deionized water, wherein the content of cerium hydroxide (in terms of molar concentration) is 0.25mol / L, and add 40mL of 2mol / L hydrogen peroxide under stirring conditions, Then a certain amount of 0.8 mol / L ammonia solution was added dro...

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Abstract

The invention provides a preparation method of nano cerium-based polishing slurry. Nano cerium hydroxide (Ce (OH) 4) synthesized by an oxidation precipitation method is used as abrasive particles, the steps of drying, firing and the like are not needed, dispersion and slurry blending are directly carried out, the chemical removal effect is enhanced by means of adding hydrogen peroxide, adjusting the pH value of slurry and the like, and high-speed polishing of glass can be realized. The primary particle size of the synthesized nano cerium hydroxide abrasive particle is 3-10nm, the nano cerium hydroxide abrasive particle has high surface chemical activity, and the nano cerium hydroxide abrasive particle and hydrogen peroxide can be subjected to the following surface chemical reaction: Ce (OH) 4 + H2O2 = Ce (OH) 3OOH + H2O to generate hydrogen peroxide cerium oxide (Ce (OH) 3OOH) with high oxidability on the surface, so that the chemical removal effect of the nano cerium hydroxide abrasive particle serving as a polishing abrasive particle is enhanced. The preparation method of the nano cerium-based polishing slurry is short in process, the obtained polishing slurry is good in suspension stability, and a dispersing agent does not need to be added.

Description

technical field [0001] The invention belongs to the technical field of high-precision processing of glass substrates, integrated circuits and optical glass surfaces required by electronic information and mobile photography, and specifically relates to the preparation and application technology of a class of cerium-based nano oxides and their polishing slurry. Background technique [0002] Chemical mechanical polishing (CMP) is one of the most effective planarization techniques in high-precision optical devices and VLSI manufacturing technologies. In the CMP process, the workpiece acts on the rotating polishing pad with a certain pressure, and the polishing slurry composed of fine abrasive particles and chemical solution flows between the workpiece and the polishing pad, and produces chemical reactions. The chemical reactants generated on the surface of the workpiece are formed by The mechanical removal of abrasive particles, that is, the planarization of the surface is achie...

Claims

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Application Information

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IPC IPC(8): C09G1/02C01F17/10C01F17/20C01F17/235
CPCC09G1/02C01F17/10C01F17/20C01F17/235C01P2002/72C01P2002/88C01P2002/01C01P2004/04
Inventor 李静王学亮周雪珍李永绣郭桂花
Owner NANCHANG UNIV