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Curable resin composition

A technology of curable resin and composition, which is applied in the fields of electric solid-state devices, chemical instruments and methods, semiconductor/solid-state device components, etc. It can solve the problems of unreachable and achieve excellent heat resistance and dielectric properties.

Pending Publication Date: 2021-12-03
DIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, although the heat resistance and dielectric properties of the cured product of the resin composition described in the aforementioned Patent Document 1 are somewhat improved, regarding the heat resistance, there is no up to the level required in recent years

Method used

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  • Curable resin composition
  • Curable resin composition
  • Curable resin composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0118]

[0119] The curable resin composition of the present invention is characterized by containing: a maleimide (A) having an indane skeleton (hereinafter, sometimes referred to as "component (A)") and a polyphenylene compound having a reactive double bond. Ether compound (B) (Hereinafter, it may be referred to as "(B) component."). It is a preferable embodiment that the component (B) can undergo three-dimensional crosslinking by reaction with the component (A) and can obtain a cured product excellent in dielectric properties and heat resistance.

[0120] As the compounding ratio (parts by mass) of the above-mentioned (A) component and the above-mentioned (B) component, (A) component: (B) component is preferably 90:10 to 10:90, more preferably 80:20 to 20:80 , more preferably 65:35 to 35:65, particularly preferably 55:45 to 45:55. By adjusting the compounding ratio to the above-mentioned range, heat resistance, low dielectric constant, and low dielectric loss tangent are...

Embodiment

[0157] Next, the present invention will be described concretely with reference to Examples and Comparative Examples. Hereinafter, "parts" and "%" are based on mass unless otherwise specified. In addition, softening point, amine equivalent, GPC, and FD-MS spectrum were measured and evaluated under the following conditions.

[0158] 1) softening point

[0159] Measuring method: According to JIS K7234 (ring and ball method), the softening point (°C) of the intermediate amine compound obtained in the synthesis example shown below was measured.

[0160] 2) Amine equivalent

[0161] The amine equivalent of the intermediate amine compound was measured by the following measuring method.

[0162] After accurately weighing about 2.5 g of intermediate amine compounds, 7.5 g of pyridine, 2.5 g of acetic anhydride, and 7.5 g of triphenylphosphine as samples in a 500 mL Erlenmeyer flask with a stopper, install a condenser and set it at 120°C Heated to reflux in an oil bath for 150 minute...

Synthetic example 1

[0201] [Synthesis Example 1] Synthesis of Maleimide Compound A-1

[0202] (1) Synthesis of intermediate amine compounds

[0203] Put 48.5g (0.4mol) of 2,6-dimethylaniline, α,α'-dihydroxy-1 , 272.0g (1.4mol) of 3-diisopropylbenzene, 280g of xylene and 70g of activated clay were heated to 120°C while stirring. Furthermore, distilled water was removed with a Dean-Stark tube, the temperature was raised to 210° C., and the reaction was performed for 3 hours. Then, after cooling to 140 degreeC and throwing in 145.4 g (1.2 mol) of 2, 6- dimethyl aniline, it heated up to 220 degreeC, and performed reaction for 3 hours. After the reaction, the air was cooled to 100° C., diluted with 300 g of toluene, the activated clay was removed by filtration, and low molecular weight substances such as solvent and unreacted substances were distilled off under reduced pressure to obtain the following general formula (A-1 ) intermediate amine compound 364.1g. The amine equivalent is 298, and the s...

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Abstract

Provided are: a curable resin composition in which a combination of dielectric characteristics and excellent heat resistance are provided in a cured material thereof; a cured material of the curable resin composition; a prepreg, a circuit substrate, a build-up film, and a semiconductor sealing material in which the above properties are combined; and a semiconductor device. This curable resin composition is characterized by containing a maleimide (A) having an indane skeleton, and a polyphenylene ether compound (B) having a reactive double bond.

Description

technical field [0001] The present invention relates to a curable resin composition, a cured product obtained from the curable resin composition, a prepreg, a circuit board, a laminate film, a semiconductor sealing material, and a semiconductor device. Background technique [0002] As a material for circuit boards for electronic equipment, it is widely used: epoxy resins, BT (bismaleimide-triazine) resins and other thermosetting resins are impregnated into glass cloth and heated and dried. A prepreg, a laminate obtained by heat-curing the prepreg, and a multilayer board obtained by combining the laminate and the prepreg and heat-cured. Among them, semiconductor package substrates are gradually becoming thinner, and warping of the package substrate during mounting becomes a problem. In order to suppress this, materials exhibiting high heat resistance are required. [0003] In addition, in recent years, high-speed and high-frequency signals have been increased, and it is desi...

Claims

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Application Information

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IPC IPC(8): C08F290/06H01L23/29H01L23/31C08J5/24B32B15/08B32B15/088H05K1/03
CPCB32B15/08B32B15/088C08F290/06H01L23/29H01L23/31H05K1/03C08J5/244C08F290/062B32B15/20H05K1/0366B32B2311/12B32B2457/08
Inventor 下野智弘冈本竜也
Owner DIC CORP