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Resin composition, prepreg, circuit board and printed circuit board

A technology of resin composition and curing agent, which is applied in the direction of circuit substrate materials, printed circuits, printed circuit components, etc., can solve the problem of high water absorption rate of circuit substrates, moisture absorption degradation of dielectric properties, difficulty in meeting the requirements of crosslinking density of resin systems, Problems such as poor thermal performance of the circuit substrate, to achieve the effect of easy control of the preparation process, ensuring stability and reliability, and excellent heat resistance

Pending Publication Date: 2021-12-17
ZHEJIANG WAZAM NEW MATERIAL CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the one hand, the amide group inherent in the molecular structure of TAIC is a hydrophilic group and is easy to hydrolyze, so it has strong hygroscopicity, resulting in a high water absorption rate of the circuit substrate and serious hygroscopic degradation of the dielectric properties, which affects the reliability of the board; On the other hand, TAIC is volatile, which makes it difficult for the crosslinking density of the resin system to meet the requirements, resulting in poor thermal properties such as the glass transition temperature (Tg) of the circuit substrate or poor batch stability

Method used

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  • Resin composition, prepreg, circuit board and printed circuit board
  • Resin composition, prepreg, circuit board and printed circuit board
  • Resin composition, prepreg, circuit board and printed circuit board

Examples

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Embodiment 1

[0072] Referring to Table 1, get 100 parts by weight of the first polyphenylene ether resin, 70 parts by weight of the first polysiloxane curing agent, 50 parts by weight of the first hydrocarbon resin, 40 parts by weight of hypophosphite, 0.086 parts by weight Dicumyl peroxide, 140 parts by weight of silicon dioxide and 215 parts by weight of toluene solvent were added into a container equipped with a stirrer and a condenser at room temperature to prepare a resin composition.

[0073] The above resin composition is coated on the E-type glass cloth, and after baking in an oven at 170°C, a prepreg is obtained. The glue content in the prepreg is 50%, and the formula for calculating the glue content is: glue content=(prepreg The quality of - E-type glass cloth quality) × 100% / the quality of the prepreg.

[0074] Stack six prepregs to obtain a prepreg layer, cover both sides of the prepreg layer with copper foil with a thickness of 1 oz, place it in a vacuum hot press, and press...

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Abstract

The invention relates to a resin composition, a prepreg, a circuit board and a printed circuit board. The resin composition comprises carbon-carbon conjugated group-terminated polyphenyl ether resin, carbon-carbon double bond-containing hydrocarbon resin, a polysiloxane curing agent and a solvent, wherein the structure of the polysiloxane curing agent is shown as a formula (I), in the formula (I), m is an integer of 1-20, R1 is a first alkyl group with a carbon chain length of 1-12, R2 is hydrogen or a second alkyl group with a carbon chain length of 1-12, and at least one of R1 or R2 contains an alkenyl active functional group. The polysiloxane curing agent in the resin composition is not easy to volatilize, so that the stable performance of circuit substrates prepared in different batches can be ensured; moreover, the polysiloxane curing agent does not contain hydrophilic groups and cannot be hydrolyzed, so that in the use process of the circuit substrate, the hygroscopicity of the circuit substrate can be effectively reduced, and the dielectric property of the circuit substrate can be prevented from being degraded due to moisture absorption.

Description

technical field [0001] The invention relates to the technical field of electronic industry, in particular to a resin composition, a prepreg, a circuit substrate and a printed circuit board. Background technique [0002] In the 5G era, in order to maintain the transmission rate and maintain the integrity of the transmission signal, the circuit substrate needs to have a low dielectric constant and dielectric loss. However, the resin system of the traditional circuit board is a polyphenylene ether resin system, and the curing crosslinking agent used is triallyl isocyanurate (TAIC). On the one hand, the amide group inherent in the molecular structure of TAIC is a hydrophilic group and is easy to hydrolyze, so it has strong hygroscopicity, resulting in a high water absorption rate of the circuit substrate and serious hygroscopic degradation of the dielectric properties, which affects the reliability of the board; On the other hand, TAIC is volatile, which makes it difficult for ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L83/07C08L47/00H05K1/03
CPCC08L71/126C08L83/04H05K1/036H05K1/0353C08L2203/20C08L47/00
Inventor 王亮任英杰董辉俞高
Owner ZHEJIANG WAZAM NEW MATERIAL CO LTD
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