Resin composition, prepreg, circuit board and printed circuit board

Abstract

The invention relates to a resin composition, a prepreg, a circuit board and a printed circuit board. The resin composition comprises carbon-carbon conjugated group-terminated polyphenyl ether resin, carbon-carbon double bond-containing hydrocarbon resin, a polysiloxane curing agent and a solvent, wherein the structure of the polysiloxane curing agent is shown as a formula (I), in the formula (I), m is an integer of 1-20, R1 is a first alkyl group with a carbon chain length of 1-12, R2 is hydrogen or a second alkyl group with a carbon chain length of 1-12, and at least one of R1 or R2 contains an alkenyl active functional group. The polysiloxane curing agent in the resin composition is not easy to volatilize, so that the stable performance of circuit substrates prepared in different batches can be ensured; moreover, the polysiloxane curing agent does not contain hydrophilic groups and cannot be hydrolyzed, so that in the use process of the circuit substrate, the hygroscopicity of the circuit substrate can be effectively reduced, and the dielectric property of the circuit substrate can be prevented from being degraded due to moisture absorption.

Description

technical field [0001] The invention relates to the technical field of electronic industry, in particular to a resin composition, a prepreg, a circuit substrate and a printed circuit board. Background technique [0002] In the 5G era, in order to maintain the transmission rate and maintain the integrity of the transmission signal, the circuit substrate needs to have a low dielectric constant and dielectric loss. However, the resin system of the traditional circuit board is a polyphenylene ether resin system, and the curing crosslinking agent used is triallyl isocyanurate (TAIC). On the one hand, the amide group inherent in the molecular structure of TAIC is a hydrophilic group and is easy to hydrolyze, so it has strong hygroscopicity, resulting in a high water absorption rate of the circuit substrate and serious hygroscopic degradation of the dielectric properties, which affects the reliability of the board; On the other hand, TAIC is volatile, which makes it difficult for ...

AI Technical Summary

Problems solved by technology

On the one hand, the amide group inherent in the molecular structure of TAIC is a hydrophilic group and is easy to hydrolyze, so it has strong hygroscopicity, resulting in a high water absorption rate of the circuit substrate and serious hygroscopic degradation of the dielectric properties, which affects the reliability of the board; On the other hand, TAIC is volatile, which makes it difficult for the crosslinking density of the resin system to meet the requirements, resulting in poor thermal properties such as the glass transition temperature (Tg) of the circuit substrate or poor batch stability

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