Method for reducing roughness of copper foil and copper foil product thereof

Abstract

The invention discloses a method for reducing the roughness of a copper foil and a copper foil product thereof. The method comprises the following steps: 1) preparing a polishing solution; 2) treating the copper foil to be polished; 3) performing electrochemical polishing; and 4) performing cleaning, specifically, cleaning the large-grain-size copper foil subjected to electrochemical polishing, and then performing drying treatment to obtain the copper foil product with reduced roughness. The method for reducing the roughness of the copper foil provided by the invention is simple in process and simple and effective to operate; the large-grain-size copper foil formed by annealing a polycrystalline copper foil is polished by an electrochemical polishing technology; and the polishing solution is formed by mixing strong phosphoric acid and ethylene glycol, so that the used raw materials are few in variety, low in cost, small in environmental pollution and good in polishing effect. The copper foil product obtained by polishing by the method for reducing the roughness of the copper foil has the surface roughness of 1-2 nm, which is reduced by more than 10 times compared with that before treatment, has high finish degree and a good mirror effect, and meets the application of the ultra-smooth copper foil market.

Description

technical field [0001] The invention relates to the technical field of copper foil polishing, in particular to a method for reducing the roughness of copper foil and a copper foil product thereof. Background technique [0002] Copper is a non-ferrous metal closely related to human beings and one of the earliest metal materials used in human history. Copper is rich in natural mineral deposits, has good electrical conductivity, thermal conductivity, extensibility, corrosion resistance and other properties, and is widely used in electric power, electronics, energy petrochemical, transportation, machinery and metallurgical industries, light industry, emerging industries and high-tech fields . Copper and its alloys also play a pivotal role in cutting-edge technologies, such as integrated circuits, large-scale integrated circuits, superconducting electromagnets, nuclear fusion devices, shape memory alloys, etc. Ideal material choice for the application. [0003] Single crystal ...

AI Technical Summary

Problems solved by technology

Because the thickness of the foil is at the micron level, the labor intensity of mechanical polishing is high, the pollution is serious, and it is difficult to polish materials with complex shapes, and the gloss retention time is short

Chemical polishing includes acid polishing and alkaline polishing. The polishing rate is fast but not easy to control, and there is gas overflow that seriously pollutes the environment

To reduce the traces after rolling, the traditional surface polishing process, such as mechanical polishing and chemical polishing, cannot meet the lower roughness, so it is necessary to adopt a better electrochemical polishing process

[0005] Publication No. "CN107937977A", an invention patent titled "A cathode roller electrolytic polishing solution and polishing method", discloses a cathode roller electrolytic polishing solution and a polishing method. The electrolytic polishing solution is composed of two or more NH 4 HF 2 、NaNO 3 、HNO 3 、H 2 SO 4 , (CH 2 Oh) 2 The solution is mixed, the acid content is generally high, the acidity is strong, it is easy to cause corrosion of the workpiece to be polished, the operation is difficult, and the operating temperature is high, it is easy to generate acid mist, which has a certain impact on the production environment

[0006] Publication No. "CN105390384B", an invention patent titled "A Method for Removing Silicon Dioxide During Stress-Free Electrochemical Polishing of Copper", discloses a method for removing silicon dioxide during stress-free electrochemical polishing of copper. The combination of the copper chemical mechanical polishing method and the new copper stress-free electrochemical polishing method has many steps and relatively troublesome operation.

[0007] Publication No. "CN105603518A", an invention patent titled "A Method for Converting Polycrystalline Copper Foil into Single Crystal Cu(100)", discloses that the concentration of phosphoric acid in the polishing solution is as high as 98%, and the polishing time is longer. Low polishing efficiency

In the article "Research on Electrochemical Polishing of Copper in Phosphoric Acid Solution" figure 2 It can be seen from the change trend of the roughness after copper polishing with the concentration of phosphoric acid that using phosphoric acid as the main component of the electrochemical polishing solution, the minimum roughness of the polishing is only 30nm; , easy to wrinkle, difficult to protect product quality

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