A kind of preparation method of active metal brazing copper-clad ceramic substrate

A copper-clad ceramic substrate and active metal technology, which is applied in the field of ceramic metallization, can solve the problems of high vacuum degree and high interface void rate, and achieve the effects of stable bonding, reduced void rate, and enhanced adhesion firmness

Active Publication Date: 2022-03-22
GUANGZHOU XIANYI ELECTRONICS TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to overcome the defects and deficiencies of high vacuum requirements and high interfacial voids in the preparation process of the existing active metal brazing copper-clad ceramic substrates, and provide an active metal that reduces vacuum requirements and effectively reduces voids. Batch preparation method of brazed copper-clad ceramic substrate

Method used

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  • A kind of preparation method of active metal brazing copper-clad ceramic substrate
  • A kind of preparation method of active metal brazing copper-clad ceramic substrate
  • A kind of preparation method of active metal brazing copper-clad ceramic substrate

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Embodiment 1

[0049] The preparation of embodiment 1 AMB copper clad ceramic substrate

[0050] The preparation method of described AMB copper clad ceramic substrate comprises the following steps:

[0051] S1. Printing solder paste: dissolve 40wt% binder (halogen-free low-temperature modified rosin) and 3wt% thixotropic agent (hydrogenated castor oil) in 57 wt% diethylene glycol monobutyl ether: terpineol=7 Prepare paste raw material in the mixed solvent of 3, with 15 wt% paste raw material and 85 wt% metal powder (5wt% particle diameter is the nanometer silver powder+65wt% micron silver powder+28wt% copper powder of 50~100 nm) 2wt% titanium hydride powder) mixed and stirred to prepare silver-copper-titanium active solder paste, and then print silver-copper-titanium active solder paste with a thickness of 0.1mm on the surface of the copper plate;

[0052] S2. Degreasing treatment: Put the copper plate printed with silver-copper-titanium active solder paste obtained in step S1 into an atmosph...

Embodiment 2

[0056] Embodiment 2 Preparation of AMB copper-clad ceramic substrate

[0057] S1. Printing solder paste: dissolve 40wt% binder (halogen-free low-temperature modified rosin) and 4wt% thixotropic agent (polyurea) in 56wt% diethylene glycol monobutyl ether: terpineol = 7:3 Prepare the paste raw material in the mixed solvent of 15 wt% paste raw material and 85wt% metal powder (10 wt% particle size is the nano-silver powder+61 wt% micro-silver powder+26 wt% copper powder+ 3wt% titanium hydride powder) mixed and stirred to prepare silver-copper-titanium active solder paste, and then print silver-copper-titanium active solder paste with a thickness of 0.2mm on the surface of the copper plate;

[0058] S2. Degreasing treatment: Put the copper plate printed with silver-copper-titanium active solder paste obtained in step S1 into an atmosphere tube furnace, raise the temperature to 130°C at a rate of 3-5°C per minute under a nitrogen atmosphere, and keep it for 20 minutes to volatilize ...

Embodiment 3

[0062] Embodiment 3 Preparation of AMB copper-clad ceramic substrate

[0063] S1. Printing solder paste: Dissolve 40wt% binder (acrylic resin) and 2wt% thixotropic agent (polyurea) in 58 wt% diethylene glycol monobutyl ether: terpineol = 7:3 mixed solvent Prepare the paste raw material in , with 15 wt% paste raw material and 85 wt% metal powder (30 wt% particle diameter is the silver-copper of the nanometer silver powder+35 wt% micron silver powder+32 wt% silver copper of 200~500nm (Ag:Cu =1:1) alloy powder + 3 wt% titanium hydride powder) mixed and stirred to prepare silver-copper-titanium active solder paste, and then print silver-copper-titanium active solder paste with a thickness of 0.3mm on the surface of the copper plate;

[0064] S2. Degreasing treatment: Put the copper plate printed with silver-copper-titanium active solder paste obtained in step S1 into an atmosphere tube furnace, raise the temperature to 130°C at a rate of 3-5°C per minute under a nitrogen atmospher...

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Abstract

The invention belongs to the technical field of ceramic metallization, and in particular relates to a method for preparing a copper-clad ceramic substrate by active metal brazing; comprising: printing silver-copper-titanium active solder paste on one side of the copper plate; heating and degreasing the copper plate and the upper and lower surfaces of the ceramic plate Laminated to form a sandwich structure, the copper plate in the sandwich structure is attached with silver-copper-titanium active solder (after degreasing, the organic components of the silver-copper-titanium active solder paste are removed and transformed into powder or block silver-copper-titanium active solder) and ceramics The upper and lower sides of the board are in contact; heat-conducting materials are vacuum-packed and brazed at high temperature; the present invention adds nano-silver powder with great surface activity to the silver-copper-titanium active solder paste, thereby enhancing the solder paste on the copper plate after degreasing. Adhesion firmness: heat-conducting materials are used for vacuum packaging to adjust the vacuum degree, brazing can be completed with conventional equipment, and at the same time, the void rate of the interface can be effectively reduced, and the combination of ceramics and copper plates is more stable.

Description

technical field [0001] The invention belongs to the technical field of ceramic metallization. More specifically, it relates to a method for preparing an active metal brazing copper-clad ceramic substrate. Background technique [0002] Copper-clad ceramic substrates have both excellent electrical conductivity and insulation properties. They are important materials for packaging power devices in the field of power electronics, and are generally used as substrates for chips. The active metal brazing (AMB) process used in the preparation of copper-clad ceramic substrates is one of the important production processes for ceramic metallization, especially for non-oxide ceramics AlN, Si 3 N 4 , which uses active solder to braze the ceramic plate and metal copper foil together, and the combination reliability is obviously better than other metallization processes. [0003] Silver-copper-titanium active solder is a commonly used active solder. There are two types of silver-copper-t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/00B23K1/20B23K3/08H01L21/48
CPCB23K1/0008B23K1/20B23K3/08H01L21/4846
Inventor 陈卫民李文涛
Owner GUANGZHOU XIANYI ELECTRONICS TECH
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