Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Gold-plated palladium-copper-based bonding wire and preparation method thereof

A technology of bonding wire and palladium copper, which is applied in the field of bonding wire, can solve problems such as high coating thickness on the surface of bonding wire, coating shedding, and short coordinated deformation process, so as to improve bonding adhesion, increase contact area, and improve contact area effect

Active Publication Date: 2022-02-01
江西蓝微电子科技有限公司
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, there are still some problems in the production and use of composite bonding wires. In the production process of composite bonding wires that have been reported so far, most of the core material ingots are drawn to filaments with a diameter of less than 1 mm or even a diameter of less than 100 μm. Then electroplating or vacuum plating is carried out on the surface of the core busbar to prepare the cladding layer. The disadvantages of this processing method are: firstly, the continuous electroplating or vacuum plating process used is costly, the filament plating efficiency is low, and the electroplating The liquid usually contains toxic cyanide and other substances, which is not conducive to environmental protection; secondly, during the process of drawing the filament to the product size after plating, the coordinated deformation process experienced by the plating layer and the core material is relatively short, which makes the interface bonding force between the two insufficient , at the same time, due to the compactness of the coating obtained by electroplating or vacuum plating and the poor combination with the core material, the coating is prone to fall off during drawing or use; again, the thinner the diameter of the wire used in the coating, the smaller the initial coating. The higher the unevenness of the coating thickness on the surface of the final bonding wire caused by the uneven thickness, the more inconsistent the performance of the bonding wire. combined quality reduction

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A gold-plated palladium-copper-based bonding wire is characterized in that it is prepared from the following materials in weight percentage: 93% copper, 0.006% platinum, 0.005% cerium, 6.089% gold and 0.9% palladium.

[0034] In a further step, the copper-based bonding wire is composed of the base material copper, platinum and cerium are added to form a master alloy substrate, and the surface of the fine metal wire made of the master alloy substrate is plated with gold and then palladium-plated to form the copper-based bonding wire .

[0035] Further, the purity of the copper is higher than 99.99%.

[0036] Further, the purity of the gold is higher than 99.99%.

[0037] This embodiment also discloses a preparation method of the gold-plated palladium-copper-based bonding wire as described in any one of the above, the preparation method comprising the following steps,

[0038] (1) Put copper, platinum, and cerium into a high-purity graphite crucible after mechanically m...

Embodiment 2

[0050] A gold-plated palladium-copper-based bonding wire is characterized in that it is prepared from the following materials in weight percentage: 92% copper, 0.005% platinum, 0.004% cerium, 7.591% gold, and 0.4% palladium.

[0051] In a further step, the copper-based bonding wire is composed of the base material copper, platinum and cerium are added to form a master alloy substrate, and the surface of the fine metal wire made of the master alloy substrate is plated with gold and then palladium-plated to form the copper-based bonding wire .

[0052]Further, the purity of the copper is higher than 99.99%.

[0053] Further, the purity of the gold is higher than 99.99%.

[0054] This embodiment also discloses a preparation method of the gold-plated palladium-copper-based bonding wire as described in any one of the above, the preparation method comprising the following steps,

[0055] (1) Put copper, platinum, and cerium into a high-purity graphite crucible after mechanically m...

Embodiment 3

[0067] A gold-plated palladium-copper-based bonding wire is characterized in that it is prepared from the following materials in weight percentage: 90.3% copper, 0.005% platinum, 0.003% cerium, 9% gold, and 0.692% palladium.

[0068] In a further step, the copper-based bonding wire is composed of the base material copper, platinum and cerium are added to form a master alloy substrate, and the surface of the fine metal wire made of the master alloy substrate is plated with gold and then palladium-plated to form the copper-based bonding wire .

[0069] Further, the purity of the copper is higher than 99.99%.

[0070] Further, the purity of the gold is higher than 99.99%.

[0071] This embodiment also discloses a preparation method of the gold-plated palladium-copper-based bonding wire as described in any one of the above, the preparation method comprising the following steps,

[0072] (1) Put copper, platinum, and cerium into a high-purity graphite crucible after mechanically ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a gold-plated palladium-copper-based bonding wire. The wire is prepared from the following materials in percentage by weight: 90%-93% of copper, 0.005%-0.006% of platinum, 0.001%-0.005% of cerium, 6%-9% of gold and 0.4%-0.9% of palladium. According to the copper-based bonding wire, platinum and cerium are added into a base material copper, so that a master alloy base material can be formed, and gold is plated on the surface of a fine metal wire made of the master alloy base material, and the surface of the fine metal wire is plated with the palladium, so that the copper-based bonding wire can be formed. The base material of the master alloy is well combined with a plating layer, and the plating layer is not easy to fall off.

Description

technical field [0001] The invention relates to the technical field of bonding wires, in particular to a gold-plated palladium-copper-based bonding wire and a preparation method thereof. Background technique [0002] Semiconductor packaging in integrated circuits requires the use of a key material - Bonding Wires. The rapid development of the electronics industry has promoted the rapid development of bonding wire manufacturing technology. Bonding wire is a fine-diameter high-tensile-strength metal wire, which is an essential package inner lead in the manufacturing process of integrated circuits, semiconductor discrete devices and LED light-emitting tubes. The common ones are alloy bonding wire, copper bonding wire, aluminum bonding wire, gold bonding wire, etc. The characteristics required for bonding wires are corrosion resistance, conductivity, good connectivity, and fast bonding speed. [0003] However, there are still some problems in the production and use of composit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48C21D9/52C22C1/02C22C9/00C22F1/02C22F1/08C23C18/42C23C28/02C25D3/48C25D7/06
CPCH01L23/49H01L21/4885C22C9/00C22C1/02C25D7/0607C25D3/48C23C18/42C23C28/023C22F1/08C21D9/525C22F1/02
Inventor 彭庶瑶彭晓飞
Owner 江西蓝微电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products