Gold-plated palladium-copper-based bonding wire and preparation method thereof

Abstract

The invention discloses a gold-plated palladium-copper-based bonding wire. The wire is prepared from the following materials in percentage by weight: 90%-93% of copper, 0.005%-0.006% of platinum, 0.001%-0.005% of cerium, 6%-9% of gold and 0.4%-0.9% of palladium. According to the copper-based bonding wire, platinum and cerium are added into a base material copper, so that a master alloy base material can be formed, and gold is plated on the surface of a fine metal wire made of the master alloy base material, and the surface of the fine metal wire is plated with the palladium, so that the copper-based bonding wire can be formed. The base material of the master alloy is well combined with a plating layer, and the plating layer is not easy to fall off.

Description

technical field [0001] The invention relates to the technical field of bonding wires, in particular to a gold-plated palladium-copper-based bonding wire and a preparation method thereof. Background technique [0002] Semiconductor packaging in integrated circuits requires the use of a key material - Bonding Wires. The rapid development of the electronics industry has promoted the rapid development of bonding wire manufacturing technology. Bonding wire is a fine-diameter high-tensile-strength metal wire, which is an essential package inner lead in the manufacturing process of integrated circuits, semiconductor discrete devices and LED light-emitting tubes. The common ones are alloy bonding wire, copper bonding wire, aluminum bonding wire, gold bonding wire, etc. The characteristics required for bonding wires are corrosion resistance, conductivity, good connectivity, and fast bonding speed. [0003] However, there are still some problems in the production and use of composit...

AI Technical Summary

Problems solved by technology

[0003] However, there are still some problems in the production and use of composite bonding wires. In the production process of composite bonding wires that have been reported so far, most of the core material ingots are drawn to filaments with a diameter of less than 1 mm or even a diameter of less than 100 μm. Then electroplating or vacuum plating is carried out on the surface of the core busbar to prepare the cladding layer. The disadvantages of this processing method are: firstly, the continuous electroplating or vacuum plating process used is costly, the filament plating efficiency is low, and the electroplating The liquid usually contains toxic cyanide and other substances, which is not conducive to environmental protection; secondly, during the process of drawing the filament to the product size after plating, the coordinated deformation process experienced by the plating layer and the core material is relatively short, which makes the interface bonding force between the two insufficient , at the same time, due to the compactness of the coating obtained by electroplating or vacuum plating and the poor combination with the core material, the coating is prone to fall off during drawing or use; again, the thinner the diameter of the wire used in the coating, the smaller the initial coating. The higher the unevenness of the coating thickness on the surface of the final bonding wire caused by the uneven thickness, the more inconsistent the performance of the bonding wire. combined quality reduction