Gold-plated palladium-copper-based bonding wire and preparation method thereof
A technology of bonding wire and palladium copper, which is applied in the field of bonding wire, can solve problems such as high coating thickness on the surface of bonding wire, coating shedding, and short coordinated deformation process, so as to improve bonding adhesion, increase contact area, and improve contact area effect
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Embodiment 1
[0033] A gold-plated palladium-copper-based bonding wire is characterized in that it is prepared from the following materials in weight percentage: 93% copper, 0.006% platinum, 0.005% cerium, 6.089% gold and 0.9% palladium.
[0034] In a further step, the copper-based bonding wire is composed of the base material copper, platinum and cerium are added to form a master alloy substrate, and the surface of the fine metal wire made of the master alloy substrate is plated with gold and then palladium-plated to form the copper-based bonding wire .
[0035] Further, the purity of the copper is higher than 99.99%.
[0036] Further, the purity of the gold is higher than 99.99%.
[0037] This embodiment also discloses a preparation method of the gold-plated palladium-copper-based bonding wire as described in any one of the above, the preparation method comprising the following steps,
[0038] (1) Put copper, platinum, and cerium into a high-purity graphite crucible after mechanically m...
Embodiment 2
[0050] A gold-plated palladium-copper-based bonding wire is characterized in that it is prepared from the following materials in weight percentage: 92% copper, 0.005% platinum, 0.004% cerium, 7.591% gold, and 0.4% palladium.
[0051] In a further step, the copper-based bonding wire is composed of the base material copper, platinum and cerium are added to form a master alloy substrate, and the surface of the fine metal wire made of the master alloy substrate is plated with gold and then palladium-plated to form the copper-based bonding wire .
[0052]Further, the purity of the copper is higher than 99.99%.
[0053] Further, the purity of the gold is higher than 99.99%.
[0054] This embodiment also discloses a preparation method of the gold-plated palladium-copper-based bonding wire as described in any one of the above, the preparation method comprising the following steps,
[0055] (1) Put copper, platinum, and cerium into a high-purity graphite crucible after mechanically m...
Embodiment 3
[0067] A gold-plated palladium-copper-based bonding wire is characterized in that it is prepared from the following materials in weight percentage: 90.3% copper, 0.005% platinum, 0.003% cerium, 9% gold, and 0.692% palladium.
[0068] In a further step, the copper-based bonding wire is composed of the base material copper, platinum and cerium are added to form a master alloy substrate, and the surface of the fine metal wire made of the master alloy substrate is plated with gold and then palladium-plated to form the copper-based bonding wire .
[0069] Further, the purity of the copper is higher than 99.99%.
[0070] Further, the purity of the gold is higher than 99.99%.
[0071] This embodiment also discloses a preparation method of the gold-plated palladium-copper-based bonding wire as described in any one of the above, the preparation method comprising the following steps,
[0072] (1) Put copper, platinum, and cerium into a high-purity graphite crucible after mechanically ...
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