Copper surface roughening micro-etching liquid and use method thereof

Abstract

The invention discloses a copper surface roughening micro-etching solution and a use method thereof, and belongs to the technical field of metal surface chemical treatment. The coarsening micro-etching liquid comprises a bivalent copper ion source, organic amine, an acid radical donor, a halide ion source and a water-soluble polymer, wherein the organic amine is at least one of amino-containing polyethylene polyamine, alkyl alcohol amine and a hydroxyl nitrogen-containing heterocyclic compound; wherein the acid radical donor is at least one of monoaliphatic carboxylic acid and organic carboxylic acid copper salt, and the molar ratio of carboxyl in the acid radical donor to amino in organic amine is not higher than 1: 2; wherein the water-soluble polymer is a polymer of which a molecular chain contains an amino functional group, a nitrogen-containing heterocyclic functional group and a quaternary ammonium cation group; the copper surface roughening micro-etching liquid can be used at a low temperature of 25-35 DEG C. The coarsening micro-etching liquid can form a uniform coarsening effect on the surfaces of copper and alloys thereof, does not cause discoloration due to corrosion to other metals, and has a relatively high copper etching rate; in addition, the coarsening micro-etching liquid is not harsh in use condition and is suitable for popularization and use.

Description

technical field [0001] The invention relates to a roughening microetching solution and a method for using the same, in particular to a copper surface roughening microetching solution and a method for using the same, and belongs to the technical field of metal surface chemical treatment. Background technique [0002] In the production process of printed circuit boards (PCBs), the key performance and reliability of PCBs are mainly reflected in the reliability of the bonding between the conductor copper layer and the dielectric polymer material, as well as the effective reliability in harsh environments. The bonding between the copper layer and the dielectric polymer material layer involved in the entire PCB manufacturing process mainly includes: one is the bonding between the copper layer and the epoxy resin prepreg layer during the inner layer lamination process; the other is the bonding between the graphic circuit production process. Adhesion between copper layers and layers...

AI Technical Summary

Problems solved by technology

Another alkaline microetching agent used in the prior art is mainly composed of alkanolamines, copper ion sources, organic acids and halide ions. This microetching agent can solve the corrosion of metals other than copper caused by the microetching process. And the problem of discoloration, and existing cupric chloride-ammonia water system alkaline etchant produces the problem of irritating smell and performance instability because of ammonia water volatilization during use

However, there are still certain problems in the above-mentioned prior art, such as the inability to ensure that other metals are not corroded, and at the same time ensure that the surface of copper and its alloys has a uniform roughening effect and has a faster copper corrosion rate.

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