Liquid metal phase change heat absorption material

Abstract

The invention relates to a liquid metal phase change heat absorption material, and aims to effectively remove expansion stress generated in the phase change process of liquid metal, and meanwhile, a plurality of phase change materials do not generate a sedimentation layering phenomenon after being compounded. The liquid metal phase change heat absorption material is composed of low-melting-point metal, gallium oxide, tin hydroxide and phase change microcapsules, and the phase change point range is 20-40 DEG C. The low-melting-point metal is a gallium-tin alloy, and the low-melting-point metal comprises the following components in percentage by mass: 80% of gallium and 20% of tin. According to the phase change microcapsule disclosed by the invention, paraffin is used as a core material, polyacrylate is used as a wall material, and meanwhile, silicon dioxide nanoparticles are compounded on the surface of the polyacrylate wall material, so that the phase change microcapsule has higher affinity with low-melting-point metal, the phase change microcapsule is conveniently and uniformly dispersed in the low-melting-point metal, and sedimentation is avoided.

Description

technical field [0001] The invention relates to a liquid metal phase-change heat-absorbing material. The heat-absorbing material has no expansion stress and a stable freezing point. At the same time, the low-melting point metal and the phase-change microcapsule are fully fused after compounding, and no sedimentation and stratification phenomenon occurs. It can be widely used in cooling and thermal management systems in the fields of national defense, aerospace, energy systems, and civilian electronic equipment. Background technique [0002] Compared with traditional phase change materials (such as paraffin and its composite phase change materials), liquid metal phase change materials have the advantages of high thermal conductivity, fast heat absorption efficiency, and large volume latent heat. Breaking through the performance limit of traditional phase change materials, it provides a new solution for the cooling of a large number of devices and equipment facing the problem ...

AI Technical Summary

Problems solved by technology

[0003] Existing liquid metal phase change materials will generate huge expansion stress due to volume change during the phase change process, thus damaging electronic devices that need to be cooled

In addition, by adding other phase change materials with opposite volume changes, there is still a phenomenon of obvious precipitation and stratification with liquid metal, which affects the overall heat absorption efficiency of liquid metal phase change materials, resulting in the heat of electronic devices not being dissipated in time and burning out the electronic device

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