Liquid metal phase change heat absorption material

A liquid metal phase and heat-absorbing material technology, applied in heat exchange materials, microcapsule preparations, chemical instruments and methods, etc., can solve the problem of affecting the overall heat absorption efficiency of liquid metal phase change materials, and the heat of electronic devices cannot be dissipated in time , burnout of electronic devices and other problems, to achieve the effect of reducing surface tension, reducing supercooling, and avoiding sedimentation and stratification

Pending Publication Date: 2022-03-29
BEIJING EMIKON TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing liquid metal phase change materials will generate huge expansion stress due to volume change during the phase change process, thus damaging electronic devices that need to be cooled
In addition, by adding other phase change materials with opposite volume changes, there is

Method used

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  • Liquid metal phase change heat absorption material
  • Liquid metal phase change heat absorption material
  • Liquid metal phase change heat absorption material

Examples

Experimental program
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Effect test

Embodiment 1

[0031] Example 1 tested the step cooling curve of the liquid metal phase change endothermic material with a phase change point range of 20-40°C of the present invention at an ambient temperature of 15°C. figure 1 It is the step cooling curve of the liquid metal phase-change endothermic material of the present invention at an ambient temperature of 15°C.

[0032] In this embodiment, a liquid metal phase-change endothermic material is characterized in that it contains a low melting point metal, gallium oxide, tin hydroxide, and phase-change microcapsules.

[0033] In this embodiment, the total mass of materials is 300g, the mass fraction of low melting point metal is 80%, the mass fraction of gallium oxide is 0.5%, the particle size is 10 microns, the mass fraction of tin hydroxide is 0.5%, and the particle size is 10 microns , the mass fraction of phase change microcapsules is 19%.

[0034] The preparation of the phase change endothermic material of the present invention compr...

Embodiment 2

[0042] figure 2 with image 3 A typical application of the liquid metal phase-change endothermic material of the present invention in cooling and thermal management systems is shown. figure 2 It is a structural schematic diagram of the application of the liquid metal phase-change endothermic material of the present invention in cooling and thermal management systems. Among them: 1-liquid metal phase change heat absorbing material, 2-copper refrigeration plate, 3-radio frequency chip.

[0043]A liquid metal phase-change endothermic material in this embodiment, the mass fraction of low-melting point metal is 85%, the mass fraction of gallium oxide is 1%, the particle diameter is 8 microns, the mass fraction of tin hydroxide is 1%, and the mass fraction is 1%. The diameter is 8 microns, and the mass fraction of phase change microcapsules is 13%.

[0044] When in use, the liquid metal phase-change heat-absorbing material is filled in the copper refrigeration plate. The thickn...

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Abstract

The invention relates to a liquid metal phase change heat absorption material, and aims to effectively remove expansion stress generated in the phase change process of liquid metal, and meanwhile, a plurality of phase change materials do not generate a sedimentation layering phenomenon after being compounded. The liquid metal phase change heat absorption material is composed of low-melting-point metal, gallium oxide, tin hydroxide and phase change microcapsules, and the phase change point range is 20-40 DEG C. The low-melting-point metal is a gallium-tin alloy, and the low-melting-point metal comprises the following components in percentage by mass: 80% of gallium and 20% of tin. According to the phase change microcapsule disclosed by the invention, paraffin is used as a core material, polyacrylate is used as a wall material, and meanwhile, silicon dioxide nanoparticles are compounded on the surface of the polyacrylate wall material, so that the phase change microcapsule has higher affinity with low-melting-point metal, the phase change microcapsule is conveniently and uniformly dispersed in the low-melting-point metal, and sedimentation is avoided.

Description

technical field [0001] The invention relates to a liquid metal phase-change heat-absorbing material. The heat-absorbing material has no expansion stress and a stable freezing point. At the same time, the low-melting point metal and the phase-change microcapsule are fully fused after compounding, and no sedimentation and stratification phenomenon occurs. It can be widely used in cooling and thermal management systems in the fields of national defense, aerospace, energy systems, and civilian electronic equipment. Background technique [0002] Compared with traditional phase change materials (such as paraffin and its composite phase change materials), liquid metal phase change materials have the advantages of high thermal conductivity, fast heat absorption efficiency, and large volume latent heat. Breaking through the performance limit of traditional phase change materials, it provides a new solution for the cooling of a large number of devices and equipment facing the problem ...

Claims

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Application Information

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IPC IPC(8): C09K5/06B01J13/02
CPCC09K5/066B01J13/02
Inventor 郭瑞
Owner BEIJING EMIKON TECH DEV
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