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Power switch based on GaAs pHEMT technology and GaN technology

A power switch and process technology, applied in electronic switches, electrical components, pulse technology, etc., can solve the problems of difficult optimal design of converter parameters, high electromagnetic radiation and noise, and increased switching loss, etc., to achieve excellent power performance and low switching Effect of Loss, Operating Frequency and Gain Increase

Pending Publication Date: 2022-04-29
成都明夷电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] High frequency is an effective way to increase the power density of switching converters. Limited by the design and manufacturing technology of power semiconductors, when the switching frequency is increased to a certain level, hard switching converters will have the following problems: 1) The switching loss increases significantly; 2 ) switch stress; 3) electromagnetic radiation and noise
However, the resonant converter will generate high circulating energy, which requires frequency conversion control, and it is difficult to optimize the design of converter parameters

Method used

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  • Power switch based on GaAs pHEMT technology and GaN technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] This embodiment proposes a power switch based on GaAs pHEMT process and GaN process, such as figure 1 As shown, including drive amplifier unit and switch circuit unit;

[0049] The input end of the drive amplifier unit receives a radio frequency input signal, and the output end is connected to the switch circuit unit; the output end of the switch circuit unit outputs a radio frequency output signal;

[0050] The drive amplifier unit includes transistors made based on GaAs pHEMT technology; the switch circuit unit includes transistors made based on GaN technology.

[0051] In order to better realize the present invention, further, the switch circuit unit includes a boost switch Q1, a boost switch Q2, a power inductor L2, an input capacitor C4, and an output capacitor C5;

[0052] The input capacitor C4 is connected to the ground after being connected to the DC voltage source V1;

[0053] The boost switch Q1 is connected between the DC voltage source V1 and the input en...

Embodiment 2

[0060] This embodiment is based on the above-mentioned embodiment 1, in order to better realize the present invention, further, as figure 1 As shown, the drive amplifier unit includes a first capacitor C1, a second capacitor C2, a third capacitor C3, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a Six resistors R6, first transistor M1, second transistor M2, third transistor M3, first diode D1, second diode D2, third diode D3, fourth diode D4, DC voltage source V1, the first inductor L1;

[0061] One end of the first capacitor is connected to the anode of the DC voltage source V1, the other end is connected to the first resistor R1 and connected to the anode of the first diode D1 through the first resistor R1; the cathode of the first diode D1 connected to the ground;

[0062] One end of the second resistor R2 is connected to the anode of the DC voltage source V1, the other end is connected to the source of the firs...

Embodiment 3

[0084]In this embodiment, on the basis of the above-mentioned embodiment 2, in order to better realize the present invention, further, the gate widths of the first transistor M1 and the second transistor M2 are respectively 8×100 μm and 8×120 μm.

[0085] Further, the parameter of the power inductor L2 is 36nH.

[0086] Further, the value of the switch output capacitor Coss1 is 600 pF.

[0087] Further, the value of the switch output capacitor Coss2 is 600 pF.

[0088] Other parts of this embodiment are the same as those of Embodiment 2 above, so details are not repeated here.

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Abstract

The invention provides a power switch based on a GaAs pHEMT technology and a GaN technology. The driving amplifier part adopts a GaAs pHEMT process, and the switch part adopts a GaN process; compared with other processes, the GaAs pHEMT process has higher electron mobility and excellent power performance, can work at a lower temperature, and provides higher current density and electron mobility, so that the working frequency and gain are improved; compared with a traditional Si power device, the GaN power switch has lower on resistance and faster switching performance, and is one of the optimal choices for high switching frequency and high-efficiency operation. When the switching frequency is increased to MHz level, the soft switching plays an important role in further reducing the switching loss and improving the efficiency; compared with a traditional power switch, the low switching loss can be achieved, and the conduction loss is not remarkably increased.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit power switches, and in particular relates to a power switch based on GaAs pHEMT technology and GaN technology. Background technique [0002] With the rapid development of semiconductor technology, in gallium arsenide pseudo-matched high electron mobility transistor (GaAspHEMT), the InGaAs layer acts as a non-doped GaAs layer, and the GaAs pHEMT can work at a lower temperature, providing a larger The current density and electron mobility increase the operating frequency and gain. Compared with Si, SiC, GaN and other processes, GaAs pHEMT has higher electron mobility and excellent power performance, and it is widely used in the design and manufacture of MMIC DA. [0003] Wide bandgap (WBG) semiconductors such as gallium nitride (GaN) and silicon carbide (SiC) have superior characteristics compared to conventional silicon devices and are considered to be the next generation of power switc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03K17/042H03K17/687
CPCH03K17/04206H03K17/6871
Inventor 陈阳平苏黎明毋茜
Owner 成都明夷电子科技有限公司
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