Polybutadiene and epoxidized polybutadiene composition, adhesive, glued metal foil, prepreg, laminated board and preparation method

Abstract

The invention relates to a polybutadiene resin and epoxidized polybutadiene resin composition, an adhesive, a glued metal foil, a glued prepreg, a laminated board and a preparation method. The resin composition comprises a polybutadiene resin (A) with a structural general formula (1) and a number-average molecular weight of 1000-3000, a polybutadiene resin (B) with a structural general formula (1) and a number-average molecular weight of 120000-300000, and an epoxidized polybutadiene resin (C) with a structural general formula (2) and a number-average molecular weight of 1000-3000, wherein the weight ratio of the polybutadiene resin (A) to the polybutadiene resin (B) to the epoxidized polybutadiene resin (C) is 100: (80-500): (50-200). The resin composition and the adhesive containing the resin composition can be used for improving the peel strength of a metal foil and a base material in a laminated board; meanwhile, a large amount of non-polar structures such as carbon-carbon bonds and symmetric carbon-hydrogen bonds still exist in the cured components, the dielectric loss is small, and the dielectric property of the base material cannot be remarkably influenced.

Description

technical field [0001] The invention belongs to the field of laminate preparation, and in particular relates to a polybutadiene resin and an epoxidized polybutadiene resin composition, an adhesive, a rubberized metal foil, a rubberized prepreg, a laminated board and a preparation method. Background technique [0002] With the development of information technology, especially the advent of the era of 5G + Internet of Everything, high-frequency and high-speed copper-clad laminates (laminated boards), as one of the key basic materials in the field of electronic communications, are also expanding year by year. High-performance CCL materials require extremely low dielectric loss, thermal stability, chemical stability, and good processing performance. At present, the market's demand for high-performance copper-clad laminates is mainly reflected in: (1) Due to the requirements of high-speed signal processing of electronic products, the heat emitted from the inside of semiconductor ...

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Problems solved by technology

Traditional glue-coated copper foils often use epoxy resin systems as adhesives, but this traditional adhesive cannot meet the requirements of low dielectric loss

For hydrocarbon-based copper-clad laminates, Landi et al. reported a glue-coated copper foil material with thermosetting elastomer as the main component; but the material is relatively soft, and the surface of the glue-coated copper foil is easily damaged

In addition, Poutasse et al. reported that multi-component organosilane was used as a treatment agent to treat the surface of copper foil, thereby enhancing the peel strength with the substrate; however, this method has a very limited improvement in peel strength

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