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Manufacturing method of bonding wire protection layer

A production method and a technology of a protective layer, which are applied in the field of bonding wires, can solve the problems of reduced electrical conductivity, affecting the electrical conductivity and welding performance of metallic silver, and reducing the reflectivity of metallic silver, and achieve the effect of high thermal conductivity

Pending Publication Date: 2022-05-31
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, silver directly exposed to the air can easily react with hydrogen sulfide, oxygen, etc. to form silver sulfide
This not only greatly reduces the reflectivity of metallic silver, but also affects the conductivity and welding performance of metallic silver, which has become the main factor restricting the large-scale application of silver bonding wire.
[0004] At present, the main methods commonly used at home and abroad to prevent the discoloration of silver bonding wires are: plating precious metals on the surface of silver bonding wires, bright silver plating, chemical passivation with chromic acid, and dip-coating organic anti-silver discoloration agents. The surface of the final silver bonding wire is coated with other metals, so the conductivity will be reduced, and the reflectivity will also be reduced, which seriously affects the use of silver bonding wire

Method used

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  • Manufacturing method of bonding wire protection layer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] After the wire bonding is completed, the wire is immersed in liquid nitrogen below -196 ° C, so that the temperature of the wire is reduced to the same as that of liquid nitrogen; then the wire is immediately placed in an atmosphere containing an organic coating agent gas (containing an organic coating The atmosphere of the reagent gas is in a reducing gas, and the imidazole solvent is heated and evaporated in the range of 180 ° C to obtain a gas containing imidazole or formic acid; the reducing gas is a mixture of 5% hydrogen by volume and 95% argon or nitrogen by volume. In the mixed gas), the initial pressure of the atmosphere containing the organic coating agent gas is 0.1 MPa, and at a temperature of 400 ° C, the pressure is then increased to 1 MPa, and the reaction is carried out for 2 minutes. The organic coating agent is rapidly cooled on the surface of the bonding wire to form dense protective layer.

[0021] After the wire bonding was completed, the wires were...

Embodiment 2

[0024] After the wire bonding is completed, the wire is immersed in liquid helium below -196°C, so that the temperature of the wire is reduced to the same as that of liquid helium; then the wire is immediately placed in an atmosphere containing an organic coating agent gas (containing an organic coating The atmosphere of the reagent gas is in a reducing gas, and the imidazole solvent is heated and evaporated in the range of 180 ° C to obtain a gas containing imidazole or formic acid; the reducing gas is a mixture of 5% hydrogen by volume and 95% argon or nitrogen by volume. In the mixed gas), the initial gas pressure of the atmosphere containing the organic coating agent gas is 0.01 MPa, and at a temperature of 400 ° C, the gas pressure is then increased to 0.1 MPa, and the reaction is performed for 1 minute. The organic coating agent is rapidly cooled on the surface of the bonding wire to form Dense protective layer.

Embodiment 3

[0026] After the wire bonding is completed, the wire is immersed in dry ice below -78.5°C, so that the temperature of the wire is reduced to the same as the dry ice; then the wire is immediately placed in an atmosphere containing an organic capping agent gas (containing an organic capping agent gas The atmosphere is that in a reducing gas, the formic acid solvent is heated and evaporated in the range of 180 ° C to obtain a gas containing imidazole or formic acid; the reducing gas is a mixture of 5% hydrogen by volume and 95% argon or nitrogen by volume ), the initial pressure of the atmosphere containing the organic coating agent gas is 0.05MPa, and at a temperature of 200 ° C, the pressure is then increased to 0.5MPa, and the reaction is carried out for 5 minutes. The organic coating agent is rapidly cooled on the surface of the bonding wire to form dense The protective layer.

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Abstract

The invention belongs to the technical field of bonding wires, and discloses a manufacturing method of a bonding wire protection layer. The method comprises the following steps: after lead bonding is completed, immersing a lead in a low-temperature medium with the temperature lower than 0 DEG C, so that the temperature of the lead is reduced to be consistent with that of the low-temperature medium; and then the lead is immediately placed in an atmosphere containing organic coating agent gas, the initial air pressure of the atmosphere containing the organic coating agent gas is 0.01-0.1 MPa, the temperature ranges from room temperature to 400 DEG C, then the air pressure is increased to 0.1-1 MPa, the organic coating agent is rapidly cooled on the surface of the bonding wire through reaction, and a compact protection layer is formed. According to the method, organic matter steam is adopted for coating, the bonding wire is high in heat conductivity, due to low temperature, organic matter is induced to be separated out on the surface of the bonding wire to form a coating layer, and after a lead bonding sample is rapidly placed in a steam chamber, rapid pressure increasing is carried out, and the organic matter is induced to be separated out on the surface of the bonding wire to form the coating layer.

Description

technical field [0001] The invention belongs to the technical field of bonding wires, and particularly relates to a manufacturing method of a bonding wire protective layer. Background technique [0002] The bonding wire is mainly composed of gold wire, copper wire, aluminum wire, bonding wire and precious / base metal composite (such as palladium-plated copper wire) and other wires. Among them, aluminum wire and copper wire are mainly used in middle and low-grade circuits, and precious metal wire is mainly used in middle and high-grade products or military products due to cost reasons. [0003] As a precious metal bonding wire, silver bonding wire has the appearance of metallic silver, which is white and bright, and has excellent electrical conductivity, ductility and high reflectivity. Based on these characteristics of silver, silver bonding wires are widely used in precision connection technology fields such as LED lamps, mobile phone components, and semiconductor packaging...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60
CPCH01L21/50H01L24/85H01L2224/8592H01L2224/85948
Inventor 杨冠南张海德周志强崔成强张昱
Owner GUANGDONG UNIV OF TECH