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High-thermal-conductivity bonding sheet for fluorine-containing resin-based high-frequency copper-clad plate

A technology of fluorine-containing resin and adhesive sheet, which is applied in the field of communication materials, can solve the problems of restricting wide application and low thermal conductivity, and achieve the effects of quick and easy adjustment, reduction of production cost, and improvement of interaction force

Active Publication Date: 2022-06-03
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of fluorine-containing resin itself is extremely low (0.15W / mK), which limits its wider application. Therefore, it is imminent to develop high-frequency fluorine-containing resin-based copper-clad laminates with high thermal conductivity.

Method used

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  • High-thermal-conductivity bonding sheet for fluorine-containing resin-based high-frequency copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

Take 120 parts of BN (D50=10um) and mix it with 3500 parts of pure water. After dispersing by ball milling for 30 minutes, add 70 parts of NaOH to it. After 8 hours of ultrasonic-assisted reaction at 80 °C, add acetic acid to adjust the pH value to 6- Between 7 and 7, a reaction solution of activated BN is obtained.

[0043] Prepare 100 parts of a 2wt% H2O / ethanol mixed solution, add 0.7 parts of coupling agent KH550 and 2.3 parts of coupling agent KH570, stir at 55 ° C for 5 minutes, adjust the pH of the system to 3-5, and continue to stir 15min to obtain an activated composite coupling agent solution.

[0044] Pour the activated composite coupling agent solution into the activated BN reaction solution, continue stirring at 60 ° C for 4 hours, filter and wash the product with water for several times until the pH value of the filtrate is between 7-8; After washing with ethanol and toluene, the modified BN co-modified by KH570 / KH550 was obtained.

[0045] A homogeneous dispers...

Synthetic example 2

Take 120 parts of BN (D50=20um) and mix it with 3500 parts of pure water. After dispersing by ball milling for 30 minutes, add 80 parts of NaOH to it. After 12 hours of ultrasonic-assisted reaction at 80 °C, add acetic acid to adjust the pH value to 6- Between 7 and 7, a reaction solution of activated BN is obtained.

[0047] Prepare 100 parts of a 2wt% H2O / ethanol mixed solution, add 0.8 parts of coupling agent perfluorodecyltrimethoxysilane and 3.5 parts of coupling agent KH570, stir at 50 °C for 10 minutes, and adjust the pH of the system to 3- 5, and continue to stir for 20 min to obtain an activated composite coupling agent solution.

[0048] Pour the activated composite coupling agent solution into the activated BN reaction solution, continue stirring at 60 ° C for 5 hours, filter and wash the product with water for several times until the pH value of the filtrate is between 7-8; After rinsing with ethanol and toluene, the modified BN co-modified with perfluorodecyltrime...

Embodiment 1

Weigh 75 parts PTFE (Japan Daikin PTFE M-18), 75 parts PFA (DuPont Teflon PFA340), 15 parts FEP (Japan Daikin Neoflon FEP NC-1539), 40 parts silica, 2 parts mica powder, 5 parts PVDF and 120 parts of modified BN in Synthesis Example 1 were stirred in liquid nitrogen by a high-speed mixer for 2 hours to mix uniformly, the liquid nitrogen was volatilized, and after adding excess water, stirring and dispersing uniformly, 50 parts of commercially available ammonia solution (100% by mass) were added. 26%), stirred and mixed at 25°C for 24 hours, and then dried at 100°C to obtain a fluororesin mixture.

[0051] The fluorine-containing resin mixture is placed in a mold and pressed into a compact, under a nitrogen atmosphere at 360 ° C, 70 kg / cm 2 After sintering under hot pressing for 24 hours, a bonding sheet with a thickness of about 0.095-0.105 mm is obtained by turning; the bonding sheet and the PTFE-based prepreg are pressed together at high temperature to obtain a substrate for ...

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Abstract

The invention belongs to the technical field of communication materials, and particularly relates to a high-thermal-conductivity bonding sheet for a fluorine-containing resin-based high-frequency copper-clad plate. The preparation method comprises the following steps: firstly, adding, stirring and mixing raw material components into a liquid nitrogen medium to prepare a liquid nitrogen material; performing liquid nitrogen volatilization operation on the liquid nitrogen material, firstly adding water and stirring, and then adding ammonia water and stirring to prepare an ammonia water material; baking the ammonia water material, and removing water and ammonia to prepare a fluorine-containing resin mixture; then adding and pressing the fluorine-containing resin mixture in a mold to prepare a rod-shaped blank; and finally, under the protection of inert gas, carrying out hot pressing sintering-turning operation on the rod-shaped object blank to obtain the final high-thermal-conductivity bonding sheet.

Description

technical field [0001] The invention belongs to the technical field of communication materials, and particularly relates to a high thermal conductivity bonding sheet for a fluorine-containing resin-based high-frequency copper clad laminate. Background technique [0002] As the main carrier of electronic components, copper clad laminates have higher and higher integration levels and finer lines. In order to ensure the stability of electronic components, in addition to stable insulation and thermo-mechanical properties, copper clad laminates , and also need to have a good heat dissipation function. [0003] Metal-based copper clad laminates have the best heat dissipation capacity, but their manufacturing costs remain high and production is difficult, and they are only used for high-current modules. Ceramic substrates such as alumina-based, aluminum nitride-based and silicon nitride-based also have good thermal conductivity, but ceramic substrates have poor mechanical properti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/30C09J127/18C09J11/04C09J11/08C09J7/10C08J5/18C08J3/24C08L27/18C08L27/16C08K9/06C08K9/04C08K3/38B29D7/01B32B15/20B32B15/08B32B27/30B32B27/28
CPCC09J7/30C09J127/18C09J11/04C09J11/08C09J7/10C08J5/18C08J3/246B29D7/01B32B15/20B32B15/08B32B27/304B32B27/285C08K2003/385C08J2327/18C08J2427/18C08J2427/16C08L27/18C08L27/16C08K9/08C08K9/06C08K3/38
Inventor 冯凯俞卫忠俞丞顾书春赵琳
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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