Gradient machining system and method for atomic-scale surface and structure

Abstract

The invention relates to an atomic-scale surface and structure gradient machining system and method, and the system is sequentially provided with an energy regulator, a light beam shaping module and a grating beam splitting module along a light path, and the grating beam splitting module is used for splitting a machining light beam into a light beam which is suitable for the machining of each precision grade and has required irradiation energy density; the diaphragm is used for limiting the diffracted light beams entering a subsequent processing system; the optical switch is used for controlling whether the processing light beam is emitted or not; and the light beam focusing module is used for focusing light beams. The machining method comprises the steps of fixing the grating and moving a workpiece for different-precision machining; or the workpiece is fixed, and the grating is adjusted to realize in-situ machining with different precisions. According to the invention, cross-scale micron-scale, nano-scale and atomic-scale material removal is realized, the integration degree of the processing system is high, and the problem of connection and difficulty in repeated positioning caused by various processing methods and equipment are avoided; and by means of the ionization effect of high photon energy and fine regulation and control of ultrashort pulses on the material, lattice damage to the final surface is effectively reduced, and the machining precision is improved.

Description

technical field [0001] The invention belongs to the field of precision, ultra-precision, atomic and near-atomic scale manufacturing, in particular to a gradient processing system and method for atomic-level surfaces and structures. Background technique [0002] With the rapid development of information technology and various fields, the manufacture of important core devices such as quantum chips, photonic chips and biochips has put forward higher and higher requirements for surface quality and processing accuracy, and even requires the realization of atomically flat surfaces and structures. Among the existing subtractive manufacturing technologies, ultra-precision diamond processing technology can achieve micro- and nano-scale machining accuracy, and ultra-precision grinding or polishing technology can achieve nano-scale or sub-nanometer surface roughness. Ion beam processing, electron beam processing and extreme ultraviolet (EUV) lithography can achieve nano-scale material ...

AI Technical Summary

Problems solved by technology

[0003] Atomic layer etching (ALE) can remove atomic layers through self-limiting chemical reactions to achieve atomic-level surface roughness, but there are problems such as low removal rate, selectivity loss, net deposition and spontaneous etching.

Based on atomic force microscopy (AFM), scanning tunneling microscopy (STM) and scanning probe microscopy (SPM), single atoms can be manipulated for atomic-level structure preparation and doping, but the extremely low work efficiency is not yet suitable for production practice.

Images