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P-type gallium oxide nanostructure film and preparation method thereof

A nanostructure and gallium oxide technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low quality and difficult p-type doping of materials, and achieve low price, mature technology, and ease of crystal lattice Effects of Mismatch and Thermal Mismatch

Pending Publication Date: 2022-06-28
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of this invention is to provide a kind of p-type Ga prepared by thermal oxidation method on gallium antimonide (GaSb) single crystal substrate 2 o 3 Nanostructured films and methods for their preparation to address Ga 2 o 3 Difficult and low-quality p-type doping of materials

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  • P-type gallium oxide nanostructure film and preparation method thereof
  • P-type gallium oxide nanostructure film and preparation method thereof
  • P-type gallium oxide nanostructure film and preparation method thereof

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Embodiment 1

[0020] A. Pretreatment of the GaSb single crystal substrate 1: First, the GaSb single crystal substrate 1 is cleaned in sequence with toluene, acetone, and ethanol for 5 minutes in an ultrasonic state. Then, the cleaned GaSb single crystal substrate 1 was placed in a hydrochloric acid solution with a mass fraction of 10% for 5 minutes, the surface oxide layer was removed and rinsed with deionized water, and finally the substrate was blown dry with high-purity nitrogen;

[0021] B. Before growth, the GaSb single crystal substrate needs to be heated by a tube furnace in a vacuum environment. The heating temperature is 500°C, the time is 5min, and the reaction pressure is 10Pa, so that most of the Sb element on the surface of GaSb is detached to form In the Ga-rich state, Ga atoms cluster on the surface of the substrate to form tiny droplets.

[0022] C. p-type Ga 2 O 3 The nanostructured film is formed by the high temperature oxidation of the heated GaSb single crystal substra...

Embodiment 2

[0028] A. Pretreatment of the GaSb single crystal substrate 1: First, the GaSb single crystal substrate 1 is cleaned in sequence with toluene, acetone, and ethanol for 5 minutes in an ultrasonic state. Then, the cleaned GaSb single crystal substrate 1 was placed in a hydrochloric acid solution with a mass fraction of 10% for 5 minutes, the surface oxide layer was removed and rinsed with deionized water, and finally the substrate was blown dry with high-purity nitrogen;

[0029] B. Before growth, the GaSb single crystal substrate needs to be heated by a tube furnace in a vacuum environment. The heating temperature is 470°C, the time is 4min, and the reaction pressure is 20Pa, so that most of the Sb element on the surface of GaSb is detached, forming In the Ga-rich state, Ga atoms cluster on the surface of the substrate to form tiny droplets.

[0030] C. p-type Ga 2 O 3 The nanostructured film is formed by the high temperature oxidation of the heated GaSb single crystal substr...

Embodiment 3

[0035] A. Pretreatment of the GaSb single crystal substrate 1: First, the GaSb single crystal substrate 1 is cleaned in sequence with toluene, acetone, and ethanol for 5 minutes in an ultrasonic state. Then, the cleaned GaSb single crystal substrate 1 was placed in a hydrochloric acid solution with a mass fraction of 10% for 5 minutes, the surface oxide layer was removed and rinsed with deionized water, and finally the substrate was blown dry with high-purity nitrogen;

[0036] B. Before the growth, the GaSb single crystal substrate needs to be heated by a tube furnace in a vacuum environment. The heating temperature is 520°C, the time is 6min, and the reaction pressure is 7Pa, so that most of the Sb element on the surface of GaSb is detached and formed In the Ga-rich state, Ga atoms cluster on the surface of the substrate to form tiny droplets.

[0037] C. p-type Ga 2 O 3 The nanostructured film is formed by the high temperature oxidation of the heated GaSb single crystal s...

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Abstract

The invention discloses a p-type gallium oxide nanostructure film and a preparation method thereof, and belongs to the technical field of semiconductor film material preparation. The structure thin film is composed of a GaSb single crystal substrate and a p-type Ga2O3 nano structure thin film in sequence. The method comprises the following steps: heating a GaSb single crystal substrate to form gallium liquid drops on the surface of the GaSb single crystal substrate; and then oxygen is introduced to carry out continuous thermal oxidation on the gallium liquid drops, so that Sb replacement SbO formed by Sb in the substrate is combined with intrinsic defect Ga vacancy VGa in Ga2O3, a SbO-VGa complex structure is formed to serve as an effective acceptor doping source, and the stable p-type Ga2O3 film is formed. In addition, the nanostructure formed during thermal oxidation can effectively relieve large lattice mismatch and thermal mismatch between the nanostructure and the substrate, and the crystal quality of the thin film is improved. The method is simple in process and low in cost, the problem of p-type doping of the Ga2O3 material is solved, the film quality is high, and the method provides powerful support for development of Ga2O3-based devices.

Description

technical field [0001] The invention belongs to the technical field of semiconductor thin film material preparation, in particular to a p-type gallium oxide nanostructure thin film and a preparation method thereof. Background technique [0002] Gallium oxide (Ga 2 O 3 ) is a wide bandgap semiconductor material, the most stable crystal phase is β-Ga monoclinic 2 O 3 structure. Ga 2 O 3 It has high transmittance in the ultraviolet region, high breakdown electric field strength (8MV / cm), good thermal stability and chemical stability. Its good semiconductor process compatibility and low cost make it more valuable than semiconductor materials such as SiC and GaN. Ga 2 O 3 Its many characteristics make it have broad application prospects in optoelectronic devices, power electronics, gas sensing and other fields. [0003] Currently Ga 2 O 3 The research progress of base devices is relatively slow, the main reason is that Ga 2 O 3 There are great difficulties in the ef...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L21/02175H01L21/02241
Inventor 董鑫陈威焦腾刁肇悌李政达张源涛张宝林
Owner JILIN UNIV