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2DEG ultraviolet detector with symmetric interdigital structure and preparation method thereof

A technology of ultraviolet detector and interdigital structure, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of low sensitivity, low signal-to-noise ratio, and long response time, so as to improve the light-to-dark current ratio and reduce the response time , The effect of simple manufacturing process

Pending Publication Date: 2022-06-28
JIANGNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to solve the problems of low sensitivity, low signal-to-noise ratio, and long response time of current ultraviolet detectors, the present invention provides a 2DEG ultraviolet detector with a symmetrical interdigitated structure, which uses a GaN channel layer to disconnect the 2DEG conductive channel, A symmetrical interdigitated 2DEG electrode is formed to reduce the dark current of the device while obtaining a high response. The ultraviolet detector includes from bottom to top: a substrate layer, an AlN buffer layer, a GaN channel layer, an AlGaN barrier layer, and metal electrode layer;

Method used

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  • 2DEG ultraviolet detector with symmetric interdigital structure and preparation method thereof
  • 2DEG ultraviolet detector with symmetric interdigital structure and preparation method thereof
  • 2DEG ultraviolet detector with symmetric interdigital structure and preparation method thereof

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Embodiment 1

[0037] This embodiment provides a 2DEG ultraviolet detector with a symmetrical interdigital structure. The ultraviolet detector includes, from bottom to top, a sapphire substrate, an AlN buffer layer, a GaN channel layer, and an interdigitated AlGaN potential with an Al composition of 0.18. Barrier layer and 30 / 150 / 50 / 20nm Ti / Al / Ti / Au ohmic metal electrode layer;

[0038] The thickness of the AlN buffer layer is 450nm, and the GaN buffer layer is not doped, and its thickness is 1.8μm. By growing 22nm thick Al 0.18 Ga 0.82 N barrier layer to form 2DEG.

[0039] The mesa etching was performed using an inductively coupled plasma with BCl3 / Cl2 gas, and the interdigitated AlGaN electrodes of the mesa structure had dimensions of 30 μm wide, 400 μm long, and 5 μm pitch. Therefore, 30 μm-wide AlGaN 2DEG mesa electrodes separated by 5 μm-wide intrinsic GaN buffer channels constitute a 2DEG-based interdigital UV detector.

Embodiment 2

[0041] The present embodiment provides a method for preparing a 2DEG ultraviolet detector with a symmetrical interdigital structure, by growing a device epitaxial heterostructure on a sapphire substrate by metal organic chemical vapor deposition (MOCVD), including:

[0042] Step 1: deposit undoped GaN on the AlN buffer layer;

[0043] Step 2: after the GaN layer is grown, undoped AlGaN is deposited on the GaN layer to form an AlGaN layer, and a two-dimensional electron gas 2DEG is formed at the interface of the AlGaN / GaN heterostructure;

[0044] Step 3: Using Inductively Coupled Plasma with BCl 3 / Cl 2 The AlGaN layer is mesa-isolated and etched by the gas to form a symmetrical interdigitated AlGaN 2DEG electrode;

[0045] Step 4: After the mesa isolation etch, a standard Ti / Al / Ti / Au (30 / 150 / 50 / 20nm) ohmic metal stack was deposited.

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Abstract

The invention discloses a 2DEG ultraviolet detector with a symmetric interdigital structure and a preparation method, and belongs to the technical field of semiconductor device manufacturing. The ultraviolet detector sequentially comprises a substrate layer, an AlN buffer layer, a GaN channel layer, an AlGaN barrier layer and a metal electrode layer from bottom to top. According to the invention, the 2DEG electrode with the symmetric interdigital structure is adopted, valence band offset in an AlGaN / GaN heterostructure is utilized, hole accumulation on an interface causes reduction of potential barrier energy when electrons enter a conduction band, so that the defects of low response and low quantum efficiency of an ultraviolet detector with a traditional device structure are overcome, the responsivity and gain are improved, a 2DEG conductive channel is disconnected through GaN, and the quantum efficiency of the ultraviolet detector is improved. The dark current of the device is reduced, the light-dark current ratio is improved, the response time is effectively reduced, and meanwhile, the sensitivity and the signal-to-noise ratio of the device are improved. In addition, the manufacturing process is simple, monolithic integration is facilitated, and then chip integration of an optical sensing system can be achieved.

Description

technical field [0001] The invention relates to a 2DEG ultraviolet detector with a symmetrical interdigital structure and a preparation method, and belongs to the technical field of semiconductor device manufacturing. Background technique [0002] With the wide application of UV photodetectors in industrial production, environmental monitoring, military ballistic guidance prediction strategy, biomedical research, medicine, and UV astronomy, semiconductor UV photodetectors have attracted extensive attention in the field of photodetectors. The performance of UV photodetectors has a crucial impact on the reliability and accuracy of UV signal detection. Therefore, in most applications, an ideal UV detector should exhibit high responsivity to maximize signal, and low dark current to minimize quiescent power. [0003] In recent years, with the development of semiconductor materials, Al(GaN) has become a typical representative of the third-generation wide-bandgap semiconductor mat...

Claims

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Application Information

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IPC IPC(8): H01L31/109H01L31/0224H01L31/0304H01L31/18
CPCH01L31/109H01L31/03048H01L31/1848H01L31/022408Y02P70/50
Inventor 杨国锋谷燕谢峰陆乃彦陈国庆张秀梅蒋学成
Owner JIANGNAN UNIV
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