2DEG ultraviolet detector with symmetric interdigital structure and preparation method thereof
A technology of ultraviolet detector and interdigital structure, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of low sensitivity, low signal-to-noise ratio, and long response time, so as to improve the light-to-dark current ratio and reduce the response time , The effect of simple manufacturing process
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Embodiment 1
[0037] This embodiment provides a 2DEG ultraviolet detector with a symmetrical interdigital structure. The ultraviolet detector includes, from bottom to top, a sapphire substrate, an AlN buffer layer, a GaN channel layer, and an interdigitated AlGaN potential with an Al composition of 0.18. Barrier layer and 30 / 150 / 50 / 20nm Ti / Al / Ti / Au ohmic metal electrode layer;
[0038] The thickness of the AlN buffer layer is 450nm, and the GaN buffer layer is not doped, and its thickness is 1.8μm. By growing 22nm thick Al 0.18 Ga 0.82 N barrier layer to form 2DEG.
[0039] The mesa etching was performed using an inductively coupled plasma with BCl3 / Cl2 gas, and the interdigitated AlGaN electrodes of the mesa structure had dimensions of 30 μm wide, 400 μm long, and 5 μm pitch. Therefore, 30 μm-wide AlGaN 2DEG mesa electrodes separated by 5 μm-wide intrinsic GaN buffer channels constitute a 2DEG-based interdigital UV detector.
Embodiment 2
[0041] The present embodiment provides a method for preparing a 2DEG ultraviolet detector with a symmetrical interdigital structure, by growing a device epitaxial heterostructure on a sapphire substrate by metal organic chemical vapor deposition (MOCVD), including:
[0042] Step 1: deposit undoped GaN on the AlN buffer layer;
[0043] Step 2: after the GaN layer is grown, undoped AlGaN is deposited on the GaN layer to form an AlGaN layer, and a two-dimensional electron gas 2DEG is formed at the interface of the AlGaN / GaN heterostructure;
[0044] Step 3: Using Inductively Coupled Plasma with BCl 3 / Cl 2 The AlGaN layer is mesa-isolated and etched by the gas to form a symmetrical interdigitated AlGaN 2DEG electrode;
[0045] Step 4: After the mesa isolation etch, a standard Ti / Al / Ti / Au (30 / 150 / 50 / 20nm) ohmic metal stack was deposited.
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