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Preparation method of functional material film and preparation method of quantum dot light-emitting diode

A technology of quantum dot luminescence and functional materials, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc. It can solve the problems of easy precipitation of solute particles, uneven film layer, unstable quality, etc., and achieve good surface flatness , improve repeatability, reduce the effect of variance

Pending Publication Date: 2022-07-01
TCL CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of this application is to provide a method for preparing a functional material film and a method for preparing a quantum dot light-emitting diode. technical issues

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  • Preparation method of functional material film and preparation method of quantum dot light-emitting diode
  • Preparation method of functional material film and preparation method of quantum dot light-emitting diode
  • Preparation method of functional material film and preparation method of quantum dot light-emitting diode

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preparation example Construction

[0025] The first aspect of the embodiments of the present application provides a method for preparing a functional material film, such as figure 1 As shown, the preparation method comprises the following steps:

[0026] S01: Provide substrate;

[0027] S02: depositing a functional material solution on the substrate, and performing annealing treatment in a solvent vapor atmosphere to obtain the functional material film;

[0028] Wherein, the solvent forming the solvent vapor can dissolve the functional material.

[0029] The present application provides a method for preparing a functional material film. After depositing a functional material solution on a substrate, annealing is performed in a solvent vapor atmosphere, and both the solvent forming the solvent vapor and the solvent in the functional material solution can dissolve The functional material, so during the annealing process, the functional material on the surface of the functional material layer, that is, the solut...

Embodiment 1

[0076] A quantum dot light-emitting diode, from bottom to top, comprises: an ITO glass substrate (anode substrate), a hole transport layer, a quantum dot light-emitting layer, an electron transport layer and a cathode. Its preparation method comprises the following steps:

[0077] Ⅰ. First, provide an ITO glass substrate and a 10 mg / ml TFB dichlorobenzene solution.

[0078] Take 0.1 ml of TFB dichlorobenzene solution, drop it on top of the ITO substrate, and spin-coat at 3000 rpm for 30 s to prepare a hole transport layer on the ITO substrate. After the spin coating is completed, transfer the sheet to a two-compartment petri dish, add 15 ml of dichlorobenzene (one for each sheet and solvent) to the petri dish, seal the petri dish, and transfer it to a 125°C heating plate. After standing at a constant temperature for 60 min, solvent vapor annealing was performed. After the dichlorobenzene vapor annealing, the wafer was transferred to a 125° C. heating plate, heat-treated for ...

Embodiment 2

[0085] A quantum dot light-emitting diode, from bottom to top, comprises: an ITO glass substrate (anode substrate), a hole transport layer, a quantum dot light-emitting layer, an electron transport layer and a cathode. Its preparation method comprises the following steps:

[0086] I. First, an ITO glass substrate and a 10 mg / ml TFB toluene solution are provided.

[0087] Take 0.1 ml of TFB toluene solution, drop it on top of the ITO substrate, and spin-coat at 3000 rpm for 30 s to prepare a hole transport layer on the ITO substrate. After the spin coating is completed, transfer the film to a two-compartment petri dish, add 15 ml of toluene (one space for each film and solvent) into the petri dish, seal the petri dish, and transfer it to a heating plate at 110 °C. Set 60min, carry out solvent vapor annealing. After the dichlorobenzene vapor annealing, the wafers were transferred to a 110° C. heating plate, heat treated for 30 min, and the residual solvent was removed to compl...

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Abstract

The invention belongs to the technical field of display device processes, and particularly relates to a preparation method of a functional material film and a preparation method of a quantum dot light-emitting diode. The preparation method of the functional material film comprises the following steps: providing a substrate; depositing a functional material solution on the substrate, and carrying out annealing treatment under a solvent vapor atmosphere condition to obtain the functional material film; wherein the solvent forming the solvent vapor can dissolve the functional material. In the preparation method of the functional material film, the annealing treatment process is carried out under the condition of solvent vapor atmosphere, so that the functional material, namely solute particles, on the surface of the functional material layer generates dissolution-precipitation balance under the action of solvent vapor, and the solute particles on the surface of the functional material layer are rearranged; therefore, the thickness of the functional material film is uniform, and the surface flatness of the functional material film is better.

Description

technical field [0001] The application belongs to the technical field of display device technology, and in particular relates to a preparation method of a functional material film and a preparation method of a quantum dot light-emitting diode. Background technique [0002] Due to their unique optoelectronic properties, quantum dot materials are considered to have a wide range of applications in the fields of photovoltaic power generation and optoelectronic display, and have become a research hotspot. In terms of the preparation of optoelectronic devices, the spin coating method has the characteristics of mild process conditions, simple operation, energy saving and environmental protection, and the optoelectronic devices prepared by it have the advantages of high carrier mobility and precise thickness. Therefore, in recent years, spin-coating method to fabricate optoelectronic devices has been paid more and more attention. [0003] At present, spin coating is the most common...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/50
CPCH10K71/441H10K50/115H10K50/171H10K50/15H10K50/16H10K50/17H10K71/00
Inventor 丘洁龙
Owner TCL CORPORATION