Molybdenum disulfide electrodepositing method and liquid for micromachinery surface
A molybdenum disulfide and electrodeposition technology, applied in the direction of electrolytic inorganic material coating, etc., can solve the problem of little research on molybdenum disulfide, and achieve the effects of excellent profiling, controllable operation, and simple electrodeposition equipment.
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Embodiment 1
[0020] A molybdenum disulfide deposition solution for surface treatment of mechanical parts is characterized in that it includes soluble molybdate, soluble sulfide, and pH regulator, wherein soluble molybdate can be selected as sodium molybdate, molybdenum in this embodiment Ammonium acid, soluble sulfide can be selected as sodium sulfide, ammonium sulfide, acidity regulator in this embodiment and can be selected as hydrochloric acid, phosphoric acid, acetic acid in the present embodiment; The mol ratio of soluble sulfide and soluble molybdate is 4~ 30:1, 5:1, 7:1, 20:1, 27:1; the molar ratio of acidity regulator to soluble molybdate is 2~30:1, which can be selected as 3:1, 7:1 in this embodiment 1, 14: 1, 24: 1, the molar ratio of water and soluble molybdate is 55~5500: 1, can be selected as 70: 1, 300: 1, 2000: 1, 3890: 1, 5100 in this embodiment : 1.
Embodiment 2
[0022] A molybdenum disulfide electrodeposition solution for micromechanical surface treatment, the components required to configure the solution are soluble molybdate, soluble sulfide, pH regulator and water, wherein the soluble molybdate can be selected in this embodiment Be sodium molybdate, ammonium molybdate, can be selected as sodium sulfide, ammonium sulfide, acidity regulator in the present embodiment and can be selected as hydrochloric acid, phosphoric acid in the present embodiment; Remove water, and the molar percentage of soluble molybdate is 1- 30%, can be selected as 5%, 20%, 27% in the present embodiment, and soluble sulfide accounts for 10-50% in molar percentage, can be selected as 14%, 25%, 40%, 45% in the present embodiment, The molar percentage of acidity regulator is 10-50%, can be selected as 14%, 25%, 40%, 45% in the present embodiment, and above-mentioned additive can be hydrochloric acid, phosphoric acid, acetic acid, lactic acid, propionic acid, malic ...
Embodiment 3
[0024] The molybdenum disulfide deposition liquid formulation of the present invention is used to treat N-type single-sided polished single-crystal silicon wafers for micromechanics. The wafer has a diameter of 3 inches, a crystal orientation of 110, doped with arsenic, and a resistivity of 0.002 ohm cm. The composition of molybdenum disulfide and the low-temperature electrodeposition process are as follows:
[0025] Composition of molybdenum disulfide electrodeposition solution
[0026] Component Concentration (Mol / L)
[0027] Sodium molybdate 0.01~0.1
[0028] Sodium sulfide 0.04~0.9
[0029] Hydrochloric acid 0.04~0.5
[0030] Soak the substrate in 80°C hydrochloric acid and hydrogen peroxide solution for 20 minutes. After cleaning, the second step: store the micromechanical material substrate in the electrolytic tank with the above composite deposition solution, and connect the mechanical parts to be processed to the cathode of the power supply. At room temperature, w...
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