Method of manufacturing monolithic integration of movable micro physical construction on monocrystalline silicon substrate

Abstract

The present invention discloses a method for making movable micromechanical structure monolithic integration on the unicrystalline silicon substrate. Said invention adopts the processes of dense boron diffusion, photoetching, deep reaction ion etching and selective wet etching to make the movable floating and fixed microstructure on same single-crystal silicon wafer so as to attain the goal of making movable micromechanical monolithic integration. Said invention can make monolithic integration and large-scale integration, and is suitable for making several movable microstructure devices of optical switch, resonator and G-meter, etc.

Description

technical field [0001] The invention relates to a manufacturing method for monolithic integration of movable micro-mechanical structures on a single-crystal silicon substrate in the technical field of micro-electronic mechanical processing, and is especially suitable for manufacturing various devices with movable micro-electronic mechanical structures. Background technique [0002] Micro-electro-mechanical system, also known as MEMS, refers to a controllable and movable micro-electromechanical device with a size below the millimeter level. The combination of these constitutes a system with specific functions, which has the advantages of light weight, small size, low cost and integration. MEMS technology emerged in the mid-1980s and developed rapidly in the early 1990s. At present, many developed countries in the world have given priority to the development of MEMS technology. The United States lists MEMS technology, aerospace technology and information technology as the th...

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Problems solved by technology

In the silicon-based process, the surface processing adopts a multi-layer thin film structure (generally less than 3 μm) and sacrificial layer corrosion technology. The production process is complicated and difficult to control. At present, there are few domestic applications. The bulk silicon process is mainly used, and the bulk silicon process is used most. The most important is the bulk silicon dissolving process, that is, the double-layer structure of silicon-glass bonding. Compared with the surface process, the bulk silicon process has a larger processing space (generally greater than 20 μm), but the bulk silicon dissolving process also has many shortcomings. If the process is complex and requires silicon-glass bonding, it increases the difficulty of the process and leads to a decrease in yield

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