Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates

A technology of polyimide resin and precursor solution, applied in circuit substrate materials, printed circuit parts, conductive layers on insulating carriers, etc., can solve the problems of metal ion migration and loss of resin insulation, etc.

Inactive Publication Date: 2004-04-07
TORAY ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] However, the method described in Japanese Patent Publication No. 5-61296 has many safety problems such as explosion and toxicity of reducing gas.
In the method described in Japanese Patent Application Laid-Open No. 5-306469, since the addition amount of the metal compound must be as high as about...

Method used

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  • Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates
  • Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates
  • Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates

Examples

Experimental program
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Effect test

Embodiment 1

[0052] A solution of a commercially available palladium acetylacetone complex (hereinafter referred to as palladium complex) dissolved in N-methyl-2-pyrrolidone (hereinafter referred to as NMP) was added to the polyimide of Toray Co., Ltd. In the amine resin precursor varnish "トレニ-ス" #3000, the varnish solution was adjusted so that the average content of the palladium complex compound in the varnish solution became 1 wt / vol%. The varnish solution contains an average polyimide resin precursor of approximately 5 wt / vol% of the palladium coordination compound.

[0053] In addition, the so-called 1 wt / vol% refers to, for example, the concentration of 0.01 g of the palladium complex compound dissolved in 1 ml of "Toraynis" varnish solution.

[0054] Next, a test piece of 10×10 cm (thickness 50μm) of the polyimide substrate "Yu-ピレツクス-S" from Ube Industries Co., Ltd. was treated with 1% NaOH aqueous solution and 1% HCl aqueous solution, and washed with pure water. After drying, the varni...

Embodiment 2

[0061] The palladium complex content of the polyimide resin precursor solution of Example 1 was changed to 0.5 wt / vol%, and the same treatment was performed to prepare a substrate for electronic parts with a copper film thickness of 22 μm. As a result of measuring the peel strength between the metal portion of the obtained substrate and the polyimide resin layer by the method specified in JISC-6481, it was 12 N / cm (1200 gf / cm).

Embodiment 3

[0063] Change the ultraviolet radiation dose of Example 1 to 7500mJ / cm 2 , Proceed with the same treatment.

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Abstract

Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.

Description

Technical field [0001] This invention relates to the manufacturing method of the electronic component material and base material for microfabrication which has a polyimide resin layer. Background technique [0002] As flexible printed circuit boards, TAB materials, and CSP materials, copper-clad polyimide substrates are used. However, with the miniaturization of equipment and the increase in signal transmission speed, high-density micro-wiring and micro-channels are required. Microfabrication, and a material with high adhesion strength of metal film is increasingly required. [0003] In the past, in order to obtain a copper-clad polyimide substrate with high adhesion strength, the method used is to apply a sputtering method to the surface of the polyimide after dry pretreatment such as ion bombardment and corona discharge. And chromium and other underlying metals, and then electroless plating and electrolytic plating are performed on it to form a metal film. [0004] However, thi...

Claims

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Application Information

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IPC IPC(8): C08K5/00C08L79/08C23C18/20H01B5/14H01B13/00H05K1/03
CPCC23C18/204C23C18/2086C23C18/30
Inventor 泉田信也伊藤釭司小山稔铃木笃
Owner TORAY ENG CO LTD
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