Amorphous crystallization preparation method for nano crystal thermoelectric semiconductor material
A thermoelectric semiconductor and nanocrystalline technology, applied in the field of new energy materials, can solve the problems of easy introduction of other impurities, uneven grain size, difficulty in obtaining high-purity thermoelectric semiconductor materials, etc. The effect of easy large-scale preparation
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[0021] Example 1: Bulk CoSb 3 Preparation of Nanocrystalline Thermoelectric Semiconductor Material
[0022] Using cobalt powder and antimony powder as raw materials, melt reaction at 1100℃ to obtain uniform CoSb 3 Melt, using copper single copper roll quenching technology, to 10 5 Preparation of CoSb at a cooling rate of ℃ / sec 3 The amorphous alloy strip has a width of about 2 to 3 mm, a thickness of about 25 μm, a length of several meters, and a smooth surface.
[0023] The strips weighing about 5g are ground and pulverized into powder, and then packed into a graphite mold of φ10mm for compaction, and then moved together with the mold into the spark plasma rapid recrystallization and densification sintering (SPS) equipment. The vacuum degree in the furnace is 10 -3 Pa, heat up to 600℃ for recrystallization, use 30MPa pressure for densification, recrystallization and densification time is 7min, after cooling, take out the mold and get a block material with a diameter of 10mm and a...
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[0024] Example 2: Bulk Ba is filled with nano-skutterudite compound Ba y Co 4 Sb 12 Preparation of thermoelectric semiconductor materials
[0025] Using bulk barium, cobalt powder and antimony powder as raw materials, the melting reaction is carried out at 1100°C to obtain uniform Ba-filled Ba y Co 4 Sb 12 Melt, using copper single copper roll quenching technology, to 10 5 ℃ / sec cooling rate to prepare Ba y Co 4 Sb 12 The amorphous alloy strip has a width of about 2 to 3 mm, a thickness of about 25 μm, a length of several meters, and a smooth surface.
[0026] The strips weighing about 8g are ground and crushed into powder, and then packed into a φ20mm graphite mold for compaction, and then moved together with the mold into the spark plasma rapid recrystallization and densification sintering (SPS) equipment. The vacuum in the furnace is 10 -3 Pa, heat up to 600℃ for recrystallization, and use 30MPa pressure for densification. The recrystallization and densification time is 8min. A...
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