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Method for preparing reactive hot-press in-situ autogenesis copper-base composite material

A copper-based composite material, in-situ self-generated technology, applied in the field of preparation of copper-based composite materials, can solve the problems of complex operation, difficult control, expensive equipment, etc.

Inactive Publication Date: 2005-12-21
HARBIN INST OF TECH
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  • Abstract
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  • Claims
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Problems solved by technology

[0005] In order to solve the disadvantages of expensive equipment, complicated operation, and difficult control of reaction products in the existing in-situ synthesis method of copper-based composite materials, the present invention provides a method for preparing copper-based composite materials in situ by reaction hot pressing, which is through The following steps are implemented: a. Powder mixing by ball milling: Put the prepared Ti powder, B powder and Cu powder into the ball mill tank, first vacuumize and then fill with argon. Mix the powder for 6-12 hours under the condition of 200-400 rpm; b, cold press molding: put the mixed powder into a graphite mold and cold press to form, so that the density of the material reaches 20-40%; c, vacuum Hot-press sintering: Put the powder together with graphite mold into a vacuum hot-press furnace for hot-press sintering, press the material to a density of 95-99%, cool to room temperature with the furnace, and release the mold to obtain TiB 2 / Cu composite material

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  • Method for preparing reactive hot-press in-situ autogenesis copper-base composite material

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specific Embodiment approach 1

[0008] Specific embodiment one: this embodiment is carried out according to the following steps: a, ball milling method powder mixing: put the prepared Ti powder, B powder and Cu powder into the ball mill tank, first vacuumize, then fill with argon to prevent ball milling The powder is oxidized during the process, and the TiB 2 In the preparation process of Cu / Cu composite materials, the ball milling process parameters are very important for the successful preparation of composite materials. If the ball milling speed is too low, the ball material ratio is small or the powder mixing time is too short, it will easily lead to uneven powder mixing; on the contrary, if If the ball milling speed is too high, the ball-to-material ratio is too large, or the powder mixing time is too long, mechanical alloying will occur (that is, a chemical reaction has occurred during the ball milling process to form a composite material), and mechanical alloying is easy to introduce into the ball mill...

specific Embodiment approach 2

[0009] Specific Embodiment 2: The difference between this embodiment and Specific Embodiment 1 is that in order to further improve TiB 2 / Cu composite material structure, to improve the performance of the composite material, the composite material prepared by reactive hot pressing must be hot-extruded: the composite material is covered with low-carbon steel, the composite material is heated to 900-1000 °C, and the extrusion die is simultaneously Heating to 480-540°C, then taking the composite material out of the heating furnace and putting it into an extrusion die, and hot-extruding the composite material to obtain high-quality TiB 2 / Cu composite material. The extrusion ratio is 20-30:1, and the cone angle of the die is 120°.

specific Embodiment approach 3

[0010] Specific implementation mode three: this implementation mode is realized in this way:

[0011] a. Powder mixing by ball milling method: put the prepared Ti powder, B powder and Cu powder into the ball mill tank, first vacuumize, and then fill with argon to prevent the powder from being oxidized during the ball milling process. The powder is mixed on a planetary ball mill, the ball-to-material ratio is 5:1, the rotating speed is 300 rpm, and the powder mixing time is 8 hours.

[0012] b. Cold pressing molding: Put the mixed powder into graphite mold and cold pressing molding, the material density reaches 30%.

[0013] c. Hot press sintering: Then put the powder together with the graphite mold into a vacuum hot press furnace for hot press sintering. First evacuate to a vacuum of 10 -3 Torr, then start heating at a heating rate of 10°C / min, heat to 650°C for 30 minutes, degas, and press the material to a density of 80%. Continue heating to 950°C, press the material unti...

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Abstract

The invention discloses a preparation technique of reaction heat pressing original position autogeny copper base material, relates to preparation technique of a copper base material applied to micro electric industry. Focusing on the problem that existing original position autogeny preparation technique is of expensive devices, complex operation while the product is hard to specify. The technique is achieved through following steps: a, put powder of Ti, B, Cu into ball milling cylinder and vacuum the cylinder, aerate with argon gas, blend the mixed powder for 6 to 12 hours for while the ratio of grinding media to material is 1 to 20 : 1 and rotating speed at 200 to 400 round per minutes; b: shape the blended powder in black lead moulds making the density to 20 to 40 percent; c, sinter the powder together with the mould into vacuum heat press furnace and make the density to 90 to 99 percent, furnace cool to room temperature, unmould to acquire the TiB2 / Cu complex material. The device in the invention is of simple and easy operation, the volume fraction is easy to control while the reaction temperature needs not to be very high and without side reaction product.

Description

Technical field: [0001] The invention relates to a preparation process of a copper-based composite material used in the microelectronics industry, in particular to a preparation process of an in-situ self-generated copper-based composite material related to powder metallurgy reaction hot pressing. Background technique: [0002] With the continuous development of information technology, the microelectronics industry has higher and higher requirements for conductive metal materials. The trend of this requirement is to hope that conductive metal materials not only have high conductivity, but also have high strength and high temperature resistance. The indicators for the development of microelectronics today are: tensile strength of materials ≥ 600MPa, electrical conductivity ≥ 80% IACS (International Annealed Copper Standard-International Annealed Copper Standard), high temperature resistance softening temperature ≥ 800K. For a long time, copper and copper alloys are commonly u...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05
Inventor 王桂松耿林郑镇洙
Owner HARBIN INST OF TECH
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