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Electronic part with external electrode

A technology of electronic components and external electrodes, which is applied in the field of laminated ceramic electronic components, can solve problems such as poor plating, degradation of moisture-resistant life insulation, and inability to obtain electrical characteristics of electrostatic capacitance.

Inactive Publication Date: 2006-01-18
PANASONIC CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in a capacitor having an external electrode obtained by the above-mentioned method 1, the glass frit component in the conductive paste diffuses into the capacitor element during high-temperature firing, resulting in defective plating due to glass floating, or occurrence of defects during soldering on the substrate. Defects such as cracks
Furthermore, since the plating solution permeates into the sintered body during the plating process, there are problems with the reliability of capacitor performance, such as the electrostatic capacitance is lower than the design value, or the insulation resistance is deteriorated.
[0008] On the other hand, a capacitor having an external electrode obtained by thermally curing a thermosetting conductive paste at a low temperature (method 2) can solve the above-mentioned problems when mounting on a substrate or during plating, but because the curing temperature is low , so there is no solid-phase diffusion between conductive particles such as Ag powder in the conductive paste and the metal of the internal electrode, and the electrical characteristics such as the designed electrostatic capacitance cannot be obtained due to poor bonding between the internal electrode and the external electrode, and the reliability deteriorates
[0009] In addition, in the capacitor with external electrodes formed by using a thermosetting conductive paste containing a pyrolytic organometallic body in Method 3, the pot life of the paste is shortened and insulation degradation in the moisture resistance life occurs due to the addition of silver acetate and amine. and other bad situations

Method used

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  • Electronic part with external electrode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0039] Hereinafter, the present invention will be described in further detail through examples and comparative examples. The present invention is not limited by these examples. However, in these examples, parts represent parts by weight.

[0040] [Preparation of conductive paste]

[0041] The compositions of the conductive pastes used in Examples and Comparative Examples are shown in Table 1 below.

[0042] Conductive paste

A

(fired type)

B

(heat curing)

C

(heat curing)

Spherical silver powder A

50

-

-

Spherical silver powder B

-

75

55

Flake silver powder C

25

-

-

Flake silver powder D

-

10

15

Barium borosilicate glass

5

-

-

tin powder

-

-

15

Ethyl cellulose

3.5

-

-

Resole type phenolic resin

-

9.5

9.5

Bisphenol A type epoxy resin...

Embodiment 1

[0050] Example 1 (production of thermosetting electrode)

[0051] Under the conditions of Comparative Example 2, the conductive paste C (thermosetting) shown in Table 1 was applied, dried, cured, and plated to obtain a chip multilayer capacitor.

[0052] [determination]

[0053] The chip multilayer capacitor element obtained above is placed on the Pb-free solder paste printed on the copper-clad electrode of the glass epoxy substrate, and the solder paste is fully melted at a temperature such as 250 to 260°C. Solder joints were used to prepare test samples for electrical characteristics and joint strength. Measure the initial electrical properties (capacitance, tan δ) of the sample with 4278A manufactured by Agilent, measure the bonding strength (shear strength) with the substrate electrode with a bench-top strength tester manufactured by AIKOHENGINEERING CO., LTD, and then measure the thermal cycle resistance in the same way Electrical characteristics and joint strength afte...

Embodiment 1a～1d

[0058] In order to study the situation of changing the compounding amount of conductive particles with a high melting point and metal powder with a melting point below 300°C in the thermosetting conductive paste, the composition shown in Table 3 below was used to prepare the heat Curable conductive paste. The amount of conductive particles with a high melting point and metal powder with a melting point below 300°C in the thermosetting conductive paste is 60 to 98% relative to the total weight of conductive particles with a high melting point, metal powder with a melting point below 300°C, and resin. weight%. Furthermore, using the prepared paste, capacitor samples were prepared in the same manner as in Example 1, and their electrical characteristics and joint strength were measured.

[0059] The capacitors obtained in Examples 1a to 1d are the same as in Example 1, showing good electrical properties and joint strength, especially when the high melting point conductive particles...

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Abstract

The present invention is intended to solve the problem of a conventional thermosetting conductive paste with respect to bonding-property between an internal electrode(s) and an external electrode(s) so as to provide a multilayer ceramic electronic part suitable for its mounting on a substrate and for its plating-treatment. The present invention relates to a multilayer ceramic electronic part, characterized in that it has an external electrode(s) formed from a thermosetting conductive paste comprising conductive particles having a high melting point, metal powder having a melting point of 300 DEG C or less and a resin(s).

Description

technical field [0001] The present invention relates to laminated ceramic electronic components. In particular, it relates to a laminated ceramic electronic component such as a laminated ceramic capacitor which is suitable for mounting on a substrate or a plating process and has high reliability. Background technique [0002] Multilayer ceramic capacitors as an example of multilayer ceramic electronic parts such as figure 1 shown. Here, the external electrodes 4 formed on the internal electrode extraction surface of the ceramic composite formed by laminating the ceramic dielectrics 2 and internal electrodes 3 alternately in the multilayer ceramic capacitor 1 are generally fired conductive paste or thermosetting conductive paste. , can be formed by the method shown below. [0003] The first method is to apply, for example, a sintered conductive paste in which conductive particles such as Ag and Cu and glass frit are mixed in a vehicle (vehicle) on the extraction surface of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12H01B1/22H01G4/232
CPCH01G4/2325H01B1/22H01G4/005
Inventor 木村猛高田和驹形道典北村昌弘横山公宪
Owner PANASONIC CORP
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