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Sputtering film electrode paster inducer and its production method

An electrode patch and production method technology, applied in the direction of inductors, sputtering plating, fixed inductors, etc., can solve the problems of poor tensile strength, complex process, high cost, and achieve excellent high-temperature welding performance and film-layer bonding. Robust, low production cost effect

Inactive Publication Date: 2006-06-28
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The enameled wire head is burnt off the paint skin in a high-temperature tin bath above 425°C, and welded to the metal electrode. Since the metal electrode is coated with silver-lead-palladium paste on the surface of the ferrite and other skeletons, it is sintered at a high temperature, and then this The metal layer is based on electroless plating of nickel, copper, silver and other metal layers; in the prior art, the electrode layer of the chip inductor needs to go through high-temperature sintering and electroless plating steps to make the metal plated on the end surface of the skeleton. The process is complicated, the environment is polluted, the consumption of metal raw materials and energy is large, and the waste liquid treatment of the electroplating solution is difficult and costly. It is very easy to corrode the electrode layer; the chemical components harmful to the human body remain on the metal layer obtained by the chemical electroplating method, which does not meet the relevant standards for products entering the international market, which limits the production company's development of the international market; The skeleton made of molecular polymer material cannot be used to form the electrode layer by high-temperature sintering silver paste process

Method used

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  • Sputtering film electrode paster inducer and its production method
  • Sputtering film electrode paster inducer and its production method
  • Sputtering film electrode paster inducer and its production method

Examples

Experimental program
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Effect test

Embodiment 1

[0024] A kind of sputtering film electrode patch inductor whose diameter is 4 millimeters is DA-43, and its skeleton 2 is made of nickel-zinc material, adopts the radio frequency plasma cleaning skeleton 2 end face that power is 500W before coating, with the method of the present invention On the end face of the skeleton 2, the metal chromium bottom layer sputtering film 6 with a thickness of 100nm, the metal copper transition layer sputtering film 5 with a thickness of 3000nm and the metal silver surface layer sputtering film 4 with a thickness of 200nm are respectively plated, and the three constitute a film It is the electrode layer 1, and the enameled wire is wound on an automatic winding machine, and then immersed in a high-temperature lead-free tin bath at 430°C for three seconds, and then dipped three times; In the full-scale test of the sample, the lead-out ends of the enameled wires were fully welded on the electrode layer 1 separated from the left and right, and no ex...

Embodiment 2

[0026] A 0805 chip inductor with a length of 2.5 mm and a width of 1.5 mm. Its skeleton 2 is made of 95 ceramic material and is shaped like a saddle. A mask plate 13 is used to protrude from the skeleton 2, which is less than 1mm2 The end faces are plated with the film system electrode layer 1 with the technology of the present invention respectively, and the composition of each film layer is: the sputtered film 6 of titanium base layer with a thickness of 200nm, the metal nickel-copper transition layer sputtered film 5 with a thickness of 2500nm and the sputtered film with a thickness of 200nm The metal silver surface layer is sputtered with thin film 4; wind the coil 3 on the automatic winding machine, and use the pulse welding machine attached to the winding machine to press-weld the enameled wire head on the above two coating end faces. Observing the welding part of the product, the two wire ends are welded on the film layer. After the tensile test, the average tensile stre...

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Abstract

This invention relates to a sputtered membrane electrode plate inductor and its production method, in which, said inductor includes a framework and a coil, an electrode layer is set on the end surface of the framework, the thrum of the coil is fixed on the electrode layer characterizing that said electrode layer is composed of at least a layer of sputtered film-a lamination conductor, said inductor is prepared by cleaning the end face of the framework, vacuum filming, winding coils and high temperature welding.

Description

technical field [0001] The invention belongs to the technical field of basic electrical components, in particular to a sputtered film electrode chip inductor and a production method thereof. Background technique [0002] The chip inductor is composed of a ferrite or ceramic skeleton, coil, etc. The manufacturing process is as follows: the end surface of the skeleton is plated with a metal electrode layer, wound with an enameled coil, and then the enameled wire head is welded to the electrode layer. The enameled wire head is burnt off the paint skin in a high-temperature tin bath above 425°C, and welded to the metal electrode. Since the metal electrode is coated with silver-lead-palladium paste on the surface of the ferrite and other skeletons, it is sintered at a high temperature, and then this The metal layer is based on electroless plating of nickel, copper, silver and other metal layers; in the prior art, the electrode layer of the chip inductor needs to go through high-t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F17/00C23C14/04C23C14/14H01F17/03H01F41/00
Inventor 王德苗任高潮董树荣金浩顾为民邵净羽
Owner ZHEJIANG UNIV