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Kind of light-heat dual curing anisotropic conductive adhesive, anisotropic conductive film and their preparation methods

a technology of anisotropic conductive adhesive and anisotropic conductive film, which is applied in the field of microelectronic packaging technology, can solve the problems of affecting the health of workers, applying light curing technology to produce acf, and the adhesion strength of light curing is not as good as heat curing, and achieves the effect of high adhesion strength

Inactive Publication Date: 2015-10-22
SHENZHEN FISHER NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is addressing the environmental pollution caused by using solvents in traditional ACF production technology. Instead, a light-heat dual curing technology is applied to produce ACF, which avoids the use of solvent to protect the natural environment. Using heat curing method for electric connection ensures high adhesion strength between the electric components. This invention has several advantages over prior art methods.

Problems solved by technology

Secondly, we coat the above-mentioned ACA on a plastic film, then blow plenty of hot air to dry the ACA.
During the course of production, plenty of polluted harmful waste gas will affect the health of the workers.
The Chinese patent CN101724361 discloses the method about using heat curing to promote light curing, but it does not apply light curing technology to produce ACF.
The adhesion strength of light curing is not as good as heat curing.
Light curing can not meet the requirements about high bond strength.

Method used

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  • Kind of light-heat dual curing anisotropic conductive adhesive, anisotropic conductive film and their preparation methods
  • Kind of light-heat dual curing anisotropic conductive adhesive, anisotropic conductive film and their preparation methods
  • Kind of light-heat dual curing anisotropic conductive adhesive, anisotropic conductive film and their preparation methods

Examples

Experimental program
Comparison scheme
Effect test

embodiment 1

[0120]Weigh the following components according to the lower table.

ContentComponents(W %)light curing activatedhydroxyethyl methylacrylate16.0monomerlight-cured resinEthoxylated bisphenol A two methyl4.5acrylate (SR348)thermosetting resintetraphenol ethane tetraglycidyl23.5ether epoxy resin (EPON-1301)elastomerepoxy-terminated nitrile10.0rubber(NBR-1704)plasticizerpolypropylene glycol diglycidyl ether6.0(RF-PPD1217)insulating nanoparticlesnano-SiO215.0conductive particlesConductive gold balls (10 μm)4.0light curing agentEpoxy group phenyl ethyl copper3.0Irgacure651latent heat curing agentmodified dicyandiamide (asahi16.0chemical industry AEHD-610)coupling agenttrimethoxy[2-(7-oxabicyclo1.0[4.1.0]hept-3-yl)ethyl]-Silaneleveling agentsolydimethyl siloxane0.5antioxidant2,6-2 tertiary butyl phenol0.5(T502A)

[0121]Put the solid-state light-cured resin, thermosetting resin and elastomer in a dispersing mixer, then heat them to melt to form a mixture, and the melting temperature is between 1...

embodiment 2

[0130]Weigh the following components according to the lower table.

ContentComponents(W %)light curing activated2-dimethyl propyl ester two acrylate,18.0monomerlight-cured resinTwo shrinkage three glycol dimethyl9.5acrylate (SR205)thermosetting resintetraphenol ethane tetraglycidyl ether20.0epoxy resin (EPON-1301)elastomerEpoxy acrylate rubber (ACM62)5.0plasticizerpolypropylene glycol diglycidyl ether3.0RF-PPD1217insulating nanoparticlesnano-CaCO38.0conductive particlesconductive gold balls(4 μm)18.0light curing agentDMPA Irgacure6514.0latent heat curing agentHuntsman product DY957712.0coupling agenttrimethoxy[2-(7-oxabicyclo0.5[4.1.0]hept-3-yl)ethyl]-Silaneleveling agentPolyphenylmethylsiloxane1.0antioxidantnonyl-n-benzenamin KT55351.0

[0131]Put the solid-state light-cured resin, thermosetting resin and elastomer in a dispersing mixer, then heat them to melt to form a mixture, and the melting temperature is between 130° C. to 150° C.;

[0132]Put the liquid-state light curing activated m...

embodiment 3

[0140]Weigh the following components according to the lower table.

ContentComponents(W %)light curingLauric acid (meth) acrylate16.0activated monomerlight-cured resinPolyurethane acrylic resin BK-23084.5thermosetting resinP-aminophenol three glycidyl epoxy resin23.5elastomerhydroxyl-terminated NBR CTBN1300X1810.0plasticizerpolypropylene glycol diglycidyl ether6.0insulatingNano-ceramic powder15.0nanoparticlesconductive particlesConductive gold balls (9 μm)4.0light curing agentHCPK Irgacure1843.0latent heatmodified dicyandiamide (Aradur2844)16.0curing agentcoupling agentγ-methacryloxypropyltrimethoxysilane1.0leveling agentpolymethylphenyl silicone0.5antioxidant4,4-methylene (2,6-2 tertiary butyl0.5phenol) T511

[0141]Put the solid-state light-cured resin, thermosetting resin and elastomer in a dispersing mixer, then heat them to melt to form a mixture, and the melting temperature is between 130° C. to 150° C.;

[0142]Put the liquid-state light curing activated monomer and plasticizer in th...

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Abstract

A kind of light-heat dual curing anisotropic conductive adhesive includes light curing activated monomer 15.0-18.0%, light-cured resin 4.5-12.5%, thermosetting resin 20.0-25.0%, elastomer 5.0-10.0%, insulating nanoparticles 8.0-15.0%, conductive particles 4.0-18.0%, light curing agent 3.0-5.0% and latent heat curing agent 12.0-16.0%, wherein the components are counted according to weight percentage. The present invention also discloses a kind of light-heat dual curing anisotropic conductive film (ACF) and its preparation methods. Ultraviolet light curing method is applied to produce ACF can avoid using solvent to protect the natural environment. When using ACF, heat curing method is then applied to guarantee the quality of banding and the reliability.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is a divisional application of application Ser. No. 14 / 128,629 filed on Dec. 23, 2013 which is a continuation of International application No. PCT / CN2013 / 074658 filed on Apr. 24, 2013 which claims priority to Chinese Patent Application Serial No. 201210153970.6 filed on May 17, 2012.FIELD OF THE PRESENT INVENTION[0002]The present invention relates to micro-electronic packaging technology field, in particular to a kind of light-heat dual curing anisotropic conductive adhesive, anisotropic conductive film and their preparation methods.BACKGROUND OF THE PRESENT INVENTION[0003]Anisotropic conductive film (ACF) has both unilateral conduction function and adhesion function. Currently, ACF is used for COG, TCP / COF, COB and FPC, in particular for the electric connection between IC and ITO glass. It can connect a lot of minuscule wires which traditional connectors can not connect.[0004]Anisotropic conductive films are mainly applie...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C09J163/00C09J9/02C09J7/22C09J7/35
CPCC09J9/02C09J163/00C09J175/14C09J4/06C08K3/08C08K5/0025C09J11/00C08K7/18C08K2003/0831C09J2203/326H01L24/29H01L2224/2929H01L2224/29344H01L2224/29386H01L2924/07811C09J7/35C09J7/22B05D5/10B05D5/12B05D7/04B05D3/065Y10T428/2809Y10T428/1471H01L2924/0665H01L2924/00014H01L2924/05442H01L2924/00B05D3/067
Inventor XIAO, REN-LIANGZHAO, CHANG-HOULIU, CHENG-GUIWAN, XIAN-FEIYANG, CHANG-WUYIN, HUA-GUO
Owner SHENZHEN FISHER NEW MATERIALS CO LTD