Resin composition for electronic and electric components for high-frequency applications and its molded product

A resin composition, electronic and electrical technology, used in the fields of electronic and electrical components, antenna substrates, and filters, can solve the problems of impairing mechanical properties, impact strength, injection moldability, sheet extrusion moldability, etc., and achieve stable dielectric properties. , The effect of improving shrinkage resistance and impact strength

Inactive Publication Date: 2008-01-30
ASAHI KASEI CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But in general, for the above-mentioned high dielectric resin composition, if a large amount of metal oxide is not added, the effect of improving the relative dielectric constant is small, and as a result, mechanical properties (especially impact strength), injection moldability, Problems such as sheet extrusion formability

Method used

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  • Resin composition for electronic and electric components for high-frequency applications and its molded product
  • Resin composition for electronic and electric components for high-frequency applications and its molded product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5 and comparative example 1～5

[0104] Install a die width of 750 mm and a die lip width of 0.5 mm on a single-screw extruder with a sub-extruder capable of multi-layer molding of 65 mmφ and L / D=28, and set the cylinder temperature to At 300°C, extrude the graphite-added resin composition shown in Table 1 as a single layer, and extrude the titanium oxide-added resin composition shown in Table 2 as a single-layer and multi-layer extrude to obtain a 500 μm sheet molding.

[0105] Table 3 lists the sheet extrusion formability of each resin composition and the dielectric properties of the sheet molded body at 25° C. and 1 GHz.

Embodiment 4

[0106] The resin composition containing 10% by weight of graphite in Example 4 shrank and was difficult to mold, but the resin composition containing 5% by weight or less of graphite had good sheet extrusion formability. In addition, the resin composition added with 30% by weight of titanium oxide in Comparative Example 4 had severe shrinkage and could not be molded, but the extrusion formability of the multilayer sheet in Example 5 was good, indicating that the extrusion molding of the sheet can be performed by multilayering. performance has been significantly improved.

[0107] The results show that the dielectric loss tangent of the sheet added with graphite with an average particle size of 20 μm in Example 1 and the sheets added with graphite with an average particle size of 60 μm in Examples 2 to 4 is 0.0025 or less. The dielectric loss tangent of the sheet of graphite with an average particle diameter of 5 μm is 0.0045, and the dielectric loss tangent of the sheet added ...

Embodiment 6

[0112] On both sides of the multilayer sheet obtained from the resin composition of Example 5, 18 μm electrolytic copper foil was pressure-laminated at a heating temperature of 220°C to manufacture polyarylene sulfide as shown in Fig. 1 Resin copper clad laminate. FIG. 1 shows a schematic cross-sectional view of the copper-clad laminate. The symbol 1 in the figure represents the extruded sheet (dielectric) with a thickness of 0.5 mm in Example 5 formed from the resin composition given in Table 2, and an electrolytic copper foil of 18 μm is laminated on both sides of the dielectric 1. 2a, 2b.

[0113] The obtained copper-clad laminate has good formability, and fully satisfies the characteristics required for the copper-clad laminate used in the field of high-frequency band electrical communication.

[0114] [Table 1]

[0115] weight%

[0116] Example 1

Example 2

Example 3

Example 4

Comparative example 1

Comparative example 2

Comparative ex...

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Abstract

The present invention relates to a resin composition for high-frequency electrical and electronic components and a molded article thereof. An object of the present invention is to provide a thermoplastic resin composition, a sheet-like molded product, and a copper-clad laminate, which are excellent in molding processability such as extrusion processability and injection moldability, solder heat resistance, and bending It has excellent mechanical properties such as properties, durability, and drillability, and satisfies the low dielectric loss required for high-frequency band electrical communication components. The present invention relates to a molded body composed of a resin composition in which specific graphite is added to a resin composition mainly composed of (a) polyarylene sulfide resin and (b) polyphenylene ether resin. The present invention also relates to a multi-layer molded body, the inner layer of which is composed of (a) polyarylene sulfide resin and (b) polyphenylene ether resin as the main components of the resin combination The outer layer of the multilayer molded body is made of a resin composition without adding metal oxides. The present invention further relates to a copper-clad laminate produced by laminating copper foil or copper plating on one or both surfaces of the above-mentioned molded body or multilayer molded body.

Description

technical field [0001] The present invention relates to a resin composition for high-frequency electrical and electronic components and a molded article using the resin composition. Antenna substrates, filters, etc. used in the electrical communication field. Background technique [0002] Recently, communication devices using radio waves, such as mobile phones, wireless LAN (Local Area Network), GPS (Global Positioning System), and ETC (Electronic Toll Collection System), have developed significantly. Along with the increase in the capacity of information, the increase in the frequency of communication signals and the miniaturization of communication equipment are advancing. The electrical and electronic parts and circuit substrates of these communication devices used in high frequency bands are required to have excellent low dielectric loss characteristics. The dielectric loss generated by a component or circuit substrate is proportional to the product of the signal frequ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L81/02B32B27/00C08K7/00C08L63/00C08L71/12
CPCH05K1/024H05K1/056B32B15/08H05K1/0373C08L81/02B32B27/20H05K1/0333C08L71/12H05K1/036H05K2201/0323H05K2201/0209Y10T428/263Y10T428/265Y10T428/264C08L2666/02
Inventor 豊内薰秋山义邦
Owner ASAHI KASEI CHEM CORP
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