Accurately digitized micro-nano imprint method

Abstract

This invention discloses a sort of delicate numeralization type method of micro-nm autogram, it is characterized in that it consists of this flowing approach: (1) Carving up the figure with the micro-nm configuration which will be impressed to the micro unit array. (2) Making the autogram model basing the micro unit. (3) Determining the relative position between the autogram model and the autogram base plate which is in the armed state, then coming into the first autogram working position. (4) Processing an autogram of the figure with the micro-nm configuration which is in the micro unit. (5)Altering the relative position between the autogram model and the autogram base plate which is in the armed state, then coming into the next autogram working position. (6) Repeating the step (4) and the step (5) till all autogram which are in the micro unit are completed. This set realizes this method by the relative movement between the working platform and the autogram head. This invention realizes the fabrication of the figure which has this extended micro-nm configuration by the joint of this small area autogram configuration, resolves this problem that the possibility of the figure aberrance becomes big when the model area becomes big in the existing technique, and enlarges the applied range of the micro-nm autogram.

Description

technical field [0001] The present invention relates to a precision processing method, in particular to a method of imprinting using micro-nano processing technology, especially a digital precision micro-area micro-nano imprinting method, which can realize optoelectronic devices with complex micro-nano structures Fast imprint replication of . Background technique [0002] Since the 1960s, integrated circuits have been constantly updated according to Moore's Law, which states that the number of transistors integrated into a single chip doubles every 18 months. As the dimensions of devices in circuits continue to shrink, optical lithography approaches its physical limits. Although the optical lithography method of complex micro-optoelectronic structures with a line width of less than 100nm has made progress, the cost of this manufacturing method is very expensive, and the cost of each device is as high as tens of millions to hundreds of millions of dollars. [0003] Micro-na...

AI Technical Summary

Problems solved by technology

However, by improving the performance of the pressure application system, although balanced and uniform imprinting can be achieved to a certain extent, its effect is limited. Currently, the size of the wafer (substrate) that can be processed is usually 3 to 8 inches

Actual products, such as the embossing equipment of Obducat in Sweden, can only emboss graphics with a size of 10×10mm to 203×203mm, and cannot make micro-nano structures on a smaller or larger format

Obviously, the manufacturing cost of making a large-area imprinting template is very high, and it places high demands on the imprinting equipment

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