Dielectric composition, capacitor and light wiring using the dielectric composition

A composition and dielectric technology, applied in the direction of fixed capacitor dielectric, fixed capacitor parts, circuits, etc., can solve the problems of high filling of inorganic fillers, etc., and achieve the effect of uniform film thickness and high reliability

Inactive Publication Date: 2008-04-02
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the conventional method, the inorganic filler cannot be sufficiently highly filled, and the linear expansion coefficient cannot be lowered to be substantially close to that of the wiring layer.

Method used

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  • Dielectric composition, capacitor and light wiring using the dielectric composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] Using a homogenizer, 323 parts by weight of barium titanate filler (manufactured by Sakai Chemical Co., Ltd., BT-05, average particle size: 0.5 μm) and 18 parts by weight of γ-butyrolactone were mixed and dispersed for 1 hour under ice cooling to obtain Dispersion A-1. Mix 10 parts by weight of epoxy resin (manufactured by Nippon Kayaku Co., Ltd., EPPN 502H), 10 parts by weight of phenol novolac resin (manufactured by Dainippon Inki Industry Co., Ltd., TD-2131), 0.6 parts by weight of curing accelerator (North Koh Kagaku Co., Ltd. product, triphenylphosphine), 20 parts by weight of γ-butyrolactone, and epoxy resin solution B-1 was obtained. Dispersion liquid A-1 and epoxy resin solution B-1 were mixed using a ball mill to prepare paste composition C-1. The boiling point of γ-butyrolactone is 204°C. The paste composition C-1 was coated on an aluminum substrate with a thickness of 300 μm by a die coating method, dried in an oven at 80° C. for 15 minutes, and cured at 17...

Embodiment 2

[0077] Paste composition C-1 was prepared in the same manner as in Example 1. Then, 22.6 parts by weight of γ-butyrolactone was further added so that the amount of the solvent in the pasty composition became 15% by weight, and the pasty composition C-2 was produced. In addition, based on the method of Example 1, a high dielectric composition was produced, and the evaluation results of the dielectric properties are shown in Table 1. The dielectric constant of the high dielectric composition is 73, the dielectric loss tangent is 3.4%, and the electrostatic capacity per unit area is 4.3nF / cm 2 . The porosity was 12% by volume.

Embodiment 3～4

[0079] γ-butyrolactone was further added to the paste composition C-1 so that the amount of solvent in the paste composition was 20 and 25% by weight, and paste compositions C-3 to C-4 with different solvent amounts were produced . In addition, based on the method of Example 1, a high dielectric composition was produced, and the evaluation results of the dielectric properties are shown in Table 1. A high dielectric composition having a porosity of 20% by volume or less and a dielectric constant of 50 or more was obtained.

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Abstract

This invention is a paste composition containing an inorganic filler, a resin and a solvent, wherein the paste composition is characterized in that it contains one or more solvents of which boiling point is 160 DEG C or higher and an inorganic filler of which mean particle diameter is 5 m or smaller, and the total content of the solvent being 25 wt% or less based on the total amount of the paste composition, and relates to a dielectric composition containing an inorganic filler and resin, wherein the inorganic filler includes inorganic fillers of at least two kinds of mean particle diameter, and the greatest mean particle diameter of said mean particle diameters is 0.1-5 m and is 3 times or more to the minimum mean particle diameter. By this invention, it is possible to obtain a high dielectric constant composition of which linear expansion coefficient is low, and which has a large capacitance.

Description

[0001] This application is a divisional application of the patent application with the application number 200480009120.2, the filing date is March 25, 2004, and the invention title is "paste composition and dielectric composition using the paste composition". technical field [0002] The present invention relates to a dielectric composition exhibiting excellent characteristics as an interlayer insulating material or an optical wiring material for a capacitor or a circuit material having a capacitor function. Background technique [0003] In recent years, along with the miniaturization of electronic equipment, the increase in the speed of signals, and the increase in capacity, the density of mounted circuit components has been increasing. However, problems such as an increase in electrical noise and generation of data errors also arise. In order to suppress the generation of this electrical noise and operate the semiconductor device stably, it is important to supply a necessa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B3/00C04B35/00C08K3/00C08K5/00H01G4/20
Inventor 原义豪山铺有香川崎学野中敏央
Owner TORAY IND INC
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