Light emitting diode chip and method for manufacturing the same
A technology of light-emitting diodes and chips, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of high requirements for uniform distribution, high contact resistance of metal electrode layers, and high working voltage, and achieves improved heat transfer performance and current. distribution, the effect of reducing the operating voltage
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[0038] In this embodiment, a GaN-based epitaxial wafer grown on a transparent alumina single crystal (ie, a sapphire substrate) is used to prepare flip-chip LED chips. The process is shown in FIGS. 3a to 3c. For the LED in this embodiment The chip and its manufacturing process are detailed as follows:
[0039] First, a GaN-based epitaxial wafer is grown on a sapphire substrate 1. According to the design pattern and size of the P-type and N-type regions, an etching process is used to form the P-type region 7 and the N-type region 8 required by the design. Shown in Figure 3a. Those skilled in the art can understand that the design graphics conforming to the concept of the present invention can have many variations. For example, seven graphic designs conforming to the concept of the present invention are shown in FIGS. 2a to 2g. The photolithography mask in the etching process can be made according to relevant parameters and design patterns.
[0040] Next, deposit a transparent metal...
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