Second metallizing method for ceramics

Abstract

The invention relates to a second metallized ceramic method, belonging to the technical field of ceramic metallization, which comprises the following steps: preparing nickel paste of second metallization, printing the nickel paste and then drying and sintering. The powdered nickel and the caking agent are weighted according to weight account and then put into a ball mill tank with agate ball. The ball mill tank is on the globe mill. Then the mixed material is ball milled by controlling the frequency and milling time of the globe mill, and then the nickel paste can be obtained after separating the agate ball after ball milling. The nickel paste is printed on the molybdenum-manganese layer surface of a ceramic base which is metallized sintered once by controlling the printing thickness and the ceramic base coated by nickel paste can be obtained. The ceramic base coated by nickel paste is dried first and then put into a container to sinter, finally, the second metallized ceramic product coated by nickel paste can be obtained. The second metallized ceramic method has the advantages of ensuring the pass percent, controlling the cost and meeting the producing requirements of mass production, and thus can benefit the environment and employee and the ceramic base second metallized has the advantages of good sealing-in result and strong tensile strength.

Description

technical field [0001] The invention relates to a method for secondary metallization of ceramics, which is used to coat at least one end face of a ceramic substrate as a cathode and anode assembly of a microwave oven magnetron that has completed primary metallization, so that the ceramic substrate after nickel coating is more effective. The invention relates to sealing ground and metal such as kovar alloy, and belongs to the technical field of ceramic metallization processing. Background technique [0002] Compared with the processing of metallized ceramic devices used as microwave oven magnetrons, such as discharge tubes, vacuum switch tubes, electronic devices, detection sensors, etc., it is difficult both in terms of technical quality requirements and cost control requirements. It is much larger. Therefore, up to now, although there are a handful of manufacturers involved in the production of metallized ceramic devices for microwave oven magnetrons in my country, there has...

AI Technical Summary

Problems solved by technology

This method has the following disadvantages: one, due to the nickel plating by the electroplating method, the thickness of the nickel layer is only a very thin 2-4um, so it is very easy to peel, foam, have many defects, and the pass rate is low when burning hydrogen. The cost is high, and if it is directly sealed (brazed) with metals such as Kovar alloy without sintering, it will cause poor welding, air leakage, and affect the product quality of the microwave oven magnetron; secondly, due to the use of electroplating Nickel plating, therefore serious environmental pollution, and the plating solution is detrimental to the health of employees; third, the thin nickel plating layer of 2-4um is difficult to guarantee the sealing strength with Kovar alloy, so the applicant passed the Japanese and Korean products The thickness of the nickel layer was measured. The thickness of the nickel layer is usually 6-8um, and it also shows that the thickness of the nickel layer is not only difficult to foam and peel when burning hydrogen, but also shows the ability to seal with the metal. reliable seal strength

In addition, the price of nickel is high, and the utilization rate of nickel is not high in the process of electroplating nickel, most of the nickel is plated on the accompanying plating such as steel balls, and the cost is high

Moreover, the nickel plating layer is too thin, it is easy to peel and foam after burning hydrogen, and the product qualification rate is relatively low