Etching liquid composition and etching method

A technology of etching solution and composition, which is applied in the field of etching solution composition and etching of silver or silver alloy, and can solve problems such as cost cannot be reduced, long-term use cannot be used, pattern disappears, etc.

Inactive Publication Date: 2008-08-20
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Although there are a variety of etchant compositions for silver alloys at present, such as the etching compositions proposed in the Taiwan Patent No. I226386 and the No. 0593634 patent; Diameter loss (Critical dimensionloss, CD-loss) up to 2μm or more
However, driven by the trend of refinement of everything, the width of the metal lines in the display is only 3-5 μm at most. Therefore, once the known etching solution is used, as long as there is a slight error in the etching time, patterns may occur The entire disappearing condition does not apply
[0005] In addition, the etching composition proposed in U.S. Patent No. US 2003 / 0168431A1 and Taiwan Patent I226386; the oxidizing agent used is easy to decay in acidic and alkaline environments, so the service life of the etching solution composition is mostly only hours and cannot be used for a long time, which makes the cost of related manufacturing impossible to reduce

Method used

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  • Etching liquid composition and etching method
  • Etching liquid composition and etching method
  • Etching liquid composition and etching method

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Embodiment Construction

[0029] The "etching solution composition and etching method" of the present invention will be fully understood from the following examples, so that those skilled in the art can complete it accordingly. However, the implementation of the present invention is not limited by the following examples.

[0030] The etching solution composition of the present invention is mainly formed by mixing at least two of oxidants, acids and salts. When using oxidants, acids and deionized water to make etching solution, the preferred content of oxidants is 1%-80% (percentage by weight), and the preferred content of acids is 0.1%-5% (percentage by weight); And when using oxidant, salt and deionized water to make etching solution, preferred oxidant content is 1%-80% (percentage by weight), and preferred salt content is 0.1%-80% (percentage by weight) ; And when only using acids, salts and deionized water to make etching solution, the preferred acid content is 0.1%-5% (percentage by weight), and t...

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Abstract

The invention relates to an etchant composition and an etching method, wherein, the etchant composition comprises any two components of oxidants, acid and salt, and the pH value of the etchant composition is between 1 and 7. The oxidant components are selected from hydrogen peroxide, ammonium persulfate, potassium persulfate and ceric ammonium nitrate; the acid components are selected from chloric acid, perchlorate, acetic acid, nitric acid, hydrofluoric acid, sulfuric acid and oxalic acid, and the salt components are selected from ammonium fluoride, ammonium bifluoride, diammonium phosphate, ammonium phosphate, ammonium chloride and perfluorinated octyl sulfanilic acid (C8F17SO3NH4).

Description

technical field [0001] The invention relates to an etching solution composition and an etching method, in particular to an etching solution composition and an etching method for silver or silver alloy. Background technique [0002] At present, metals or alloys such as chromium, silver, molybdenum, copper, aluminum, palladium, platinum, titanium, etc. are often used as conductive materials in semiconductor manufacturing or flat panel display manufacturing. [0003] In the past, etching compositions containing acids and oxidants were often used to etch aluminum, chromium or silver metals and their alloys, but because the degree of etching required and the types of metals to be etched are also different, most of them rely on appropriate methods. After selecting the type of acid and oxidizing agent, adjust the appropriate concentration to achieve the best etching effect. [0004] Although there are a variety of etchant compositions for silver alloys at present, such as the etch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/16C23F1/30
Inventor 牛台宾
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